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MicroPak Automotive Q100

Nexperia's automotive-qualified Mini Logic types in leadless XSON packages

Image of Nexperia's MicroPak Automotive Q100 Nexperia's MicroPak Automotive Q100 addresses space constraints in automotive applications with innovative MicroPak solutions that exceed AEC-Q100 requirements. The Nexperia Q100 portfolio now includes more than 20 automotive-qualified functions in XSON leadless extremely-thin small-outline packages.

Features
  • Very small footprint: up to 60% space saving over equivalent leaded packages
  • Optimized for speed and power
  • Low propagation delay
  • Low dynamic power dissipation
  • Specified for partial power-down applications using IOFF

Applications

  • Infotainment
  • ADAS
  • BMS

MicroPak Automotive Q100

ImageManufacturer Part NumberDescriptionAvailable QuantityView Details
IC BUFFER NON-INVERT 3.6V 6XSON74AUP1G125GM-Q100XIC BUFFER NON-INVERT 3.6V 6XSON8889 - ImmediateView Details
IC BUFFER NON-INVERT 3.6V 6XSON74AUP1G125GS-Q100HIC BUFFER NON-INVERT 3.6V 6XSON9441 - ImmediateView Details
IC GATE NOR 1CH 2-INP 5TSSOP74AUP1G02GW-Q100HIC GATE NOR 1CH 2-INP 5TSSOP0View Details
IC INVERTER 1CH 1-INP 5TSSOP74AUP1G04GW-Q100HIC INVERTER 1CH 1-INP 5TSSOP0View Details
IC INVERTER 2CH 2-INP 6TSSOP74AUP2GU04GW-Q100HIC INVERTER 2CH 2-INP 6TSSOP0View Details
Published: 2020-09-30