IXD 609 Datasheet by IXYS Integrated Circuits Division

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IJIXYS 4? ® fins.
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IVISION
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Features
9A Peak Source/Sink Drive Current
Wide Operating Voltage Range: 4.5V to 35V
-40°C to +125°C Extended Operating Temperature
Range
Logic Input Withstands Negative Swing of up to 5V
Matched Rise and Fall Times
Low Propagation Delay Time
Low, 10A Supply Current
Low Output Impedance
Applications
Efficient Power MOSFET and IGBT Switching
Switch Mode Power Supplies
Motor Controls
DC to DC Converters
Class-D Switching Amplifiers
Pulse Transformer Driver
Description
The IXDD609/IXDI609/IXDN609 high-speed gate
drivers are especially well suited for driving the latest
IXYS MOSFETs and IGBTs. The IXD_609
high-current output can source and sink 9A of peak
current while producing voltage rise and fall times of
less than 25ns. The input is CMOS compatible, and is
virtually immune to latch up. Proprietary circuitry
eliminates cross-conduction and current
“shoot-through.” Low propagation delay and fast,
matched rise and fall times make the IXD_609 family
ideal for high-frequency and high-power applications.
The IXDD609 is configured as a non-inverting driver
with an enable, the IXDN609 is configured as a
non-inverting driver, and the IXDI609 is configured as
an inverting driver.
The IXD_609 family is available in a standard 8-pin
DIP (PI); an 8-pin SOIC (SIA); an 8-pin Power SOIC
with an exposed metal back (SI); an 8-pin DFN (D2); a
5-pin TO-263 (YI); and a 5-pin TO-220 (CI).
Ordering Information
Part Number Logic
Configuration Package Type Packing
Method Quantity
IXDD609D2TR 8-Pin DFN Tape & Reel 2000
IXDD609SI 8-Pin Power SOIC with Exposed Metal Back Tube 100
IXDD609SITR 8-Pin Power SOIC with Exposed Metal Back Tape & Reel 2000
IXDD609SIA 8-Pin SOIC Tube 100
IXDD609SIATR 8-Pin SOIC Tape & Reel 2000
IXDD609PI 8-Pin DIP Tube 50
IXDD609CI 5-Pin TO-220 Tube 50
IXDD609YI 5-Pin TO-263 Tube 50
IXDI609SI 8-Pin Power SOIC with Exposed Metal Back Tube 100
IXDI609SITR 8-Pin Power SOIC with Exposed Metal Back Tape & Reel 2000
IXDI609SIA 8-Pin SOIC Tube 100
IXDI609SIATR 8-Pin SOIC Tape & Reel 2000
IXDI609PI 8-Pin DIP Tube 50
IXDI609CI 5-Pin TO-220 Tube 50
IXDI609YI 5-Pin TO-263 Tube 50
IXDN609SI 8-Pin Power SOIC with Exposed Metal Back Tube 100
IXDN609SITR 8-Pin Power SOIC with Exposed Metal Back Tape & Reel 2000
IXDN609SIA 8-Pin SOIC Tube 100
IXDN609SIATR 8-Pin SOIC Tape & Reel 2000
IXDN609PI 8-Pin DIP Tube 50
IXDN609CI 5-Pin TO-220 Tube 50
IXDN609YI 5-Pin TO-263 Tube 50
IN
EN
OUT
INOUT
INOUT
IXD_609
9-Ampere Low-Side
Ultrafast MOSFET Drivers
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1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 Pin Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 Pin Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.5 Electrical Characteristics: TA = 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.6 Electrical Characteristics: TA = - 40°C to +125°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
1.7 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2. IXD_609 Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1 Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.2 Characteristics Test Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3. Block Diagrams & Truth Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3.1 IXDD609 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3.2 IXDI609 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3.3 IXDN609 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4. Typical Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.3 Soldering Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.4 Board Wash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.5 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
IIIIXYS Egg @fifi
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1 Specifications
1.1 Pin Configurations 1.2 Pin Definitions
1.3 Absolute Maximum Ratings
Unless stated otherwise, absolute maximum electrical ratings are at 25°C
Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device.
Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not
implied.
1.4 Recommended Operating Conditions
1
4
3
2
8
5
6
7
V
CC
IN
EN
GND
V
CC
OUT
OUT
GND
1
4
3
2
5
V
CC
OUT
GND
IN
EN
1
4
3
2
8
5
6
7
V
CC
IN
NC
GND
V
CC
OUT
OUT
GND
1
4
3
2
5
V
CC
OUT
GND
IN
NC
1
4
3
2
8
5
6
7
V
CC
IN
NC
GND
V
CC
OUT
OUT
GND
1
4
3
2
5
V
CC
OUT
GND
IN
NC
IXDD609 D2 / PI / SI / SIA
IXDI609 PI / SI / SIA
IXDN609 PI / SI / SIA
IXDD609 CI / YI
IXDI609 CI / YI
IXDN609 CI / YI
Pin Name Description
IN Logic Input
EN Output Enable - Drive pin low to disable output,
and force output to a high impedance state
OUT Output - Sources or sinks current to turn-on or
turn-off a discrete MOSFET or IGBT
OUT Inverted Output - Sources or sinks current to
turn-on or turn-off a discrete MOSFET or IGBT
VCC Supply Voltage - Provides power to the device
GND Ground - Common ground reference for the
device
NC Not connected
Parameter Symbol Minimum Maximum Units
Supply Voltage VCC -0.3 40 V
Input Voltage VIN, VEN -5 VCC+0.3 V
Output Current IOUT 9A
Junction Temperature TJ-55 +150 °C
Storage Temperature TSTG -65 +150 °C
Parameter Symbol Range Units
Supply Voltage VCC 4.5 to 35 V
Operating Temperature Range T
A-40 to +125 °C
IIIIXYS Test Conditions: 4.5V 5 V05 5 4.5V g vCC g 4.5V 5 VCD 5 0v 3 v‘N g Test Conditions: 4.5V 5 V05 5 4.5V 5 Vcc 5 4.5V 5 Vcc 5 W s vtN s
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1.5 Electrical Characteristics: TA = 25°C
Test Conditions: 4.5V < VCC < 35V (unless otherwise noted).
1.6 Electrical Characteristics: TA = - 40°C to +125°C
Test Conditions: 4.5V < VCC < 35V unless otherwise noted.
Parameter Conditions Symbol Minimum Typical Maximum Units
Input Voltage, High 4.5V < VCC < 18V VIH 3.0 - - V
Input Voltage, Low 4.5V < VCC < 18V VIL --0.8
Input Current 0V < VIN < VCC IIN --±10A
EN Input Voltage, High IXDD609 only VENH 2/3VCC --
V
EN Input Voltage, Low IXDD609 only VENL --
1/3VCC
Output Voltage, High - VOH VCC-0.025 --
V
Output Voltage, Low - VOL - - 0.025
Output Resistance, High State VCC=18V, IOUT=-100mA ROH -0.61
Output Resistance, Low State VCC=18V, IOUT=100mA ROL -0.40.8
Output Current, Continuous Limited by package power
dissipation IDC --±2A
Rise Time VCC=18V, CLOAD=10nF tr-2235
ns
Fall Time VCC=18V, CLOAD=10nF tf-1525
On-Time Propagation Delay VCC=18V, CLOAD=10nF tondly -4060
Off-Time Propagation Delay VCC=18V, CLOAD=10nF toffdly -4260
Enable to Output-High Delay Time
(IXDD609 Only) VCC=18V tENOH -2560
Disable to High Impedance State Delay Time
(IXDD609 Only) VCC=18V tDOLD -3560
Enable Pull-Up Resistor - REN -200-k
Power Supply Current
VCC=18V, VIN=3.5V
ICC
-12mA
VCC=18V, VIN=0V -<110
A
VCC=18V, VIN=VCC -<110
Parameter Conditions Symbol Minimum Maximum Units
Input Voltage, High 4.5V < VCC < 18V VIH 3.3 - V
