TJA1051 Datasheet by NXP USA Inc.

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1. General description
The TJA1051 is a high-speed CAN transceiver that provides an interface between a
Controller Area Network (CAN) protocol controller and the physical two-wire CAN bus.
The transceiver is designed for high-speed CAN applications in the automotive industry,
providing differential transmit and receive capability to (a microcontroller with) a CAN
protocol controller.
The TJA1051 belongs to the third generation of high-speed CAN transceivers from NXP
Semiconductors, offering significant improvements over first- and second-generation
devices such as the TJA1050. It offers improved ElectroMagnetic Compatibility (EMC)
and ElectroStatic Discharge (ESD) performance, and also features:
Ideal passive behavior to the CAN bus when the supply voltage is off
TJA1051T/3 and TJA1051TK/3 can be interfaced directly to microcontrollers with
supply voltages from 3Vto5V
The TJA1051 implements the CAN physical layer as defined in ISO 11898-2:2016 and
SAE J2284-1 to SAE J2284-5. This implementation enables reliable communication in the
CAN FD fast phase at data rates up to 5 Mbit/s.
These features make the TJA1051 an excellent choice for all types of HS-CAN networks,
in nodes that do not require a standby mode with wake-up capability via the bus.
2. Features and benefits
2.1 General
ISO 11898-2:2016 and SAE J2284-1 to SAE J2284-5 compliant
Timing guaranteed for data rates up to 5 Mbit/s in the CAN FD fast phase
Suitable for 12 V and 24 V systems
Low ElectroMagnetic Emission (EME) and high ElectroMagnetic Immunity (EMI)
VIO input on TJA1051T/3 and TJA1051TK/3 allows for direct interfacing with 3 V to 5 V
microcontrollers (available in SO8 and very small HVSON8 packages respectively)
EN input on TJA1051T/E allows the microcontroller to switch the transceiver to a very
low-current Off mode
Available in SO8 package or leadless HVSON8 package (3.0 mm 3.0 mm) with
improved Automated Optical Inspection (AOI) capability
Dark green product (halogen free and Restriction of Hazardous Substances (RoHS)
compliant)
AEC-Q100 qualified
TJA1051
High-speed CAN transceiver
Rev. 9 — 28 November 2017 Product data sheet
TJA1051 All information provided in this document is subject to legal disclaimers. © NXP N.V. 2017. All rights reserved.
Product data sheet Rev. 9 — 28 November 2017 2 of 25
NXP Semiconductors TJA1051
High-speed CAN transceiver
2.2 Low-power management
Functional behavior predictable under all supply conditions
Transceiver disengages from the bus when not powered up (zero load)
2.3 Protection
High ElectroStatic Discharge (ESD) handling capability on the bus pins
Bus pins protected against transients in automotive environments
Transmit Data (TXD) dominant time-out function
Undervoltage detection on pins VCC and VIO
Thermally protected
3. Quick reference data
4. Ordering information
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
VCC supply voltage 4.5 - 5.5 V
VIO supply voltage on pin VIO 2.8 - 5.5 V
Vuvd(VCC) undervoltage detection
voltage on pin VCC
3.5 - 4.5 V
Vuvd(VIO) undervoltage detection
voltage on pin VIO
1.3 2.0 2.7 V
ICC supply current Silent mode 0.1 1 2.5 mA
Normal mode; bus
recessive 2.5 5 10 mA
Normal mode; bus
dominant 20 50 70 mA
IIO supply current on pin VIO Normal/Silent mode
recessive; VTXD =V
IO - 80 250 A
dominant; VTXD = 0 V - 350 500 A
VESD electrostatic discharge
voltage IEC 61000-4-2 at pins
CANH and CANL
8- +8kV
VCANH voltage on pin CANH 58 - +58 V
VCANL voltage on pin CANL 58 - +58 V
Tvj virtual junction temperature 40 - +150 C
Table 2. Ordering information
Type number Package
Name Description Version
TJA1051T SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
SZ 2:
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Product data sheet Rev. 9 — 28 November 2017 3 of 25
NXP Semiconductors TJA1051
High-speed CAN transceiver
[1] TJA1051T/3 and TJA1051TK/3 with VIO pin; TJA1051T/E with EN pin.
5. Block diagram
TJA1051T/3[1] SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
TJA1051T/E[1] SO8 plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
TJA1051TK/3[1] HVSON8 plastic thermal enhanced very thin small outline package; no leads;
8 terminals; body 3 3 0.85 mm SOT782-1
Table 2. Ordering informationcontinued
Type number Package
Name Description Version
(1) In a transceiver without a VIO pin, the VIO input is internally connected to VCC.
