Solder preforms, wire, and ribbon are manufactured and packaged to minimize oxidation. Since no container offers complete isolation from oxygen in ambient air, solder will slowly oxidize, which may result in a reduction in wetting.

The alloys in this book are the result of decades of listening to our customers and finding solutions that enable cutting-edge technologies

Metal Thermal Interface Materials (TIMs) aid in the transfer of heat between surfaces and minimize the thermal resistance at each device connection.

For high-power devices, the performance of interconnect materials within the packaging is critical to achieve efficiency and longevity.

The automotive industry, emerging electric vehicles, and wafer-level packages with smaller pitch sizes demand higher reliability of solder joints, namely, the elongated lifetime and/or the survival of more aggressive service conditions, than the mainstream SAC305.

The theoretical volume of solder paste can be calculated for each board using the Greely Formula and a simple volume calculation.

Durafuse® LT serves as a high-reliability solution to several different application challenges employing a vast array of reflow processes to achieve different results.

Indium metal is extracted primarily from indium-bearing zinc or tin ores and purified to various grades utilizing state-of-the-art statistical process-controlled refining technologies.

Indium flux and solder compatibility application note.

Reducing the energy consumed by the reflow oven has a direct impact on reduced CO2 emissions. In addition to quantifying the energy consumed, there is a growing emphasis on the Life Cycle Assessment (LCA) of a product.

A manufacturer can choose either a rosin-containing or a non-rosin-containing flux based on the solvent used, the ratio of flux to solvent, and the current cleaning process, to name a few.

One of the biggest challenges facing the electronics industry today is voiding in the solder joints that connect bottom terminated components to PCBs.

Indium Corporation manufactures bar solder to surpass the strict quality demands of the surface mount industry, providing more consistent, reliable performance.

Solid solder wire from Indium Corporation is manufactured to meet demanding quality standards of ASTM B-32, J-STD-006, and JIS-Z-3282.

The CW-807 is compatible with all Indium Corporation no-clean solder pastes, wave fluxes, and common soft solder alloys.

Indium bar solder chips are small pieces of electronics-grade bar solder used to fill smaller pots or to quicken the melting of solder in a new solder pot.

The Indium6.6HF water-soluble solder paste from Indium is capable of SnPb and Pb-free assembly processes with an exceptional reflow process window.

Indium CW-219 highly activated, high-performance, no-clean cored wire is ideal for robotic and hand soldering of very oxidized surfaces.

Indium technologically advanced flux pens each contain 10 ml of flux and feature exceptional leak control and dispensing capability.

Indium CW-818 cored wire features heat-resistant and low-spatter properties, providing an assembly with excellent visual appearance.