Input Voltage, Low 4.5V < VCC < 18V VIL -0.65
Input Current 0V < VIN < VCC IIN 10A
Output Voltage, High - VOH VCC-0.025 -V
Output Voltage, Low - VOL - 0.025
Output Resistance, High State VCC=18V, IOUT=-100mA ROH -2
Output Resistance, Low State VCC=18V, IOUT=100mA ROL -1.5
Output Current, Continuous Limited by package power
dissipation IDC 1A
Rise Time VCC=18V, CLOAD=10nF tr-40
ns
Fall Time VCC=18V, CLOAD=10nF tf-30
On-Time Propagation Delay VCC=18V, CLOAD=10nF tondly -75
Off-Time Propagation Delay VCC=18V, CLOAD=10nF toffdly -75
Enable to Output-High Delay Time IXDD609 only, VCC=18V tENOH -75
Disable to High Impedance State Delay Time IXDD609 only, VCC=18V tDOLD -75
Power Supply Current
VCC=18V, VIN=3.5V
ICC
-2.5mA
VCC=18V, VIN=0V -150
A
VCC=18V, VIN=VCC -150
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1.7 Thermal Characteristics
2 IXD_609 Performance
2.1 Timing Diagrams
2.2 Characteristics Test Diagram
Package Parameter Symbol Rating Units
D2 (8-Pin DFN)
Thermal Impedance, Junction-to-Ambient JA
35
°C/W
CI (5-Pin TO-220) 36
PI (8-Pin DIP) 125
SI (8-Pin Power SOIC) 85
SIA (8-Pin SOIC) 120
YI (5-Pin TO-263) 46
CI (5-Pin TO-220)
Thermal Impedance, Junction-to-Case JC
3
°C/W
SI (8-Pin Power SOIC) 10
YI (5-Pin TO-263) 2
10%
90%
t
ondly
t
offdly
t
r
t
f
V
IH
V
IL
IN
OUT
10%
90%
t
ondly
t
offdly
t
f
t
r
V
IH
V
IL
IN
OUT
EN
INOUT
GND
VCC
VCC
+
-
VIN
0.1μF10μF
Tektronix
Current Probe
6302
CLOAD
VCC
‘ WT TU
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3 Block Diagrams & Truth Tables
3.1 IXDD609
3.2 IXDI609
3.3 IXDN609
IN EN OUT
0 1 or open 0
1 1 or open 1
x0
Z
IN OUT
01
10
IN
VCC
GND
OUT
IN OUT
00
11
IN
VCC
GND
OUT
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4 Typical Performance Characteristics
Load Capacitance (pF)
0 2000 4000 6000 8000 10000
Rise Time (ns)
0
10
20
30
40
50
60
70 Rise Time vs. Load Capacitance
VCC=4.5V
VCC=8V
VCC=12V
VCC=18V
VCC=25V
VCC=30V
VCC=35V
Temperature (ºC)
-40 -20 0 20 40 60 80 100 120 140
Rise & Fall Times (ns)
5
6
7
8
9
10
11
Rise and Fall Times vs. Temperature
(VIN=0-5V, VCC=18V, f=10kHz, CL=2.5nF)
tr
tf
Supply Voltage (V)
0 5 10 15 20 25 30 35
Fall Time (ns)
0
10
20
30
40
50
60
Fall Time vs. Supply Voltage
(Input=0-5V, f=10kHz, TA=25ºC)
CL=10nF
CL=5.4nF
CL=1.5nF
Supply Voltage (V)
0 5 10 15 20 25 30 35
Rise Time (ns)
0
10
20
30
40
50
60
70
Rise Time vs. Supply Voltage
(Input=0-5V, f=10kHz, TA=25ºC)
CL=10nF
CL=5.4nF
CL=1.5nF
Load Capacitance (pF)
0 2000 4000 6000 8000 10000
Fall Time (ns)
0
10
20
30
40
50
60 Fall Time vs. Load Capacitance
VCC=4.5V
VCC=8V
VCC=12V
VCC=18V
VCC=25V
VCC=30V
VCC=35V
Supply Voltage (V)
0 5 10 15 20 25 30 35
Input Threshold (V)
1.0
1.5
2.0
2.5
3.0
3.5 Input Threshold vs. Supply Voltage
Min VIH
Max VIL
Temperature (ºC)