(2) Only present in the TJA1051T/E.
Fig 1. Block diagram
TEMPERATURE
PROTECTION
TIME-OUT
MODE
CONTROL
DRIVER
TXD 1
VI/O(1)
S8
EN(2) 5
RXD 4
SLOPE
CONTROL
AND
DRIVER
VCC
CANH
CANL
7
6
53
2
GND
TJA1051
015aaa036
VCC
VIO(1)
Hflflfl LIULIU 1715335225 flflflfl UUUU msmm Hflflfl LIULIU m 015335221 L‘JLwJUL-J flF-fiflfl Transparent top view
TJA1051 All information provided in this document is subject to legal disclaimers. © NXP N.V. 2017. All rights reserved.
Product data sheet Rev. 9 — 28 November 2017 4 of 25
NXP Semiconductors TJA1051
High-speed CAN transceiver
6. Pinning information
6.1 Pinning
6.2 Pin description
[1] HVSON8 package die supply ground is connected to both the GND pin and the exposed center pad. The
GND pin must be soldered to board ground. For enhanced thermal and electrical performance, it is
recommended that the exposed center pad also be soldered to board ground.
a. TJA1051T: SO8 b. TJA1051T/E: SO8
c. TJA1051T/3: SO8 d. TJA1051TK/3: HVSON8
Fig 2. Pin configuration diagrams
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Table 3. Pin description
Symbol Pin Description
TXD 1 transmit data input
GND[1] 2 ground
VCC 3 supply voltage
RXD 4 receive data output; reads out data from the bus lines
n.c. 5 not connected; in TJA1051T version
EN 5 enable control input; TJA1051T/E only
VIO 5 supply voltage for I/O level adapter; TJA1051T/3 and TJA1051TK/3 only
CANL 6 LOW-level CAN bus line
CANH 7 HIGH-level CAN bus line
S 8 Silent mode control input
e Table 4 Figure 1
TJA1051 All information provided in this document is subject to legal disclaimers. © NXP N.V. 2017. All rights reserved.
Product data sheet Rev. 9 — 28 November 2017 5 of 25
NXP Semiconductors TJA1051
High-speed CAN transceiver
7. Functional description
The TJA1051 is a high-speed CAN stand-alone transceiver with Silent mode. It combines
the functionality of the TJA1050 transceiver with improved EMC and ESD handling
capability. Improved slope control and high DC handling capability on the bus pins
provides additional application flexibility.
The TJA1051 is available in three versions, distinguished only by the function of pin 5:
The TJA1051T is backwards compatible with the TJA1050
The TJA1051T/3 and TJA1051TK/3 allow for direct interfacing to microcontrollers with
supply voltages down to 3 V
The TJA1051T/E allows the transceiver to be switched to a very low-current Off
mode.
7.1 Operating modes
The TJA1051 supports two operating modes, Normal and Silent, which are selected via
pin S. An additional Off mode is supported in the TJA1051T/E via pin EN. See Table 4 for
a description of the operating modes under normal supply conditions.
[1] Only available on the TJA1051T/E.
[2] LOW if the CAN bus is dominant, HIGH if the CAN bus is recessive.
[3] ‘X’ = don’t care.
7.1.1 Normal mode
A LOW level on pin S selects Normal mode. In this mode, the transceiver is able to
transmit and receive data via the bus lines CANH and CANL (see Figure 1 for the block
diagram). The differential receiver converts the analog data on the bus lines into digital
data which is output to pin RXD. The slopes of the output signals on the bus lines are
controlled internally and are optimized in a way that guarantees the lowest possible
ElectroMagnetic Emission (EME).
7.1.2 Silent mode
A HIGH level on pin S selects Silent mode. In Silent mode the transmitter is disabled,
releasing the bus pins to recessive state. All other IC functions, including the receiver,
continue to operate as in Normal mode. Silent mode can be used to prevent a faulty CAN
controller from disrupting all network communications.
Table 4. Operating modes
Mode Inputs Outputs
Pin EN[1] Pin S Pin TXD CAN driver Pin RXD
Normal HIGH LOW LOW dominant active[2]
HIGH LOW HIGH recessive active[2]
Silent HIGH HIGH X[3] recessive active[2]
Off[1] LOW X[3] X[3] floating floating
Table 7 Figure 6
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Product data sheet Rev. 9 — 28 November 2017 6 of 25
NXP Semiconductors TJA1051
High-speed CAN transceiver
7.1.3 Off mode
A LOW level on pin EN of TJA1051T/E selects Off mode. In Off mode the entire
transceiver is disabled, allowing the microcontroller to save power when CAN
communication is not required. The bus pins are floating in Off mode, making the
transceiver invisible to the rest of the network.
