Laird Thermal Materials

Tflex SF10 Thermal Gap Filler

Laird's high-performing non-silicone gap filler is extremely soft and exhibits very low pressure on components

Image of Laird's Tflex SF10 Thermal Gap FillerLaird's Tflex SF10 thermal gap filler is a high-performing, non-silicone product that is also extremely soft and exhibits very low pressure on components. Tflex SF10 is an innovative high-performing thermal material in Laird’s gap filler portfolio. The silicone-free material measures 10 W/mk and has excellent deflection properties which provide minimal pressure on components. Very little pressure is required to reach the lowest possible thermal resistance.

Features
  • High thermal conductivity
  • Low shore harndness value
  • Deflects easily with minimal pressure
  • Silicone-free formulation
  • Low peak and residual pressure
  • Naturally tacky
  • Excellent surface wetting for low contact resistance
  • Exceptionally low thermal resistance
  • UL94 V0
  • RoHS and REACH compliant
Applications
  • Automotive ADAS
  • Automotive electronics
  • Automotive infotainment
  • Gaming systems
  • Tablets/notebooks
  • Routers
  • Servers
  • Smart home devices
  • Wireless infrastructure

Tflex SF10 Thermal Gap Filler

ImageManufacturer Part NumberDescriptionAvailable QuantityPriceView Details
THERM PAD 229MMX229MM GRAYA18213-02THERM PAD 229MMX229MM GRAY23 - Immediate$38.74View Details
THERM PAD 229MMX229MM GRAYA18213-06THERM PAD 229MMX229MM GRAY414 - Immediate$107.51View Details
THERM PAD 229MMX229MM GRAYA18213-04THERM PAD 229MMX229MM GRAY118 - Immediate$80.28View Details
THERM PAD 229MMX229MM GRAYA18213-10THERM PAD 229MMX229MM GRAY66 - Immediate$210.21View Details
THERM PAD 229MMX229MM GRAYA18213-08THERM PAD 229MMX229MM GRAY9 - Immediate$136.73View Details
Published: 2021-06-08

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