The Allegro ACS717 (3.3 V) and ACS718 (5 V) are medium-accuracy current sensor ICs with an 850 µΩ current conductor. They are the first surface mount current sensor ICs with a reinforced isolation rating (565 VRMS or 800 VPEAK) and can withstand up to 4800 VRMS for 60 seconds. The low-profile SOICW-16 package is ideal for space-constrained applications where large current transformers are not able to compete and the surface mount package allows for a lower cost and higher reliability assembly process.
The ACS717 and ACS718 are targeted for the industrial, consumer, and computer (IC&C) market in applications that require high-isolation and low-offset voltage drift with maximum currents up to ±20 A. Applications include white goods, solar inverters, and motor control.
| Features and Benefits |
- IEC/UL 60950-1 Ed. 2 certified to:
- Dielectric strength = 4800 VRMS (tested for 60 seconds)
- Basic isolation = 1550 VPEAK
- Reinforced isolation = 800 VPEAK
- Small footprint, low-profile SOIC16 wide-body package suitable for space-constrained applications that require high-galvanic isolation
- 0.85 mΩ primary conductor for low power loss and high inrush current withstand capability
- Low, 350 μARMS/√Hz noise density results in typ. input referred noise of 70 mA (RMS) at max. bandwidth (40 kHz)
- 3.3 V (ACS717) and 5.0 V (ACS718) single supply operation
- Output voltage proportional to AC or DC current
- Factory-trimmed sensitivity and quiescent output voltage for improved accuracy
- Chopper stabilization results in extremely stable quiescent output voltage
- Ratiometric output from supply voltage
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The Allegro ACS717 (3.3 V) and ACS718 (5 V) are medium-accuracy current sensor ICs with an 850 µΩ current conductor. They are the first surface mount current sensor ICs with a reinforced isolation rating (565 VRMS or 800 VPEAK) and can withstand up to 4800 VRMS for 60 seconds. The low-profile SOICW-16 package is ideal for space-constrained applications where large current transformers are not able to compete and the surface mount package allows for a lower cost and higher reliability assembly process.
United Kingdom