7.2 Fail-safe features
7.2.1 TXD dominant time-out function
A ‘TXD dominant time-out’ timer is started when pin TXD is set LOW. If the LOW state on
pin TXD persists for longer than tto(dom)TXD, the transmitter is disabled, releasing the bus
lines to recessive state. This function prevents a hardware and/or software application
failure from driving the bus lines to a permanent dominant state (blocking all network
communications). The TXD dominant time-out timer is reset when pin TXD is set HIGH.
The TXD dominant time-out time also defines the minimum possible bit rate of 20 kbit/s.
7.2.2 Internal biasing of TXD, S and EN input pins
Pin TXD has an internal pull-up to VIO and pins S and EN (TJA1051T/E) have internal
pull-downs to GND. This ensures a safe, defined state in case one or more of these pins
is left floating.
7.2.3 Undervoltage detection on pins VCC and VIO
Should VCC or VIO drop below their respective undervoltage detection levels (Vuvd(VCC)
and Vuvd (VIO); see Table 7), the transceiver will switch off and disengage from the bus
(zero load) until VCC and VIO have recovered.
7.2.4 Overtemperature protection
The output drivers are protected against overtemperature conditions. If the virtual junction
temperature exceeds the shutdown junction temperature, Tj(sd), the output drivers will be
disabled until the virtual junction temperature falls below Tj(sd) and TXD becomes
recessive again. Including the TXD condition ensures that output driver oscillations due to
temperature drift are avoided.
7.3 VIO supply pin
There are three versions of the TJA1051 available, only differing in the function of a single
pin. Pin 5 is either an enable control input (EN), a VIO supply pin or is not connected.
Pin VIO on the TJA1051T/3 and TJA1051TK/3 should be connected to the microcontroller
supply voltage (see Figure 6). This will adjust the signal levels of pins TXD, RXD and S to
the I/O levels of the microcontroller. For versions of the TJA1051 without a VIO pin, the VIO
input is internally connected to VCC. This sets the signal levels of pins TXD, RXD and S to
levels compatible with 5 V microcontrollers.
TJA1051 All information provided in this document is subject to legal disclaimers. © NXP N.V. 2017. All rights reserved.
Product data sheet Rev. 9 — 28 November 2017 7 of 25
NXP Semiconductors TJA1051
High-speed CAN transceiver
8. Limiting values
[1] The device can sustain voltages up to the specified values over the product lifetime, provided applied voltages (including transients)
never exceed these values.
[2] According to IEC TS 62228 (2007), Section 4.2.4; parameters for standard pulses defined in ISO7637 part 2: 2004-06.
[3] According to IEC TS 62228 (2007), Section 4.3; DIN EN 61000-4-2.
[4] According to AEC-Q100-002.
[5] According to AEC-Q100-003.
[6] AEC-Q100-011 Rev-C1. The classification level is C4B.
[7] In accordance with IEC 60747-1. An alternative definition of virtual junction temperature is: Tvj =T
amb +PRth(vj-a), where Rth(vj-a) is a
fixed value to be used for the calculation of Tvj. The rating for Tvj limits the allowable combinations of power dissipation (P) and ambient
temperature (Tamb).
9. Thermal characteristics
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are referenced to GND.
Symbol Parameter Conditions Min Max Unit
Vxvoltage on pin x[1] on pins CANH, CANL 58 +58 V
on any other pin 0.3 +7 V
V(CANH-CANL) voltage between pin CANH
and pin CANL
27 +27 V
Vtrt transient voltage on pins CANH, CANL [2]
pulse 1 100 - V
pulse 2a - 75 V
pulse 3a 150 - V
pulse 3b - 100 V
VESD electrostatic discharge voltage IEC 61000-4-2 (150 pF, 330 )[3]
at pins CANH and CANL 8+8 kV
Human Body Model (HBM); 100 pF, 1.5 k[4]
at pins CANH and CANL 8+8 kV
at any other pin 4+4 kV
Machine Model (MM); 200 pF, 0.75 H, 10 [5]
at any pin 300 +300 V
Charged Device Model (CDM); field Induced
charge; 4 pF
[6]
at corner pins 750 +750 V
at any pin 500 +500 V
Tvj virtual junction temperature [7] 40 +150 C
Tstg storage temperature 55 +150 C
Table 6. Thermal characteristics
According to IEC 60747-1.
Symbol Parameter Conditions Value Unit
Rth(vj-a) thermal resistance from virtual junction to ambient SO8 package; in free air 155 K/W
HVSON8 package; in free air 55 K/W
TJA1051 All information provided in this document is subject to legal disclaimers. © NXP N.V. 2017. All rights reserved.
