High-Performance Board-Level Heat Sinks

219 Bridge Series SMT Heat Sinks
Innovation in SMT-compatible heatsinks from Wakefield Thermal are designed to meet the needs of newer, higher-power, SMT semiconductors. The 219 series heat sinks’ unique design (patent pending) combines the technology of automatically assembling the tin-plated, solderable wires/rods with that of an extruded, aluminum, anodized heat-sink body to configure these SMT heat sinks. Rods/wires named "Rollers" are mated mechanically to the heat-sink body by forging to reduce the interface thermal resistance between the drains and heat dissipation body.

Features

• Increased thermal performance up to 30% over bright copper heat sinks from improved radiation of the black finish
• Increased surface areas by 3 times; therefore thermal performance is up to 300% over the aluminum-stamped heat sinks on markets
• Lightweight aluminum construction allows faster pick-and-place assembly, reducing the manufacturing cycle time
• Radius-mounted “Rollers” are designed for maximizing heat transfer from components and to avoid “bottle neck” heat transfer like the aluminum-stamped heat sinks
• Available in bulk packaging or tape and reel

Universal 678 Series Vertical Heat Sinks for Power Devices
Wakefield Thermal’s Universal 678 series offers high-performance, low-cost, versatile heat sinks with screws or clips for all kinds of standard packages. This type of heat sink provides both vertical and horizontal mounting options on PCB to accommodate natural and forced convection cooling methods.

Features

• Minimum assembly cost and labor: spring clips make the mounting holes and fasteners obsolete in assembly operations and reduce costs
• Design flexibility: universal, mountable, and “one-fits-all” features give designers total freedom to fit their packaging designs with ideal device pack styles and to orient the heat sink to meet their power dissipations with optimized cooling methods

Mountain Series Heat Sinks for TO-264 and TO-247 Devices
Wakefield Thermal's Mountain series heat sinks are high performance, low cost, configurable, scalable, and compact with a matrix clip system for TO220, TO-247, TO-264, and other standard packages. This type of powerful heat sink provides easy assembly, large surface areas, small space occupation, and an all-in-one solution. The power dissipations can be easily increased simply by extending the fin height on each side of the heat sink while keeping the heat sink height and PCB layout the same. It is the ideal type of heat sink for high power density and small size (1U or 2U) electronic packaging with forced convention cooling.

Features

• Minimum assembly cost and labor: spring clips make the mounting holes and fasteners obsolete in assembly operations and reduce costs
• Maximum thermal transfer, maximum surface area per unit volume, efficient cooling fins, and a consistent mounting force reduces thermal resistance
• Maximum repeatability constant spring force over repeated assembly/disassembly
• Maximum reliability resilient spring action locks electronic component in place
  • Fewer parts in assembly
  • No fasteners and washers required
  • Prevents short circuits by eliminating metal particles generated from hardware or thread tapping