NC7SZ14 Datasheet by ON Semiconductor

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- Ulmx—Smnll MicmPakw Packages - Space—Saving SC—74A and sc—ssA Packages I These Devices are Pb—Frcc, Halogen FICc/BFR Free and are ROHS Compliant IEECHEC A {1 | v Figure 1. Logic Symbol m SamaanaucxawampmmMus-nae Lu: was 1 July, 2019 — Rev. : 0N Semiconductor® www.0nsem om SC-BBA CASE 41 SAC-01 : 2-D’gll Lot Run Trace XY : 2-Dlgil Dale Code F0 2 : Assembly P‘anl Code T : Die Run Code : Yea! Coding Scheme : Plant Code Idemmey _ _ : EighI-Week Dmacoa ORDERING INFORMATID see damned ordenng mavkmg and smppmg m package mmensmns secunn on page 5 M 1m Pubhcation O
Semiconductor Components Industries, LLC, 1996
July, 2019 Rev. 3
1Publication Order Number:
NC7SZ14/D
NC7SZ14
TinyLogic UHS Inverter
with Schmitt Trigger Input
Description
The NC7SZ14 is a single inverter with Schmitt trigger input from
ON Semiconductors UltraHigh Speed (UHS) series of TinyLogic.
The device is fabricated w ith advanced CMOS technology to achieve
ultrahigh speed with high output drive while maintaining low static
power dissipation over a very broad VCC operating range. The device
is specified to operate over the 1.65 V to 5.5 V VCC range. The inputs
and outputs are highimpedance when VCC is 0 V. Inputs tolerate
voltages up to 5.5 V independent of VCC operating voltage.
Features
UltraHigh Speed: tPD 3.7 ns (Typical) into 50 pF at 5 V VCC
High Output Drive: ±24 mA at 3 V VCC
Broad VCC Operating Range: 1.65 V to 5.5 V
Matches Performance of LCX when Operated at 3.3 V VCC
Power Down High Impedance Inputs / Outputs
OverVoltage Tolerance Inputs Facilitate 5 V to 3 V Translation
Proprietary Noise / EMI Reduction Circuitry
UltraSmall MicroPak Packages
SpaceSaving SC74A and SC88A Packages
These Devices are PbFree, Halogen Free/BFR Free and are RoHS
Compliant
Figure 1. Logic Symbol
YA 1
IEEC / IEC
7Z14T
B6, 7Z14, Z14 = Specific Device Code
KK = 2Digit Lot Run Traceability Code
XY = 2Digit Date Code Format
Z = Assembly Plant Code
T = Die Run Code
= Year Coding Scheme
= Plant Code Identifier
= EightWeek Datacoding Scheme
See detailed ordering, marking and shipping information in the
package dimensions section on page 5 of this data sheet.
ORDERING INFORMATION
MARKING
DIAGRAMS
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SC88A
CASE 419AC01
SIP6
CASE 127EB
UDFN6
CASE 517DP
B6KK
XYZ
B6KK
XYZ
Z14T
Pin 1
Pin 1
SC74A
CASE 318BQ
II [[491 EU I 3: ED www.cnsemi.com
NC7SZ14
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2
Pin Configurations
NC
A
VCC
GND Y
1
2
3
5
4
Figure 2. SC88A and SC74A (Top View)
NC 1 6 VCC
A 2 5 NC
GND 3 4 Y
Figure 3. MicroPak (Top Through View)
PIN DEFINITIONS
Pin # SC88A /
SC74A Pin # MicroPak Name Description
11, 5 NC No Connect
2 2 A Input
3 3 GND Ground
4 4 Y Output
5 6 VCC Supply Voltage
FUNCTION TABLE (Y = /A)
Inputs Output
A Y
L H
H L
H = HIGH Logic Level
L = LOW Logic Level
