TC77 Datasheet by Microchip Technology

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2002-2012 Microchip Technology Inc. DS20092B-page 1
TC77
Features
Digital Temperature Sensing in 5-Pin SOT-23A
and 8-Pin SOIC Packages
Outputs Temperature as a 13-Bit Digital Word
SPI and MICROWIRE™ Compatible Interface
Solid State Temperature Sensing
±1°C (max.) accuracy from +25°C to +65°C
±2°C (max.) accuracy from -40°C to +85°C
±3°C (max.) accuracy from -55°C to +125°C
2.7V to 5.5V Operating Range
•Low Power
- 250 µA (typ.) Continuous Conversion Mode
- 0.1 µA (typ.) Shutdown Mode
Typical Applications
Thermal Protection for Hard Disk Drives and
Other PC Peripherals
PC Card Devices for Notebook Computers
Low Cost Thermostat Controls
Industrial Control
Office Equipment
Cellular Phones
Thermistor Replacement
Block Diagram
Description
The TC77 is a serially accessible digital temperature
sensor particularly suited for low cost and small form-
factor applications. Temperature data is converted from
the internal thermal sensing element and made avail-
able at anytime as a 13-bit two’s compliment digital
word. Communication with the TC77 is accomplished
via a SPI and MICROWIRE compatible interface. It has
a 12-bit plus sign temperature resolution of 0.0625°C
per Least Significant Bit (LSb). The TC77 offers a tem-
perature accuracy of ±1.0°C (max.) over the tempera-
ture range of +25°C to +65°C. When operating, the
TC77 consumes only 250 µA (typ.). The TC77’s Con-
figuration register can be used to activate the low
power Shutdown mode, which has a current consump-
tion of only 0.1 µA (typ.). Small size, low cost and ease
of use make the TC77 an ideal choice for implementing
thermal management in a variety of systems.
Package Types
Typical Application
TC77
Diode
Temperature
Sensor
VDD
SCK
CS
Serial
Port
Interface SI/O
13-Bit
Sigma Delta
A/D Converter
Register
Temperature
Register
Internal
Configuration
Manufacturer
ID Register
VSS
SOT-23-5
1
SOIC
1VDD
VSS
SCK SI/O
CS
TC77 TC77
SCK
SI/O
VSS
NC
CS
VDD
NC
NC
AN0
SCK
SDI
CS
SCK
SI/O
TC77
0.1µF
VDD
VSS
VDD
PIC®
MCU
Thermal Sensor with SPI Interface
DD FOR
TC77
DS20092B-page 2 2002-2012 Microchip Technology Inc.
1.0 ELECTRICAL
CHARACTERISTICS
1.1 Absolute Maximum Ratings †
VDD........................................................................6.0V
All inputs and outputs w.r.t. VSS ..... -0.3V to VDD +0.3V
Storage temperature ..........................-65°C to +150°C
Ambient temp. with power applied .....-55°C to +125°C
Junction Temperature......................................... 150°C
ESD protection on all pins:
Human Body Model (HBM)..............................>4 kV
Machine Model (MM)......................................>200V
Notice: Stresses above those listed under "Maximum
Ratings" may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operation listings of this specification is not implied. Exposure
to maximum rating conditions for extended periods may affect
device reliability.
PIN FUNCTION TABLE
Name Function
SI/O Serial Data Pin
SCK Serial Clock
VSS Ground
CS Chip Select (Active-Low)
NC No Connection
VDD Power Supply
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, all parameters apply at VDD = 2.7V to 5.5V and
TA = -55°C to +125°C.
Parameters Sym Min Typ Max Units Conditions
Power Supply
Operating Voltage Range VDD 2.7 5.5 V Note 1
Operating Current IDD 250 400 µA Continuous Temperature
Conversion Mode
Power-On Reset Threshold VPOR 1.2 1.6 2.2 V VDD falling or rising edge
Standby Supply Current IDD-
STANDBY
0.1 1.0 µA Shutdown Mode
Temperature to Bits Converter
Resolution 13 Bits ADC LSb = 0.0625°C/bit
(Note 4)
Temperature Conversion Time tCT — 300 400 ms
Temperature Accuracy
(Note 1)
TERR -1.0
-2.0
-3.0
+1.0
+2.0
+3.0
°C +25°C < TA < +65°C
-40°C < TA < +85 °C
-55°C < TA < +125°C
TC77-3.3MXX: VDD = 3.3V
TC77-5.0MXX: VDD = 5.0V
Note 1: The TC77-3.3MXX and TC77-5.0MXX will operate from a supply voltage of 2.7V to 5.5V. However, the tem-
perature accuracy of the TC77-3.3MXX and TC77-5.0MXX is specified at the nominal operating voltages of
3.3V and 5.0V, respectively. As VDD varies from the nominal operating value, the accuracy may be
degraded (Refer to Figures 2-6 and 2-7).