Product data sheet Rev. 9 — 28 November 2017 8 of 25
NXP Semiconductors TJA1051
High-speed CAN transceiver
10. Static characteristics
Table 7. Static characteristics
Tvj =
40
C to +150
C; VCC = 4.5 V to 5.5 V; VIO = 2.8 V to 5.5 V[1]; RL=60
unless specified otherwise; All voltages are
defined with respect to ground; Positive currents flow into the IC[2].
Symbol Parameter Conditions Min Typ Max Unit
Supply; pin VCC
VCC supply voltage 4.5 - 5.5 V
ICC supply current Off mode (TJA1051T/E) 1 5 8 A
Silent mode 0.1 1 2.5 mA
Normal mode
recessive; VTXD =VIO[3] -510mA
dominant; VTXD = 0 V - 50 70 mA
dominant; VTXD =0V;
short circuit on bus lines;
3V VCANH = VCANL) +18 V
2.5 80 110 mA
Vuvd(VCC) undervoltage detection
voltage on pin VCC
3.5 - 4.5 V
I/O level adapter supply; pin VIO[1]
VIO supply voltage on pin VIO 2.8 - 5.5 V
IIO supply current on pin VIO Normal/Silent mode
recessive; VTXD =V
IO[3] -80250A
dominant; VTXD =0V - 350 500 A
Vuvd(VIO) undervoltage detection
voltage on pin VIO
1.3 2.0 2.7 V
Mode control inputs; pins S and EN[4]
VIH HIGH-level input voltage [5] 0.7VIO[3] -V
IO +0.3
[3] V
VIL LOW-level input voltage 0.3 - 0.3VIO[3] V
IIH HIGH-level input current VS=V
IO; VEN =V
IO[3] 1410A
IIL LOW-level input current VS=0V; V
EN =0 V 10+1 A
CAN transmit data input; pin TXD
VIH HIGH-level input voltage [5] 0.7VIO[3] -V
IO +0.3
[3] V
VIL LOW-level input voltage 0.3 - +0.3VIO[3] V
IIH HIGH-level input current VTXD =V
IO[3] 50+5 A
IIL LOW-level input current Normal mode; VTXD =0V 260 150 30 A
Ciinput capacitance [6] -510pF
CAN receive data output; pin RXD
IOH HIGH-level output current VRXD =V
IO 0.4 V[3] 831mA
IOL LOW-level output current VRXD = 0.4 V; bus dominant 2 5 12 mA
Bus lines; pins CANH and CANL
VO(dom) dominant output voltage VTXD =0V; t<t
to(dom)TXD
pin CANH; RL=50 to 65 2.75 3.5 4.5 V
pin CANL; RL=50 to 65 0.5 1.5 2.25 V
Vdom(TX)sym transmitter dominant voltage
symmetry Vdom(TX)sym = VCC VCANH VCANL 400 - +400 mV
IC,
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Product data sheet Rev. 9 — 28 November 2017 9 of 25
NXP Semiconductors TJA1051
High-speed CAN transceiver
VTXsym transmitter voltage symmetry VTXsym = VCANH +V
CANL;
fTXD = 250 kHz, 1 MHz and 2.5 MHz;
VCC = 4.75 V to 5.25 V;
CSPLIT =4.7nF
[6]
[7] 0.9VCC -1.1V
CC V
VO(dif) differential output voltage dominant: Normal mode; VTXD =0V;
t<t
to(dom)TXD; VCC = 4.75 V to 5.25 V
RL=45to 65 1.5 - 3 V
RL=45to 70 1.5 - 3.3 V
RL=22401.5 - 5 V
recessive; no load
Normal mode: VTXD =V
IO[3] 50 - +50 mV
VO(rec) recessive output voltage Normal/Silent mode; VTXD =V
IO[3];
no load 20.5V
CC 3V
Vth(RX)dif differential receiver threshold
voltage Normal/Silent mode;
30 V VCANL +30 V;
30 V VCANH +30 V
0.5 0.7 0.9 V
Vrec(RX) receiver recessive voltage Normal/Silent mode;
30 V VCANL +30 V;
30 V VCANH +30 V
4-0.5 V
Vdom(RX) receiver dominant voltage Normal/Silent mode;
30 V VCANL +30 V;
30 V VCANH +30 V
0.9 - 9.0 V
Vhys(RX)dif differential receiver
hysteresis voltage Normal/Silent mode;
30 V VCANL +30 V;
30 V VCANH +30 V
50 120 200 mV
IO(sc)dom dominant short-circuit output
current VTXD =0V; t<t
to(dom)TXD; VCC =5 V
pin CANH; VCANH =15 V to
+40 V
100 70 40 mA
pin CANL; VCANL =15 V to +40 V 40 70 100 mA
IO(sc)rec recessive short-circuit output
current Normal/Silent mode; VTXD =V
IO[3];
VCANH =V
CANL =27 V to +32 V
5-+5 mA
ILleakage current VCC =V
IO =0V or V
CC =V
IO =
shorted to ground via 47 k;
VCANH =V
CANL =5V
50+5 A
Riinput resistance 2V VCANL +7 V;
2V VCANH +7 V
[6] 91528k
Riinput resistance deviation 0 V VCANL +5 V;
0V VCANH +5 V
[6] 1-+1 %
Ri(dif) differential input resistance 2V VCANL +7 V;
2V VCANH +7 V
[6] 19 30 52 k
Ci(cm) common-mode input
capacitance
[6] --20pF
Table 7. Static characteristics …continued
Tvj =
40
C to +150
C; VCC = 4.5 V to 5.5 V; VIO = 2.8 V to 5.5 V[1]; RL=60
unless specified otherwise; All voltages are
defined with respect to ground; Positive currents flow into the IC[2].
