Octavo Systems

OSD335x-SM System-in-Package (SiP) Family

Octavo Systems' OSD335x-SM is the smallest SiP device in the OSD335x family

Image of Octavo Systems' OSD335x-SM System-in-Package (SiP) FamilyThe OSD335x-SM family of SiP products from Octavo Systems leverages Texas Instruments’ Sitara™ AM335x processors to allow easy and cost-effective system implementations based on these powerful chips. These SiPs integrate TI’s AM335x processors, TPS65217C PMIC, and TL5209 LDO with up to 1 GB of DDR3 memory, 4 KB EEPROM for non-volatile configuration storage, and resistors, capacitors, and inductors into a design-in-ready package of just 21 mm x 21 mm.

This level of integration allows developers using the OSD335x-SM SiP family to concentrate on the essential system features and not spend time on the PMIC power distribution or the rather involved design of the high-speed processor to DDR3 interface.  This SiP can greatly reduce time-to-market for AM335x-based designs by reducing overall size and complexity along with the required supply chain.

OSD335x-SM Block Diagram

Features
  • TI AM335x features:
    • Arm® Cortex®-A8 up to 1 GHz
    • 8-channel 12-bit SAR ADC
    • Ethernet 10/100/1000 x 2
    • USB 2.0 HS OTG + PHY x2
    • MMC, SD, and SDIO x3
    • LCD controller
    • SGX 3D graphics engine
    • PRU subsystem
  • TI AM335x, TPS65217C, TL5209, DDR3, EEPROM and passive components integrated into a single package
  • Access to all AM335x peripherals: CAN, SPI, UART, I2C, GPIO, etc.
  • Up to 1 GB DDR3
  • PWR In: AC adapter, USB, or single cell (1S) Li-Ion / Li-Po battery
  • PWR Out: 1.8 V, 3.3 V, and SYS
  • Selectable AM335x I/O voltage: 1.8 V or 3.3 V
Benefits
  • Integrates over 100 components into one package
  • Compatible with AM335x development tools and software
  • Wide BGA ball pitch allows for low-cost assembly
  • Significantly reduces design time
  • Decreases layout complexity
  • 60% reduction in board space vs discrete implementation
  • Increased reliability through reduced number of components

OSD335x-SM System-in-Package (SiP) Family

ImageManufacturer Part NumberDescriptionAvailable QuantityPriceView Details
IC MODULE CORTEX-A8 1GHZ 512MBOSD3358-512M-BSMIC MODULE CORTEX-A8 1GHZ 512MB0 - Immediate$32.01View Details
OSD335X-SM EVAL BRDOSD3358-SM-REDOSD335X-SM EVAL BRD5 - Immediate$261.77View Details
IC MODULE CORTEX-A8 1GHZ 512MBOSD3358-512M-ISMIC MODULE CORTEX-A8 1GHZ 512MB0 - Immediate$33.95View Details
Published: 2017-09-18

Related Videos

PocketBeagle USB-Key-Fob Computer | Maker Minute
PocketBeagle USB-Key-Fob Computer | Maker Minute

Publish Date: 2018-01-11

Octavo Systems OSD335 System-in-Package – Another Geek Moment
Octavo Systems OSD335 System-in-Package – Another Geek Moment

Publish Date: 2017-08-07

Octavo Systems and Nordic Semiconductor New Product Discoveries with Randall Restle Episode 4
Octavo Systems and Nordic Semiconductor New Product Discoveries with Randall Restle Episode 4

Publish Date: 2017-06-21

Related Product Highlight

OSD335x System-in-Package (SiP) Family Octavo Systems' OSD335x family of SiP products are designed to allow implementation of systems based on Texas Instruments’ Sitara™ AM335x line of processors.

Related Articles and Blogs

Microcontroller Systems for Sensor Control and Interface This article discusses the use of application-specific development boards to simplify design tasks and help finalize designs in a timely manner.
Architecting Options for USB into Your Embedded Systems Designs While USB came from the PC world, it is not just a PC phenomenon. Cell phones, cameras, recorders, players, display devices, tuners, and more all use USB connectivity, either as a peripheral, or even as a host. Even picture frames have USB ports.
Digital Signal Controllers Making the Case for ARM Cortex-M4-based Solutions While a number of major players in the MCU space have moved to ARM-based CPU cores for general-purpose applications, the same trend is now unfolding in the digital signal controller area in which MCUs integrate DSP-centric capabilities.

Related Product Training Modules

OSD335x C-SiP System-in-Package Family This PTM will introduce the OSD335x C-SiP™, A Complete, System-in-Package including technical details, example applications, and benefits to designers.