-40 -20 0 20 40 60 80 100 120 140
Input Threshold Voltage (V)
1.9
2.0
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
Input Threshold Voltage
vs. Temperature
(VCC=18V, CL=2.5nF)
Min VIH
Max VIL
Temperature (ºC)
-40 -20 0 20 40 60 80 100 120 140
Propagation Delay (ns)
30
35
40
45
50
55
Propagation Delay
vs. Temperature
(VCC=18V, f=1kHz, CL=5.4nF)
tondly
toffdly
Input Voltage (V)
246810 12
Propagation Delay (ns)
0
20
40
60
80
100
120
140
160
180
Propagation Delay vs. Input Voltage
(VIN=5V, VCC=12V, f=1kHz, CL=5.4nF)
tondly
toffdly
119753
Supply Voltage (V)
0 5 10 15 20 25 30 35
Propagation Delay (ns)
0
50
100
150
200
Propagation Delay vs. Supply Voltage
(VIN=0-5V, f=1kHz, CL=5.4nF)
toffdly
tondly
Supply Voltage (V)
0 5 10 15 20 25 30 35
Enable Threshold (V)
0
5
10
15
20
25 Enable Threshold vs. Supply Voltage
Min VENH
Max VENL
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Load Capacitance (pF)
1000 10000
Supply Current (mA)
0
100
200
300
400
500
Supply Current vs. Load Capacitance
(V
CC
=18V)
f=2MHz
f=1MHz
f=500kHz
f=100kHz
f=50kHz
f=10kHz
f=1kHz
5000
Load Capacitance (pF)
1000 10000
Supply Current (mA)
0
50
100
150
200
250
300
Supply Current vs. Load Capacitance
(V
CC
=12V)
f=2MHz
f=1MHz
f=500kHz
f=100kHz
f=50kHz
f=10kHz
f=1kHz
5000
Load Capacitance (pF)
1000 10000
Supply Current (mA)
0
50
100
150
200
Supply Current vs. Load Capacitance
(V
CC
=8V)
f=2MHz
f=1MHz
f=500kHz
f=100kHz
f=50kHz
f=10kHz
f=1kHz
5000
Frequency (kHz)
1 10 100 1000 10000
Supply Current (mA)
0.1
1
10
100
1000
Supply Current vs. Frequency
(V
CC
=18V)
C
L
=10nF
C
L
=5.4nF
C
L
=1.5nF
Frequency (kHz)
1 10 100 1000 10000
Supply Current (mA)
0.1
1
10
100
1000
Supply Current vs. Frequency
(V
CC
=12V)
C
L
=10nF
C
L
=5.4nF
C
L
=1.5nF
Frequency (kHz)
1 10 100 1000 10000
Supply Current (mA)
0.01
0.1
1
10
100
1000
Supply Current vs. Frequency
(V
CC
=8V)
C
L
=10nF
C
L
=5.4nF
C
L
=1.5nF
Temperature (ºC)
-40 -20 0 20 40 60 80 100 120 140
Supply Current (mA)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
Quiescent Supply Current
vs. Temperature
V
IN
=3.5V
V
IN
=5V
V
IN
=10V
V
IN
=0V & 18V
Temperature (ºC)
-40 -20 0 20 40 60 80 100 120 140
Supply Current (mA)
0.35
0.40
0.45
0.50
0.55
0.60
0.65
Dynamic Supply Current
vs. Temperature
(V
IN
=5V, V
CC
=18V, f=1kHz, C
L
=1.5nF)
Supply Voltage (V)
0 5 10 15 20 25 30 35
Output Source Current (A)
0
-5
-10
-15
-20
-25
-30
Output Source Current
vs. Supply Voltage
(f=422Hz, CL=66nF)
Supply Voltage (V)
0 5 10 15 20 25 30 35
Output Sink Current (A)
0
5
10
15
20
25
30
Output Sink Current
vs. Supply Voltage
(f=422Hz, CL=66nF)
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Temperature (ºC)
-40 -20 0 20 40 60 80 100 120 140
Output Source Current (A)
-9.0
-9.5
-10.0
-10.5
-11.0