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Min Max Unit
VCC Supply Voltage 0.5 6.0 V
VIN DC Input Voltage 0.5 6.0 V
VOUT DC Output Voltage 0.5 6.0 V
IIK DC Input Diode Current VIN < 0.5 V − −50 mA
VIN > 6.0 V +20
IOK DC Output Diode Current VOUT < 0.5 V − −50 mA
VOUT > 6.0 V, VCC = GND +20
IOUT DC Output Current ±50 mA
ICC or IGND DC VCC or Ground Current ±50 mA
TSTG Storage Temperature Range 65 +150 °C
TJJunction Temperature Under Bias +150 °C
TLJunction Lead Temperature (Soldering, 10 Seconds) +260 °C
PDPower Dissipation in Still Air SC74A 225 mW
SC88A5190
MicroPak6327
MicroPak26327
ESD Human Body Model, JEDEC: JESD22A114 4000 V
Charge Device Model, JEDEC: JESD22C101 2000
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
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3
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Conditions Min Max Unit
VCC Supply Voltage Operating 1.65 5.50 V
Supply Voltage Data Retention 1.5 5.5
VIN Input Voltage 0 5.5 V
VOUT Output Voltage 0 VCC V
TAOperating Temperature 40 +85 °C
qJA Thermal Resistance SC74A 555 °C/W
SC88A5659
MicroPak6382
MicroPak26382
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
1. Unused inputs must be held HIGH or LOW. They may not float.
DC ELECTICAL CHARACTERISTICS
Symbol Parameter VCC (V) Conditions
TA = +25°C TA = 40 to +85°C
Unit
Min Typ Max Min Max
VP Positive Threshold Voltage 1.65 1.00 1.40 1.40 V
1.80 1.10 1.50 1.50
2.30 1.40 1.80 1.80
3.00 1.75 2.20 2.20
4.50 2.45 3.10 3.10
5.50 2.90 3.60 3.60
VN Negative Threshold Voltage 1.65 0.20 0.50 0.20 V
1.80 0.25 0.55 0.25
2.30 0.40 0.75 0.40
3.00 0.60 1.00 0.60
4.50 1.00 1.43 1.00
5.50 1.20 1.70 1.20
VH Hysteresis Voltage 1.65 0.10 0.48 0.90 0.10 0.90 V
1.80 0.15 0.54 1.00 0.15 1.00
2.30 0.25 0.65 1.10 0.25 1.10
3.00 0.40 0.77 1.20 0.40 1.20
4.50 0.60 1.01 1.50 0.60 1.50
5.50 0.70 1.18 1.70 0.70 1.70
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4
DC ELECTICAL CHARACTERISTICS (continued)
Symbol Unit
TA = 40 to +85°CTA = +25°C
ConditionsVCC (V)ParameterSymbol Unit
MaxMinMaxTypMin
ConditionsVCC (V)Parameter
VOH HIGH Level Output Voltage 1.65 VIN = VIL,
IOH = 100 mA
1.55 1.65 1.55 V
1.80 1.70 1.80 1.70
2.30 2.20 2.30 2.20
3.00 2.90 3.00 2.90
4.50 4.40 4.50 4.40
1.65 IOH = 4 mA 1.29 1.52 1.29
2.30 IOH = 8 mA 1.90 2.15 1.90
3.00 IOH = 16 mA 2.40 2.80 2.40
3.00 IOH = 24 mA 2.30 2.68 2.30
4.50 IOH = 32 mA 3.80 4.20 3.80
VOL LOW Level Output Voltage 1.65 VIN = VIH,
IOL = 100 mA
0.00 0.10 0.10 V
1.80 0.00 0.10 0.10
2.30 0.00 0.10 0.10
3.00 0.00 0.10 0.10
4.50 0.00 0.10 0.10
1.65 IOL = 4 mA 0.08 0.24 0.24
2.30 IOL = 8 mA 0.10 0.30 0.30
3.00 IOL = 16 mA 0.15 0.40 0.40
3.00 IOL = 24 mA 0.22 0.55 0.55
4.50 IOL = 32 mA 0.22 0.55 0.55
IIN Input Leakage Current 1.65 to 5.5 VIN = 5.5 V, GND ±0.1 ±1.0 mA
IOFF Power Off Leakage Current 0 VIN or VOUT = 5.5 V − − 110 mA
ICC Quiescent Supply Current 1.65 to 5.50 VIN = 5.5 V, GND 1.0 10 mA
