



374324B60023G | |
|---|---|
DigiKey Part Number | HS522-ND |
Manufacturer | |
Manufacturer Product Number | 374324B60023G |
Description | BGA HEAT SINK |
Manufacturer Standard Lead Time | 14 Weeks |
Customer Reference | |
Detailed Description | Heat Sink BGA, FPGA Aluminum 1.5W @ 50°C Board Level |
Datasheet | Datasheet |
Category | Length 1.063" (27.00mm) |
Mfr | Width 1.063" (27.00mm) |
Series | Fin Height 0.394" (10.00mm) |
Packaging Bulk | Power Dissipation @ Temperature Rise 1.5W @ 50°C |
Part Status Active | Thermal Resistance @ Forced Air Flow 6.00°C/W @ 500 LFM |
Type Board Level | Thermal Resistance @ Natural 30.60°C/W |
Package Cooled | Material |
Attachment Method Solder Anchor | Material Finish Black Anodized |
Shape Square, Pin Fins | Base Product Number |
| Quantity | Unit Price | Ext Price |
|---|---|---|
| 1 | £2.75000 | £2.75 |
| 10 | £2.43100 | £24.31 |
| 25 | £2.31560 | £57.89 |
| 50 | £2.23200 | £111.60 |
| 216 | £2.06514 | £446.07 |
| 432 | £1.99039 | £859.85 |
| 648 | £1.94789 | £1,262.23 |
| 1,080 | £1.89559 | £2,047.24 |
| Unit Price without VAT: | £2.75000 |
|---|---|
| Unit Price with VAT: | £3.30000 |



