BAT60J Datasheet by STMicroelectronics

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BAT60J
®
January 2003 - Ed: 6A
SMALL SIGNAL SCHOTTKY DIODE
VERY SMALL CONDUCTION LOSSES
NEGLIGIBLE SWITCHING LOSSES
LOW FORWARD VOLTAGE DROP
EXTREMELY FAST SWITCHING
SURFACE MOUNTED DEVICE
FEATURES AND BENEFITS
Schottky barrier diode encapsulated in a SOD-323
small SMD package.
This device is intended for use in portable
equipments. It is suited for DC to DC converters,
step-up conversion and power management.
DESCRIPTION
SOD-323
Symbol Parameter Value Unit
VRRM Repetitive peak reverse voltage 10 V
IFPeak forward current δ= 0.11 3 A
IFSM Surge non repetitive forward current tp=10ms 5 A
Ptot Power Dissipation Ta=25°C 310 mW
Tstg Storage temperature range - 65 to +150 °C
Tj Maximum operating junction temperature * 150 °C
TL Maximum temperature for soldering during 10s 260 °C
ABSOLUTE RATINGS (limiting values)
Symbol Parameter Value Unit
Rth (j-a) Junction to ambient (*) 400 °C/W
(*) Mounted on epoxy board with recommended pad layout.
THERMAL RESISTANCE
*:
dPtot
dTj Rth j a
<
1
()
thermal runaway condition for a diode on its own heatsink
AK
60
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Symbol Tests Conditions Tests conditions Min. Typ. Max. Unit
VF* Forward voltage drop Tj = 25°C IF= 10 mA 0.28 0.32 V
IF= 100 mA 0.35 0.40
IF= 1 A 0.53 0.58
IR** Reverse leakage current Tj = 25°C VR=5V 1 3 µA
Tj = 25°C VR= 8 V 1.3 4
Tj = 25°C VR=10V 2 6
Tj = 25°C VR= 12 V 2.5 7.5
Tj = 80°C VR= 8 V 73 150
STATIC ELECTRICAL CHARACTERISTICS
Pulse test: * tp = 380µs, δ<2%
** tp = 5ms, δ<2%
To evaluate the conduction losses the following equation:
P=0.38xI
F(AV) + 0.17 IF2(RMS)
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0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7
0.00
0.05
0.10
0.15
0.20
0.25
0.30
0.35
IF(av) (A)
PF(av)(W)
T
δ=tp/T tp
δ= 0.05 δ= 0.1 δ= 0.2 δ= 0.5
δ= 1
Fig. 1: Average forward power dissipation versus
average forward current.
0 25 50 75 100 125 150
0.0
0.4
0.8
1.2
1.6
2.0
2.4
2.8
3.2
Tamb(°C)
IF(A)
T
δ=tp/T tp
Fig. 2-1: Peak forward current versus ambient
temperature (δ= 0.11).
0 25 50 75 100 125 150
0.00
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
0.50
0.55
0.60
Tamb(°C)
IF(av)(A)
T
δ=tp/T tp
Fig. 2-2: Average forward current versus ambient
temperature (δ= 0.5).
1E-3 1E-2 1E-1 1E+0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
t(s)
IM(A)
Ta=25°C
Ta=50°C
Ta=75°C
IM
t
δ=0.5
Fig. 3: Non repetitive surge peak forward current
versus overload duration (maximum values).
1E-4 1E-3 1E-2 1E-1 1E+0 1E+1 1E+2
1E-3
1E-2
1E-1
1E+0
t(s)
Zth(j-a)/Rth(j-a)
δ= 0.5
δ= 0.2
δ= 0.1
Single pulse T
δ=tp/T tp
Fig. 4: Relative variation of thermal impedance junc-
tion to ambient versus pulse duration (Epoxy printed
circuit board FR4 with recommended pad layout).
012345678910
1E-4
1E-3
1E-2
1E-1
1E+0
1E+1
VR(V)
IR(mA)
Tj=80°C
Tj=25°C
Tj=150°C
Fig. 5: Reverse leackage current versus reverse
voltage applied (typical values).
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0 25 50 75 100 125 150
1E-1
1E+0
1E+1
1E+2
1E+3
1E+4
1E+5
Tj(°C)
IR[Tj] / IR[Tj=25°C]
VR=8V
Fig. 6: Reverse leackage current versus junction
temperature (typical values).
110
10
100
VR(V)
C(pF)
F=1MHz
Tj=25°C
Fig. 7: Junction capacitance versus reverse voltage
applied (typical values).
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
1E-1
1E+0
1E+1
VFM(V)
IFM(A)
Tj=150°C
(Typical values)
Tj=80°C
(Typical values)
Tj=25°C
(Maximum values)
Fig. 8-1: Forward voltage drop versus forward cur-
rent (High level).
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
VFM(V)
IFM(A)
Tj=150°C
(Typical values)
Tj=25°C
(Maximum values)
Tj=80°C
(Typical values)
Fig. 8-2: Forward voltage drop versus forward cur-
rent (Low level).
0 102030405060708090100
100
150
200
250
300
350
400
450
500
550
600
S(Cu) (mm²)
Rth(j-a) (°C/W)
IF=0.75A
Fig. 9: Thermal resistance junction to ambient ver-
sus copper surface (epoxy printed circuit board FR4,
copper thickness: 35µm).
m’fi LL” L A
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use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
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approval of STMicroelectronics.
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© 2003 STMicroelectronics - Printed in Italy - All rights reserved.
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PACKAGE MECHANICAL DATA
SOD-323
H
b
D
E
A1
A
L
Q1
c
REF.
DIMENSIONS
Millimeters Inches
Min. Max. Min. Max.
A 1.17 0.046
A1 0 0.1 0 0.004
b 0.25 0.44 0.01 0.017
c 0.1 0.25 0.004 0.01
D 1.52 1.8 0.06 0.071
E 1.11 1.45 0.044 0.057
H 2.3 2.7 0.09 0.106
L 0.1 0.46 0.004 0.02
Q1 0.1 0.41 0.004 0.016
Type Marking Package Weight Base qty Delivery mode
BAT60JFILM 60 SOD-323 0.005 g. 3000 Tape & reel
Epoxy meets UL94V-0
MARKING

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