-11.5
-12.0
Output Source Current
vs. Temperature
(V
CC
=18V, f=422Hz, C
L
=66nF)
Temperature (ºC)
-40 -20 0 20 40 60 80 100 120 140
Output Sink Current (A)
10.0
10.5
11.0
11.5
12.0
12.5
13.0
13.5
14.0
Output Sink Current
vs. Temperature
(V
CC
=18V, f=422Hz, C
L
=66nF)
Supply Voltage (V)
0 5 10 15 20 25 30 35
Output Resistance (Ω)
0.0
0.5
1.0
1.5
High State Output Resistance
vs. Supply Voltage
(I
OUT
= -10mA)
Supply Voltage (V)
0 5 10 15 20 25 30 35
Output Resistance (Ω)
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
Low State Output Resistance
vs. Supply Voltage
(I
OUT
= +10mA )
IIIIXYS E» ® (ans.
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5 Manufacturing Information
5.1 Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest
version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation.
We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled
according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
5.2 ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
5.3 Soldering Profile
Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the
body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum Body
Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other
processes, the guidelines of J-STD-020 must be observed.
5.4 Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce or
remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to
prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and
providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing
process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature
and duration necessary to remove the moisture trapped within the package is the responsibility of the user
(assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be
used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.
Device Moisture Sensitivity Level (MSL) Classification
IXD_609 All Versions except IXD_609YI MSL 1
IXD_609YI MSL 3
Device Classification Temperature (TC)Dwell Time (tp)Maximum Cycles
IXD_609CI 245°C for 30 seconds 30 seconds 1
IXD_609YI 245°C for 30 seconds 30 seconds 3
IXD_609PI 250°C for 30 seconds 30 seconds 3
IXD_609SI / IXD_609SIA / IXD_609D2 260°C for 30 seconds 30 seconds 3
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5.5 Mechanical Dimensions
5.5.1 SIA (8-Pin SOIC)
5.5.2 SI (8-Pin Power SOIC with Exposed Metal Back)
Dimensions
MIN / MAX
1.75 MAX
(0.069 MAX)
1.25 MIN
(0.049 MIN)
0.10 / 0.25
(0.004 / 0.010)
0.10
(0.004)
4
4.80 / 5.00
(0.189 / 0.197)
TOP VIEW
PIN #1
5.80 / 6.20
(0.228 / 0.244)
5
3.80 / 4.00
(0.150 / 0.157)
0.31 / 0.51
(0.012 / 0.020)
8x
SEATING PLANE
GAUGE PLANE
8°- 0°
0.10 / 0.25
(0.004 / 0.010)
0.40 / 1.27
(0.016 / 0.050)
A
0.25
(0.010)
PCB Land Pattern
1.55
(0.061)
0.60
(0.024)
3.75
(0.148)
A
Notes:
1. Controlling dimension: millimeters.
2. All dimensions are in mm (inches).
3. This package conforms to JEDEC Standard MS-012, variation AA, Rev. F.
4. Dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15mm per end.
5. Dimension does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.25mm per side.
6. Lead thickness includes plating.
6x
1.27
0.05
Dimensions
MIN / MAX
1.70 MAX
(0.067 MAX)
1.25 MIN
(0.049 MIN)
0 / 0.15
(0 / 0.006)
0.10
(0.004)
4
4.80 / 5.00
(0.189 / 0.197)
TOP VIEW
PIN #1
5.80 / 6.20
(0.228 / 0.244)
5
3.80 / 4.00
(0.150 / 0.157)
0.31 / 0.51
(0.012 / 0.020)
8x
BOTTOM VIEW
2.05 / 2.41
(0.081 / 0.095)
2.81 / 3.30
(0.111 / 0.130)
SEATING PLANE
GAUGE PLANE
8°- 0°
0.10 / 0.25
(0.004 / 0.010)
0.40 / 1.27
(0.016 / 0.050)
A
0.25
(0.010)
PCB Land Pattern
1.55
(0.061)
0.60
(0.024)
3.85
(0.152) 2.23
(0.088)
3.055
(0.120)
A
6x
1.27
0.05
Notes:
1. Controlling dimension: millimeters.
2. All dimensions are in mm (inches).
3. This package conforms to JEDEC Standard MS-012, variation BA, Rev. F.
4. Dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15mm per end.
5. Dimension does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.25mm per side.
6. The exposed metal pad on the back of the package should be connected to GND. It is not suitable for carrying current.
7. Lead thickness includes plating.
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5.5.3 Tape & Reel Information for SI and SIA Packages
5.5.4 YI (5-Pin TO-263)
Dimensions
mm
(inches)
NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
K0= 2.10
(0.083)
W=12.00
(0.472)
B0=5.30
(0.209)
User Direction of Feed
A0=6.50
(0.256) P1=8.00
(0.315)
H
b1
c1
b
c
SECTION: C-C
PLATING
(Note 3)
BASE METAL
E
(Note 2)
D1
D
(Note 2)
L1
e ~4x
CC
E3
D2
*
b ~5x
E1
NOTES:
1. Reference JEDEC TO-263 Type “BA”.
2. Dimension does not include mold flash; mold flash
shall not exceed 0.127mm (0.005 inch) per side.
3. Minimum plating: 1000 microinches.
4. Controlling dimension: millimeters.
MINMINMAX MAX
MM INCH
SYMBOL
1.702 BSC 0.067 BSC
0.254 BSC 0.010 BSC
0.460 TYP 0.018 TYP
0.506 TYP 0.02 TYP
4.8264.064 0.160 0.190
0.2540.000 0.000 0.010
0.9910.5080.020 0.039
0.8890.5080.020 0.035
0.7370.381 0.015 0.029
0.5840.381 0.015 0.023
1.6511.143 0.045 0.065
9.6528.382 0.330 0.380
7.7006.8580.270 0.303
10.6689.652 0.380 0.420
8.0006.223 0.245 0.315
15.87514.605 0.575 0.625
2.7941.7780.070 0.110
1.6761.000 0.039 0.066
8º--8º
A
θ
A1
b
b1
c
c1
c2
D
D1
E
E1
e
H
L
L1
L3
R
R1
6.8695.092 0.200 0.270E3
1.5621.3580.053 0.062D2
A1
L
L3
θ
RR
A
c2
A1
L
L3
θ
R1 R1
JEDEC TO-263
Optional Tip Lead Form
Recommended PCB Pattern
10.75
(0.423)
2.20
(0.087)
8.40
(0.331)
8.05
(0.317) 10.50
(0.413)
1.05
(0.041)
3.80
(0.150)
1.702
(0.067)
Dimensions
mm
(inches)
Pin 1
Indicator
Circular feature will be
present on devices
with the
Optional Tip Lead Form.
