C40 Heat Sink System

Ohmite’s C40 Series Heat Sink System (patent pending) offers flexible, high performance and compact heat sinks with an exchangeable cam-clip system for TO-247 and TO-264 devices. This powerful heat sink can be through-hole soldered in single or paired configurations. The paired unit has mounting holes to accommodate a 40 mm x 40 mm fan. It is the ideal type of heat sink for high power density and small size (1U or 2U) electronic packaging with forced convection.

• Heat Sink: Aluminum alloy 6063-T5 or equivalent with either degreased or black anodized finish
• Spring Clip: Music wire, per ASTM A228 with bright nickel plating
• Solder Foot: Cold-rolled steel, per ASTM A-366 with pure tin over copper strike. RoHS compliant
• Fan: 40 mm fan with 4 self-tapping M3 screws
• Interface Thermal Resistance: For improvement, use thermal joint compound, 0.005 Grafoil (TGon 800 by Laird), or phase-change material (Hi-Flow by Bergquist) Insulator (optional) Sil-Pad 900-S, K6 800-S and K10 by Bergquist