Increasing power density in a POL design depends on the package size and output current. Using a smaller package size typically results in a limited thermal dissipation capability and therefore a lower output current supported when considering operations over a wide range of temperatures. One of the key differentiators for the ISL8215M, and in fact, for Intersil power modules, is the packaging technology which allows for highly efficient heat transfer to the PCB. The thermal tests, as shown on this slide, illustrate that the ISL8215M can safely deliver 10A of continuous current at 85°C ambient temperature on a 24V to 3.3V conversion, thereby delivering 33W of power at 85°C ambient with no airflow or dedicated heat sink.