Symbol Parameter Conditions Min Typ Max Unit
IC, Figure 7 Figure 3
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Product data sheet Rev. 9 — 28 November 2017 10 of 25
NXP Semiconductors TJA1051
High-speed CAN transceiver
[1] Only TJA1051T/3 and TJA1051TK/3 have a VIO pin. In transceivers without a VIO pin, the VIO input is internally connected to VCC.
[2] All parameters are guaranteed over the virtual junction temperature range by design. Factory testing uses correlated test conditions to
cover the specified temperature and power supply voltage range.
[3] VIO =V
CC for the non-VIO product variants TJA1051T(/E)
[4] Only TJA1051T/E has an EN pin.
[5] Maximum value assumes VCC <V
IO; if VCC >V
IO, the maximum value will be VCC + 0.3 V.
[6] Not tested in production; guaranteed by design.
[7] The test circuit used to measure the bus output voltage symmetry (which includes CSPLIT) is shown in Figure 8.
11. Dynamic characteristics
[1] Only TJA1051T/3 and TJA1051TK/3 have a VIO pin. In transceivers without a VIO pin, the VIO input is internally connected to VCC.
[2] All parameters are guaranteed over the virtual junction temperature range by design. Factory testing uses correlated test conditions to
cover the specified temperature and power supply voltage range.
Ci(dif) differential input capacitance [6] --10pF
Temperature protection
Tj(sd) shutdown junction
temperature
[6] -190- C
Table 7. Static characteristics …continued
Tvj =
40
C to +150
C; VCC = 4.5 V to 5.5 V; VIO = 2.8 V to 5.5 V[1]; RL=60
unless specified otherwise; All voltages are
defined with respect to ground; Positive currents flow into the IC[2].
Symbol Parameter Conditions Min Typ Max Unit
Table 8. Dynamic characteristics
Tvj =
40
C to +150
C; VCC = 4.5 V to 5.5 V; VIO = 2.8 V to 5.5 V[1]; RL=60
unless specified otherwise. All voltages are
defined with respect to ground. Positive currents flow into the IC.[2]
Symbol Parameter Conditions Min Typ Max Unit
Transceiver timing; pins CANH, CANL, TXD and RXD; see Figure 7 and Figure 3
td(TXD-busdom) delay time from TXD to bus dominant Normal mode - 65 - ns
td(TXD-busrec) delay time from TXD to bus recessive Normal mode - 90 - ns
td(busdom-RXD) delay time from bus dominant to RXD Normal/Silent mode - 60 - ns
td(busrec-RXD) delay time from bus recessive to RXD Normal/Silent mode - 65 - ns
td(TXDL-RXDL) delay time from TXD LOW to RXD LOW Normal mode: versions
with VIO pin 40 - 250 ns
Normal mode: other
versions 40 - 220 ns
td(TXDH-RXDH) delay time from TXD HIGH to RXD HIGH Normal mode: versions
with VIO pin 40 - 250 ns
Normal mode: other
versions 40 - 220 ns
tbit(bus) transmitted recessive bit width tbit(TXD) = 500 ns [3] 435 - 530 ns
tbit(TXD) = 200 ns [3] 155 - 210 ns
tbit(RXD) bit time on pin RXD tbit(TXD) = 500 ns [3] 400 - 550 ns
tbit(TXD) = 200 ns [3] 120 - 220 ns
trec receiver timing symmetry tbit(TXD) = 500 ns 65 - +40 ns
tbit(TXD) = 200 ns 45 - +15 ns
tto(dom)TXD TXD dominant time-out time VTXD = 0 V; Normal mode [4] 0.3 1 5 ms
"l (7/ WW
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Product data sheet Rev. 9 — 28 November 2017 11 of 25
NXP Semiconductors TJA1051
High-speed CAN transceiver
[3] See Figure 4.
