ESDALC6V1-1U2 Datasheet by STMicroelectronics

View All Related Products | Download PDF Datasheet
September 2011 Doc ID 15089 Rev 3 1/11
11
ESDALC6V1-1U2
Single-line low capacitance Transil™ for ESD protection
Features
Breakdown voltage VBR = 6.1 V min.
Unidirectional device
Multiple ESD strike sustainability
Very low diode capacitance: 12 pF typ. at 0 V
Low leakage current
0201 SMD package size compatible
Ultra small PCB area: 0.18 mm2
RoHS compliant
Benefits
High ESD protection level
High integration
Suitable for high density boards
MSL1
Complies with the following standards:
IEC 61000-4-2 level 4
Applications
Where transient overvoltage protection in ESD
sensitive equipment is required, such as:
Portable multimedia players and accessories
Notebooks
Digital cameras and camcorders
Communication systems
Cellular phone handsets and accessories
Figure 1. Functional diagram (top view)
Description
The ESDALC6V1-1U2 is a unidirectional single
line TVS diode designed to protect the data lines
or other I/O ports against ESD transients.
The device is ideal for applications where both
reduced line capacitance and board space saving
are required.
TM: Transil is a trademark of STMicroelectronics
Pin 1 available in different forms
ST0201 package
www.st.com
(Tamn Tamb £7
Characteristics ESDALC6V1-1U2
2/11 Doc ID 15089 Rev 3
1 Characteristics
Figure 2. Electrical characteristics (definitions)
Table 1. Absolute maximum ratings (Tamb = 25 °C)
Symbol Parameter Value Unit
VPP
Peak pulse voltage:
IEC 61000-4-2 contact discharge ±8 kV
PPP Peak pulse power dissipation (8/20 µs) (1) Tj initial = Tamb 20 W
IPP Peak pulse current (8/20 µs) 2 A
TjJunction temperature 125 °C
Tstg Storage temperature range - 55 to +150 °C
TLMaximum lead temperature for soldering during 10 s 260 °C
Top Operating junction temperature range -40 to +125 °C
1. For a surge greater than the maximum values, the diode will fail in short-circuit
I
V
IF
IRM
IR
IPP
VRM VF
VBR
VCL
Symbol Parameter
V = Breakdown voltage
I = Leakage current @ V
V = Stand-off voltage
I = Forward current
I = Peak pulse current
I = Breakdown current
V = Forward voltage drop
R
BR
RM RM
RM
PP
R
F
V = Clamping voltage
CL
F
d= Dynamic impedance
T = Voltage temperatureα
Slope = 1/Rd
Table 2. Electrical characteristics (values, Tamb = 25 °C)
Symbol Test conditions Min. Typ. Max. Unit
VBR IR = 1 mA 6.1 8.0 V
IRM VRM = 3 V 100 nA
RdSquare pulse, IPP = 1 A tp = 2.5 µs 1.3 Ω
αTΔVBR = αT(Tamb - 25 °C) x VBR (25 °C) 4.5 10-4/°C
Cline VR = 0 V, Fosc = 1 MHz, Vosc = 30 mV 12.0 pF
ESDALC6V1-1U2 Characteristics
Doc ID 15089 Rev 3 3/11
Figure 7. Relative variation of leakage current versus junction temperature (typical values)
Figure 3. Relative variation of peak pulse
power versus initial junction
temperature
Figure 4. Peak pulse power versus
exponential pulse duration
P
PP
[T
j
initial] / P
PP
[T
j
initial=25°C]
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
0 25 50 75 100 125 150
Tj(°C)
P
PP
(W)
1
10
100
1000
1 10 100 1000
T
j
initial = 25 °C
t
P
(µs)
Figure 5. Clamping voltage versus peak
pulse current
(square pulse, typical values)
Figure 6. Junction capacitance versus
reverse applied voltage
(typical values)
I
PP
(A)
0.1
1.0
10.0
5 7 9 11 13 15
Tp = 2.5 µs
T
j
initial =25 °C
V
CL
(V)
C(pF)
0
2
4
6
8
10
12
012345
F=1 MHz
V
OSC
=30 mV
RMS
T
j
=25 °C
Vline (V)
I
R
[T
j
]/I
R
[T
j
=25°C]
1
10
100
25 50 75 100 125
V
R
=3V
T
j
(°C)
Characteristics ESDALC6V1-1U2
4/11 Doc ID 15089 Rev 3
Figure 10. S21 attenuation measurement results
Figure 8. ESD response to IEC 61000-4-2
(+8 kV contact discharge)
Figure 9. ESD response to IEC 61000-4-2
(-8 kV contact discharge)
10 V/Div
20 ns/Div
10 V/Div
20 ns/Div
100.0k 1.0M 10.0M 100.0M 1.0G
- 30.00
-24.00
-18.00
-12.00
- 6.00
0.00
dB
< -2.1dB
(-2.5dB@900MHz
-6.1dB@1.8GHz)
Attenuation
(0.8 4GHz)
1.02 GHz-3 dB point
0.01 dB
Pass band
attenuation
Average
Performance
(50WSystem)
< -5.2 dB
(-6.1dB@900 MHz
-14 dB@1.8 GHz)
Attenuation
(0.8 – 4GHz)
538 MHz-3 dB point
0.01 dB
Pass band
attenuation
Average
Performance
(50
ΩSystem)
F (Hz)
Q Low ca acitance
ESDALC6V1-1U2 Ordering information scheme
Doc ID 15089 Rev 3 5/11
2 Ordering information scheme
Figure 11. Ordering information scheme
ESDA LC 6V1 - 1U2
ESD Array
Low capacitance
Package
U2 = ST0201
Breakdown Voltage
6V1 = 6.1 V min
Package information ESDALC6V1-1U2
6/11 Doc ID 15089 Rev 3
3 Package information