AC ELECTRICAL CHARACTERISTICS
Symbol Parameter VCC (V) Conditions
TA = +25°C TA = 40 to +85°C
Unit
Min Typ Max Min Max
tPLH, tPHL Propagation Delay
(Figure 4, 5)
1.65 CL = 15 pF,
RL = 1 MW
9.1 15.0 15.6 ns
1.80 7.6 12.5 13.0
2.50 ±0.20 5.0 9.0 9.5
3.30 ±0.30 3.7 6.3 6.5
5.00 ±0.50 3.1 5.2 5.5
3.30 ±0.30 CL = 50 pF,
RL = 500 W
4.4 7.2 7.5
5.00 ±0.50 3.7 5.9 6.2
CIN Input Capacitance 0.00 4 pF
CPD Power Dissipation Capacitance
(Note 2) (Figure 6)
3.30 24 pF
5.00 30 − −
2. CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (ICCD) at
no output loading and operating at 50% duty cycle. CPD is related to ICCD dynamic operating current by the expression:
ICCD = (CPD) (VCC) (fIN) + (ICCstatic).
NC7SZ14
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5
Figure 4. AC Test Circuit Figure 5. AC Waveforms
NOTE:
3. Input = AC Waveform; tr = tf = 1.8 ns;
PRR = 10 MHz; Duty Cycle = 50%.
A
INPUT
VCC
Figure 6. ICCD Test Circuit
VCC
CLRL
INPUT OUTPUT
NOTE:
4. CL includes load and stray capacitance;
Input PRR = 1.0 MHz; tW = 500 ns
tr = 3 ns
50%
50%
90%
10%
90%
10%
INPUT
OUTPUT
tf = 3 ns
VCC
GND
VOH
VOL
50%
50%
tPLH tPHL
TW
ORDERING INFORMATION
Part Number Top Mark Operating Temperature Packages Shipping
NC7SZ14M5X 7Z14 40 to +85°CSC74A 3000 / Tape & Reel
NC7SZ14P5X Z14 40 to +85°CSC88A 3000 / Tape & Reel
NC7SZ14L6X B6 40 to +85°C MicroPak 5000 / Tape & Reel
NC7SZ14FHX B6 40 to +85°C MicroPak2 5000 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
2x 5- C (1) ,_‘ [.(0254) EIE 58:9 7' E E T T - I I PIN fiENTIFIERJ w 0. 50:0. 05 j (030) PIN ’I 6X 0'05 RECOMMENED I _I: 000 LAND PATTERN E I Q 0'05 C 0.35:0.05 1.45:0.05 DETAILA W — 0.20:0.05 6X \ ‘4‘ a} o.1o® c BIAI / I o.os® c K :I III __ 7 0.30:0.05 5x 1. 00:0. 05 4F I 7 : I __ 0.40:0.05 — i 0.35:0.05 5x DETAM 41— I ——__ ' gflffléggo PIN ‘I TERMINAL (.0050) I—I—I» hams) 6x 4x BOTTOM VIEW NOTES 1 CONFORMS TO JEDEC STANDARD M0-252 VARIATION UAAD Z DIMENSIONS ARE IN MILLIMETERS DRAWING CONFORMS TO ASME VI4.5M-2009 APIN ONE IDENTIFIER IS 2X LENGTH OF ANY OTHER LINE IN THE MARK CODE LAYOUT. www.0nse
NC7SZ14
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6
PACKAGE DIMENSIONS
SIP6 1.45X1.0
CASE 127EB
ISSUE O
V F M D TOP VIEW iA @ I SEATING SIDE VIEW PLANE RECOM SOLDERING FOOTPRINT" 0.95 PITCH \ ,,L , \ 5x ‘ ‘ 1.007 "For addmonal mformamn on our Pb-Free sllalegy and somermg delafls‘ p‘ease download the ON Semiconduclov Soldenng and Moummg Techmques Reference Manua‘, SOLDERRM/D. www.cnsemi.com 7 TES D‘MENS‘ON‘N wow. um CONTROLLING D‘MENS‘ON MAxqu LEAD mucmas TH‘CKNESS M‘N‘MUM LEA M‘N‘MuM mucmass o; D‘MENS‘ONS A AND a DO FLASH Pnomusms. FLASH Fnomusms EXCEEDO‘SFERS‘DE mumsrzns DIM MIN MAX A 090 Me Al um nm b 025 use e um n25 n z 250 am: a 2 095830 L 020 \ use M 0° \ m”
NC7SZ14
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PACKAGE DIMENSIONS
SC74A
CASE 318BQ
ISSUE B
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE.