[4] Minimum value of 0.8ms required according to SAE J2284; 0.3ms is allowed according to ISO11898-2:2016 for legacy devices.
Fig 3. CAN transceiver timing diagram
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TJA1051 All information provided in this document is subject to legal disclaimers. © NXP N.V. 2017. All rights reserved.
Product data sheet Rev. 9 — 28 November 2017 12 of 25
NXP Semiconductors TJA1051
High-speed CAN transceiver
12. Application information
12.1 Application diagrams
Fig 4. CAN FD timing definitions according to ISO 11898-2:2016
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TJA1051 All information provided in this document is subject to legal disclaimers. © NXP N.V. 2017. All rights reserved.
Product data sheet Rev. 9 — 28 November 2017 13 of 25
NXP Semiconductors TJA1051
High-speed CAN transceiver
12.2 Application hints
Further information on the application of the TJA1051 can be found in NXP application
hints AH1014 Application Hints - Standalone high speed CAN transceiver
TJA1042/TJA1043/TJA1048/TJA1051.
13. Test information
(1) Optional, depends on regulator.
Fig 6. Typical application of the TJA1051T/3 or TJA1051TK/3.
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inputs are connected to pin VCC.
Fig 7. Timing test circuit for CAN transceiver
TJA1051
GND
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S
100 nF47 μF
+5 V
TXD
RXD
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CANL
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RL100 pF
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TJA1051 All information provided in this document is subject to legal disclaimers. © NXP N.V. 2017. All rights reserved.
Product data sheet Rev. 9 — 28 November 2017 14 of 25
NXP Semiconductors TJA1051
High-speed CAN transceiver
13.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q100 Rev-G - Failure mechanism based stress test qualification for
integrated circuits, and is suitable for use in automotive applications.
Fig 8. Test circuit for measuring transceiver driver symmetry
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TJA1051 All information provided in this document is subject to legal disclaimers. © NXP N.V. 2017. All rights reserved.
Product data sheet Rev. 9 — 28 November 2017 15 of 25
NXP Semiconductors TJA1051
High-speed CAN transceiver
14. Package outline
Fig 9. Package outline SOT96-1 (SO8)
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TJA1051 All information provided in this document is subject to legal disclaimers. © NXP N.V. 2017. All rights reserved.
Product data sheet Rev. 9 — 28 November 2017 16 of 25
NXP Semiconductors TJA1051
High-speed CAN transceiver
Fig 10. Package outline SOT782-1 (HVSON8)
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TJA1051 All information provided in this document is subject to legal disclaimers. © NXP N.V. 2017. All rights reserved.
Product data sheet Rev. 9 — 28 November 2017 17 of 25
NXP Semiconductors TJA1051
High-speed CAN transceiver
15. Handling information
All input and output pins are protected against ElectroStatic Discharge (ESD) under
normal handling. When handling ensure that the appropriate precautions are taken as
described in JESD625-A or equivalent standards.
16. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
16.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
16.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
Through-hole components
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
16.3 Wave soldering
Key characteristics in wave soldering are:
Figure 11 Table 9 10 Figure 11
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Product data sheet Rev. 9 — 28 November 2017 18 of 25
NXP Semiconductors TJA1051
High-speed CAN transceiver
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
16.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 11) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 9 and 10
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 11.
