No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Syringe, 1.23 oz (34.869g)
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TS991SNL35T3

DigiKey Part Number
315-TS991SNL35T3-ND
Manufacturer
Chip Quik Inc.
Manufacturer Product Number
TS991SNL35T3
Description
THERMALLY STABLE SOLDER PASTE NC
Manufacturer Standard Lead Time
4 Weeks
Customer Reference
Detailed Description
No-Clean Solder Paste Sn96.5Ag3Cu0.5 (96.5/3/0.5) Syringe, 1.23 oz (34.869g)
Datasheet
 Datasheet
Product Attributes
Type
Description
Select All
Category
Manufacturer
Chip Quik Inc.
Series
CHIPQUIK®
Packaging
Bulk
Part Status
Active
Type
Solder Paste
Composition
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter
-
Melting Point
423°F (217°C)
Flux Type
No-Clean
Wire Gauge
-
Mesh Type
3
Process
-
Form
Syringe, 1.23 oz (34.869g)
Shelf Life
12 Months
Shelf Life Start
Date of Manufacture
Storage/Refrigeration Temperature
37°F ~ 77°F (3°C ~ 25°C)
Shipping Info
-
Weight
-
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In-Stock: 5
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Quantity
All prices are in GBP
Bulk
QuantityUnit PriceExt Price
1£31.89000£31.89
5£27.48200£137.41
10£25.77600£257.76
25£23.67800£591.95
50£22.20180£1,110.09
100£20.81430£2,081.43
Manufacturers Standard Package
Unit Price without VAT:£31.89000
Unit Price with VAT:£38.26800