Thermal management is one of the greatest challenges in high power module design. Ultimate power rating, especially at high ambient temperature, is dictated by the module’s electrical and mechanical design. Using thermally efficient packages that can move the heat out of the module enables better thermal performance. The ISL8274M is built upon Renesas’ patented single-layer conductive substrate in a high density lead-frame array package (aka HDA). This technology provides excellent thermal conductivity to dissipate heat because of the single conductive layer of material. When combined with excellent efficiency, effectively reducing the amount of power dissipated inside the device, it allows the ISL8274M to supply more than 25 A of continuous output current at 85°C of ambient temperature with 200 LFM (linear feet per minute) on a 12 V to 1 V conversion.