Table 9. SnPb eutectic process (from J-STD-020D)
Package thickness (mm) Package reflow temperature (C)
Volume (mm3)
< 350 350
< 2.5 235 220
2.5 220 220
Table 10. Lead-free process (from J-STD-020D)
Package thickness (mm) Package reflow temperature (C)
Volume (mm3)
< 350 350 to 2000 > 2000
< 1.6 260 260 260
1.6 to 2.5 260 250 245
> 2.5 250 245 245
mamum peak hamperature = MSL hymn damage \eve\ mmmum peak |emperature = mwmmum soldenng |emperamre W
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Product data sheet Rev. 9 — 28 November 2017 19 of 25
NXP Semiconductors TJA1051
High-speed CAN transceiver
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
17. Soldering of HVSON packages
Section 17 contains a brief introduction to the techniques most commonly used to solder
Surface Mounted Devices (SMD). A more detailed discussion on soldering HVSON
leadless package ICs can found in the following application notes:
AN10365 ‘Surface mount reflow soldering description”
AN10366 “HVQFN application information”
MSL: Moisture Sensitivity Level
Fig 11. Temperature profiles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
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Product data sheet Rev. 9 — 28 November 2017 20 of 25
NXP Semiconductors TJA1051
High-speed CAN transceiver
18. Appendix: ISO 11898-2:2016 parameter cross-reference list
Table 11. ISO 11898-2:2016 to NXP data sheet parameter conversion
ISO 11898-2:2016 NXP data sheet
Parameter Notation Symbol Parameter
HS-PMA dominant output characteristics
Single ended voltage on CAN_H VCAN_H VO(dom) dominant output voltage
Single ended voltage on CAN_L VCAN_L
Differential voltage on normal bus load VDiff VO(dif) differential output voltage
Differential voltage on effective resistance during arbitration
Optional: Differential voltage on extended bus load range
HS-PMA driver symmetry
Driver symmetry VSYM VTXsym transmitter voltage symmetry
Maximum HS-PMA driver output current
Absolute current on CAN_H ICAN_H IO(sc)dom dominant short-circuit output
current
Absolute current on CAN_L ICAN_L
HS-PMA recessive output characteristics, bus biasing active/inactive
Single ended output voltage on CAN_H VCAN_H VO(rec) recessive output voltage
Single ended output voltage on CAN_L VCAN_L
Differential output voltage VDiff VO(dif) differential output voltage
Optional HS-PMA transmit dominant timeout
Transmit dominant timeout, long tdom tto(dom)TXD TXD dominant time-out time
Transmit dominant timeout, short
HS-PMA static receiver input characteristics, bus biasing active/inactive
Recessive state differential input voltage range
Dominant state differential input voltage range
VDiff Vth(RX)dif differential receiver threshold
voltage
Vrec(RX) receiver recessive voltage
Vdom(RX) receiver dominant voltage
HS-PMA receiver input resistance (matching)
Differential internal resistance RDiff Ri(dif) differential input resistance
Single ended internal resistance RCAN_H
RCAN_L
Riinput resistance
Matching of internal resistance MR Riinput resistance deviation
HS-PMA implementation loop delay requirement
Loop delay tLoop td(TXDH-RXDH) delay time from TXD HIGH to
RXD HIGH
td(TXDL-RXDL) delay time from TXD LOW to RXD
LOW
Optional HS-PMA implementation data signal timing requirements for use with bit rates above 1 Mbit/s up to
2 Mbit/s and above 2 Mbit/s up to 5 Mbit/s
Transmitted recessive bit width @ 2 Mbit/s / @ 5 Mbit/s,
intended tBit(Bus) tbit(bus) transmitted recessive bit width
Received recessive bit width @ 2 Mbit/s / @ 5 Mbit/s tBit(RXD) tbit(RXD) bit time on pin RXD
Receiver timing symmetry @ 2 Mbit/s / @ 5 Mbit/s tRec trec receiver timing symmetry
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Product data sheet Rev. 9 — 28 November 2017 21 of 25
NXP Semiconductors TJA1051
High-speed CAN transceiver
[1] tfltr(wake)bus - bus wake-up filter time, in devices with basic wake-up functionality
HS-PMA maximum ratings of VCAN_H, VCAN_L and VDiff
Maximum rating VDiff VDiff V(CANH-CANL) voltage between pin CANH and
pin CANL
General maximum rating VCAN_H and VCAN_L VCAN_H
VCAN_L
Vxvoltage on pin x
Optional: Extended maximum rating VCAN_H and VCAN_L
HS-PMA maximum leakage currents on CAN_H and CAN_L, unpowered
Leakage current on CAN_H, CAN_L ICAN_H
ICAN_L
ILleakage current
HS-PMA bus biasing control timings
CAN activity filter time, long tFilter twake(busdom)[1] bus dominant wake-up time
CAN activity filter time, short twake(busrec)[1] bus recessive wake-up time
Wake-up timeout, short tWake tto(wake)bus bus wake-up time-out time
Wake-up timeout, long
Timeout for bus inactivity tSilence tto(silence) bus silence time-out time
Bus Bias reaction time tBias td(busact-bias) delay time from bus active to bias
Table 11. ISO 11898-2:2016 to NXP data sheet parameter conversion …continued
ISO 11898-2:2016 NXP data sheet
Parameter Notation Symbol Parameter
Section 1 Section 2.1 Table 7 Table 8 Table note 4 Figure 3 Figure 4 Figure 5 Figure 6 Figure 8
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Product data sheet Rev. 9 — 28 November 2017 22 of 25
NXP Semiconductors TJA1051
High-speed CAN transceiver
19. Revision history