Epoxy meets UL94, V0
Lead-free packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Note: Product marking may be rotated by multiples of 90° for assembly plant differentiation. In no
case should this product marking be used to orient the component for its placement on a
PCB. Only pin 1 mark is to be used for this purpose.
Table 3. ST0201 dimensions
Ref
Dimensions
Millimetres Inches
Min Typ Max Min Typ Max
A 0.23 0.28 0.33 0.009 0.011 0.013
b1 0.13 0.18 0.23 0.005 0.007 0.009
b2 0.14 0.19 0.24 0.006 0.007 0.009
D 0.55 0.60 0.65 0.022 0.024 0.026
E 0.25 0.30 0.35 0.010 0.012 0.014
e0.35 0.014
L1 0.20 0.25 0.30 0.008 0.010 0.012
L2 0.20 0.25 0.30 0.008 0.010 0.012
Figure 12. Footprint (dimensions in mm) Figure 13. Marking
D
E
A
b1
b1
b2
b2
e
e
L2
L2
L1
L1
To p
Side
Bottom
Pin 1 available in different forms
Pin 1
Bottom
0.425
0.20
0.30
0.425
1.05
Pin1 Pin 2
L1
\rlfi r\ r\/ rifl‘
ESDALC6V1-1U2 Package information
Doc ID 15089 Rev 3 7/11
Figure 14. Tape and reel specifications
Bar indicates Pin 1
User direction of unreeling
All dimensions are typical values in mm
4.0
2.0
8.0
2.0
1.75
3.5
Ø 1.55
0.34 0.38
0.22
0.68
D1
D1
D1
D1
D1
D1
D1
Recommendation on PCB assembly ESDALC6V1-1U2
8/11 Doc ID 15089 Rev 3
4 Recommendation on PCB assembly
4.1 Stencil opening design
Figure 15. Recommended stencil windows position (dimensions in mm)
4.2 Solder paste
1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004.
2. “No clean” solder paste is recommended.
3. Offers a high tack force to resist component movement during high speed
4. Solder paste with fine particles: powder particle size is 20-45 µm.
0.425
0.20 0.038
0.065
Footprint Stencil window
0.040
0.038
0.30
0.320
0.425
1.05
0.225
Temperature (“6) 260”!) max 255%: Minimize air convection currents in the reflow oven to avoid oomponen Doc ID 15089 Rev 3
ESDALC6V1-1U2 Recommendation on PCB assembly
Doc ID 15089 Rev 3 9/11
4.3 Placement
1. Manual positioning is not recommended.
2. It is recommended to use the lead recognition capabilities of the placement system, not
the outline centering
3. Standard tolerance of ± 0.05 mm is recommended.
4. 3.5 N placement force is recommended. Too much placement force can lead to
squeezed out solder paste and cause solder joints to short. Too low placement force
can lead to insufficient contact between package and solder paste that could cause
open solder joints or badly centered packages.
5. To improve the package placement accuracy, a bottom side optical control should be
performed with a high resolution tool.
6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is
recommended during solder paste printing, pick and place and reflow soldering by
using optimized tools.
4.4 PCB design preference
1. To control the solder paste amount, the closed via is recommended instead of open
vias.
2. The position of tracks and open vias in the solder area should be well balanced. The
symmetrical layout is recommended, in case any tilt phenomena caused by
asymmetrical solder paste amount due to the solder flow away.
4.5 Reflow profile
Figure 16. ST ECOPACK® recommended soldering reflow profile for PCB mounting
Note: Minimize air convection currents in the reflow oven to avoid component movement.
0
01234567
Time (min)
Temperature (°C)
2°C/s recommended
6°C/s max
220°C
125 °C
260°C max
255°C
180°C
90 sec max
10-30 sec
90 to 150 sec
3°C/s max
0
01234567
Time (min)
Temperature (°C)
2°C/s recommended
6°C/s max
220°C
125 °C
260°C max
255°C
180°C
90 sec max
10-30 sec
90 to 150 sec
3°C/s max
Ordering information ESDALC6V1-1U2
10/11 Doc ID 15089 Rev 3
5 Ordering information
6 Revision history
Table 4. Ordering information
Order code Marking Weight Base qty Delivery mode
ESDALC6V1-1U2 L1(1)
1. The marking can be rotated by multiples of 90° to differentiate assembly location
0.124 mg 15000 Tape and reel
Table 5. Document revision history
Date Revision Changes
07-Oct-2008 1Initial release.
25-Jan-2010 2Updated base qty Table 4.
22-Sep-2011 3Updated package illustrations on page 1 and in Ta bl e 3 for Pin 1
available forms.
ESDALC6V1-1U2
Doc ID 15089 Rev 3 11/11
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY TWO AUTHORIZED ST REPRESENTATIVES, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2011 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com

Products related to this Datasheet

TVS DIODE 3V ST0201
TVS DIODE 3V ST0201
TVS DIODE 3V ST0201