
TC1-200G | |
|---|---|
DigiKey Part Number | TC1-200G-ND |
Manufacturer | |
Manufacturer Product Number | TC1-200G |
Description | HEAT SINK COMPOUND - HIGH DENSIT |
Manufacturer Standard Lead Time | 4 Weeks |
Customer Reference | |
Detailed Description | Thermal Silicone Compound 200 gram Jar |
Datasheet | Datasheet |
Category | Color White |
Manufacturer Chip Quik Inc. | Thermal Conductivity 0.67W/m-K |
Packaging Bulk | Shelf Life 60 Months |
Part Status Active | Storage/Refrigeration Temperature 37°F ~ 77°F (3°C ~ 25°C) |
Type Silicone Compound | Shelf Life Start Date of Manufacture |
Size / Dimension 200 gram Jar | Shipping Info Shipped from DigiKey |
| Quantity | Unit Price | Ext Price |
|---|---|---|
| 1 | £37.01000 | £37.01 |
| Unit Price without VAT: | £37.01000 |
|---|---|
| Unit Price with VAT: | £44.41200 |