Table 12. Revision history
Document ID Release date Data sheet status Change notice Supersedes
TJA1051 v.9 20171128 Product data sheet - TJA1051 v.8.1
Modifications: Updated to comply with ISO 11898-2:2016 and SAE J22884-1 through SAE J2284-5 specifications:
Section 1: text amended (2nd last paragraph)
Section 2.1: text amended (1st entry)
Table 7: values changed and/or measurements conditions amended/added for parameters ICC,
Vdom(TX)sym, VTXsym, VO(dif), Vrec(RX), Vdom(RX), IO(sc)dom, Ri, Ri and Ri(dif)
Table 8: Table note 4 added
Figure 3: thresholds clarified
Figure 4: title changed
Figure 5, Figure 6, Figure 8: amended
TJA1051 v.8.1 20160712 Product data sheet - TJA1051 v.7
TJA1051 v.7 20150115 Product data sheet - TJA1051 v.6
TJA1051 v.6 20110325 Product data sheet - TJA1051 v.5
TJA1051 v.5 20101229 Product data sheet - TJA1051 v.4
TJA1051 v.4 20091020 Product data sheet - TJA1051 v.3
TJA1051 v.3 20090825 Product data sheet - TJA1051 v.2
TJA1051 v.2 20090701 Product data sheet - TJA1051 v.1
TJA1051 v.1 20090309 Product data sheet - -
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Product data sheet Rev. 9 — 28 November 2017 23 of 25
NXP Semiconductors TJA1051
High-speed CAN transceiver
20. Legal information
20.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
20.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
20.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer's own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
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TJA1051 All information provided in this document is subject to legal disclaimers. © NXP N.V. 2017. All rights reserved.
Product data sheet Rev. 9 — 28 November 2017 24 of 25
NXP Semiconductors TJA1051
High-speed CAN transceiver
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
20.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
21. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors TJA1051
High-speed CAN transceiver
© NXP N.V. 2017. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 28 November 2017
Document identifier: TJA1051
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
22. Contents
1 General description. . . . . . . . . . . . . . . . . . . . . . 1
2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1
2.1 General. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2.2 Low-power management . . . . . . . . . . . . . . . . . 2
2.3 Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
3 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
4 Ordering information. . . . . . . . . . . . . . . . . . . . . 3
5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 4
6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
7 Functional description . . . . . . . . . . . . . . . . . . . 5
7.1 Operating modes . . . . . . . . . . . . . . . . . . . . . . . 5
7.1.1 Normal mode . . . . . . . . . . . . . . . . . . . . . . . . . . 5
7.1.2 Silent mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
7.1.3 Off mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
7.2 Fail-safe features . . . . . . . . . . . . . . . . . . . . . . . 6
7.2.1 TXD dominant time-out function . . . . . . . . . . . . 6
7.2.2 Internal biasing of TXD, S and EN input pins . . 6
7.2.3 Undervoltage detection on pins VCC and VIO . . 6
7.2.4 Overtemperature protection . . . . . . . . . . . . . . . 6
7.3 VIO supply pin . . . . . . . . . . . . . . . . . . . . . . . . . . 6
8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7
9 Thermal characteristics . . . . . . . . . . . . . . . . . . 7
10 Static characteristics. . . . . . . . . . . . . . . . . . . . . 8
11 Dynamic characteristics . . . . . . . . . . . . . . . . . 10
12 Application information. . . . . . . . . . . . . . . . . . 12
12.1 Application diagrams . . . . . . . . . . . . . . . . . . . 12
12.2 Application hints . . . . . . . . . . . . . . . . . . . . . . . 12
13 Test information. . . . . . . . . . . . . . . . . . . . . . . . 13
13.1 Quality information . . . . . . . . . . . . . . . . . . . . . 13
14 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14
15 Handling information. . . . . . . . . . . . . . . . . . . . 16
16 Soldering of SMD packages . . . . . . . . . . . . . . 16
16.1 Introduction to soldering . . . . . . . . . . . . . . . . . 16
16.2 Wave and reflow soldering . . . . . . . . . . . . . . . 16
16.3 Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 16
16.4 Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 17
17 Soldering of HVSON packages. . . . . . . . . . . . 18
18 Appendix: ISO 11898-2:2016 parameter
cross-reference list . . . . . . . . . . . . . . . . . . . . . 19
19 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 21
20 Legal information. . . . . . . . . . . . . . . . . . . . . . . 22
20.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 22
20.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
20.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 22
20.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 23
21 Contact information . . . . . . . . . . . . . . . . . . . . 23
22 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

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