Tflex™ 300 Series

Laird Thermal's Tflex 300 is a silicone gel combined with a ceramic powder to offer a unique combination of compliancy, thermal resistance, and price. Tflex 300, at pressures of 50 psi, deflects over 50 percent the original thickness. This high rate of compliancy allows the material to "totally blanket" the component, enhancing thermal transfer. The material has a very low compression set enabling the pad to be reused many times. Tflex 300, in achieving its stellar compliancy, does not sacrifice thermal performance. With a thermal conductivity of 1.2 W/mK, low thermal resistances can be achieved at low pressures. Tflex 300 is offered with a hard, metallized liner option for easy handling and improved rework. This metallized liner offers better thermal transfer than other silicone based liners found on comparable products. The metallized liner's lower coefficient of friction also allows for easy assembly of parts that must slide together, such as a card into a chassis.