*
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5.5.5 PI (8-Pin DIP)
5.5.6 CI (5-Pin TO-220)
Dimensions
mm
(inches)
PCB Hole Pattern
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
9.144 ± 0.508
(0.360 ± 0.020)
0.457 ± 0.076
(0.018 ± 0.003)
9.652 ± 0.381
(0.380 ± 0.015)
7.239 TYP.
(0.285)
7.620 ± 0.254
(0.300 ± 0.010)
4.064 TYP
(0.160)
0.813 ± 0.102
(0.032 ± 0.004)
8-0.800 DIA.
(8-0.031 DIA.) 2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
Pin 1
0.254 ± 0.0127
(0.010 ± 0.0005)
9.652 - 10.668
(0.380 - 0.420)
14.224 - 16.510
(0.560 - 0.650)
12.700 - 14.732
(0.500 - 0.580)
CC
8.382 - 9.017
(0.330 - 0.355)
2.540 - 3.048
(0.100 - 0.120)
1.702 4x BSC
(0.067 4x BSC)
0.381 - 1.016 5x
(0.015 - 0.040 5x) SECTION C-C
0.381 - 1.016
(0.015 - 0.040)
0.356 - 0.610
(0.014 - 0.024)
0.381 - 0.965
(0.015 - 0.038)
0.356 - 0.559
(0.014 - 0.022)
PLATINGBASE METAL
3.556 - 4.826
(0.140 - 0.190)
0.508 - 1.397
(0.020 - 0.055)
5.842 - 6.858
(0.230 - 0.270)
2.032 - 2.921
(0.080 - 0.115)
0.356 - 0.610
(0.014 - 0.024)
6.858 - 8.890
(0.270 - 0.350)
12.192 - 12.878
(0.480 - 0.507)
9.652 - 10.668
(0.380 - 0.420)
7.550 - 8.100
(0.297 - 0.319)
THERMAL PAD
LEAD TIP
0.355 M B A M
AB
0.381 M B A M
3.810 - 3.860
(0.150 - 0.152)
0.127 BSC
(0.005 BSC)
4.826 - 5.334
(0.190 - 0.210)
6.300 - 6.700
(0.248 - 0.264)
5.842 - 6.858
(0.230 - 0.270)
Dimensions
mm
(inches)
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5.5.7 D2 (8-Pin DFN)
5.5.8 Tape & Reel Information for D2 Package
Dimensions
mm MIN / mm MAX
(inches MIN / inches MAX)
5.00 BSC
(0.197 BSC)
4.00 BSC
(0.157 BSC)
0.80 / 1.00
(0.031 / 0.039)
0.10
(0.004)
0.95 BSC
(0.037 BSC)
0.74 / 0.83
(0.029 / 0.033)
0.30 / 0.45
(0.012 / 0.018)
3.03 / 3.10
(0.119 / 0.122)
2.53 / 2.60
(0.100 / 0.102)
0.35 / 0.45 x 45º
(0.014 / 0.018 x 45º)
Pin 1
Pin 1 Pin 8
0.20 REF
(0.008 REF)
Recommended PCB Land Pattern
4.50
(0.177)
0.45
(0.018)
1.20
(0.047)
3.10
(0.122)
2.60
(0.102)
0.95
(0.037)
0.35 x 45º
(0.014 x 45º)
NOTE:
The exposed metal pad on the back of the D2 package should
be connected to GND. Pad is not suitable for carrying current.
K0=1.90 ± 0.10
B0=5.40 ± 0.10
5º MAX
A0=4.25 ± 0.10
5º MAX
0.30 ± 0.05
(0.05)
(0.05)
R0.75 TYP
P1=8.00 ± 0.10
2.00 ± 0.05
4.00 ± 0.10 See Note #2
12.00 ± 0.30
5.50 ± 0.05
1.75 ± 0.10
1.50 (MIN)
1.55 ± 0.05
NOTES:
1. A0 & B0 measured at 0.3mm above base of pocket.
2. 10 pitches cumulative tol. ± 0.2mm
3. ( ) Reference dimensions only.
4. Unless otherwise specified, all dimensions in millimeters.
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-IXD_609-R09
©Copyright 2017, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
10/25/2017

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