DIM MIN MAX
MILLIMETERS
D
E1
A0.90 1.10
b0.25 0.50
e0.95 BSC
A1 0.01 0.10
c0.10 0.26
L0.20 0.60
M0 10
E2.50 3.00
123
54
E
D
E1
b
A
c
__
0.20
5X
CAB
CSEATING
PLANE
L
M
DETAIL A
TOP VIEW
SIDE VIEW
A
B
END VIEW
1.35 1.65
2.85 3.15
2.40
0.70
5X
DIMENSIONS: MILLIMETERS
RECOMMENDED
0.95
PITCH
1.00
5X
e
A1
0.05
DETAIL A
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8
PACKAGE DIMENSIONS
SC88A (SC70 5 Lead), 1.25x2
CASE 419AC01
ISSUE A
E1
D
A
L
L1 L2
ee
bA1
A2
c
TOP VIEW
SIDE VIEW END VIEW
q1
q1
Notes:
(1) All dimensions are in millimeters. Angles in degrees.
(2) Complies with JEDEC MO-203.
E
q
SYMBOL MIN NOM MAX
θ
A
A1
b
c
D
E
E1
e
L
0º 8º
L2
0.00
0.15
0.10
0.26
1.80
1.80
1.15
0.65 BSC
0.15 BSC
1.10
0.10
0.30
0.18
0.46
2.20
2.40
1.35
L1
0.80
θ1 4º 10º
A2 0.80 1.00
0.42 REF
0.36
2.00
2.10
1.25
kmooxoosoar—I PIN 1 MIN 250uM 1.00:0.050 \ - Q 0.05 0 TOP VIEW IZX—I—I—I RECOMMENDED LAND PATTERN FOR SPACE CONSTRAINED PCB // 0.05 C I 0.50:0.05 :I :I I: I SIDE VIEW (0.08) 4x a .— 6X 0.14:0.05 DETAILA 1 5X ”I I<— 0.20="" 6x="" alternative="" land="" pattern="" for="" universal="" application="" £(005)="" ex="" 0.10®="" c="" b="" a="" i="" .05="" c="" 03020.05="" 4="" 0.60i—="" 0.35="" i="" (0.00)="" 4x="" bottom="" view="" notes="" a.="" complies="" to="" jedec="" m07252="" standard="" b="" dimensions="" are="" in="" millimeters.="" c="" dimensions="" and="" tolerances="" per="" asme="" yia.5mi="" 2009="" www.cnsemi.com="" 0.35:0.050="" 0.075x45°="" detail="" a="" chamfer="" pin="" 1="" lead="" scale:="" 2x="">
NC7SZ14
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9
PACKAGE DIMENSIONS
UDFN6 1.0X1.0, 0.35P
CASE 517DP
ISSUE O
a a e Mademavks m Semxcunduclm Cnmpnnems In "sine \ghlsmanumhernlpalems \rademavks Dav www mm cumrsuerguwaxem Mavkmg gm
NC7SZ14
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10
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Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
NC7SZ14/D
MicroPak and MicroPak2 are trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other
countries.
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