2: All time measurements are measured with respect to the 50% point of the signal.
3: Load Capacitance, CL = 80 pF, is used for AC timing measurements of output signals.
4: Resolution = Temperature Range/No. of Bits = (+255°C – -256°C) / (213)
Resolution = 512/8192 = 0.0625°C/Bit
2002-2012 Microchip Technology Inc. DS20092B-page 3
TC77
Digital Input/Output
High Level Input Voltage VIH 0.7 VDD —V
DD + 0.3 V
Low Level Input Voltage VIL -0.3 0.3 VDD V
High Level Output Voltage VOH 2.4 V IOH = -400 µA
Low Level Output Voltage VOL —— 0.4 VI
OL = +2 mA
Input Current IIN(0),
IIN(1)
-1.0
-1.0
+1.0
+1.0
µA VIN = GND
VIN = VDD
Input Hysteresis 0.35 0.8 V SI/O, SCK
Pin Capacitance CIN, COUT —20 — pF
Tri-state Output Leakage
Current
IO_LEAK -1.0
+1.0
µA VO = GND
VO = VDD
Serial Port AC Timing (Notes 2, 3)
Clock Frequency fCLK DC 7.0 MHz
CS Fall to First Rising SCK
Edge
tCS-SCK 100 — ns
CS Low to Data Out Delay tCS-SI/O —— 70 ns
SCK Fall to Data Out Delay tDO —— 100ns
CS High to Data Out
Tr i - s t a t e
tDIS —— 200ns
SCK High to Data In Hold Time tHD 50 — ns
Data In Set-up Time tSU 30 — ns
Thermal Package Resistance
Thermal Resistance, SOT23-5 JA —230 —°C/W
Thermal Resistance, 8L-SOIC JA —163 —°C/W
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise noted, all parameters apply at VDD = 2.7V to 5.5V and
TA = -55°C to +125°C.
Parameters Sym Min Typ Max Units Conditions
Note 1: The TC77-3.3MXX and TC77-5.0MXX will operate from a supply voltage of 2.7V to 5.5V. However, the tem-
perature accuracy of the TC77-3.3MXX and TC77-5.0MXX is specified at the nominal operating voltages of
3.3V and 5.0V, respectively. As VDD varies from the nominal operating value, the accuracy may be
degraded (Refer to Figures 2-6 and 2-7).
2: All time measurements are measured with respect to the 50% point of the signal.
3: Load Capacitance, CL = 80 pF, is used for AC timing measurements of output signals.
4: Resolution = Temperature Range/No. of Bits = (+255°C – -256°C) / (213)
Resolution = 512/8192 = 0.0625°C/Bit
TC77
DS20092B-page 4 2002-2012 Microchip Technology Inc.
FIGURE 1-1: Timing Diagrams.
CS
SCK
1/fCLK
SI/O
tDO
LSb
tDIS
HI-Z
Data Output Timing
MSb
tCS-SI/O
tHD tSU
SI/O
SCK
CS
HI-Z SI/O
SCK
CS
HI-Z
tHD tSU
HI-Z
tCS-SCK
SI/O Data Input Set-up and Hold Timing (Data is clocked on the rising edge of SCK)
2002-2012 Microchip Technology Inc. DS20092B-page 5
TC77
2.0 TYPICAL PERFORMANCE CURVES
Note: Unless otherwise indicated, all parameters apply at VDD = 3.3V for the TC77-3.3MXX and VDD = 5.0V for the TC77-
5.0MXX, and TA = -55°C to +125°C. The TC77-3.3MXX and TC77-5.0MXX will operate from a supply voltage of 2.7V
to 5.5V. However, the temperature accuracy of the TC77-3.3MXX and TC77-5.0MXX is specified at the nominal oper-
ating voltages of 3.3V and 5.0V, respectively.
FIGURE 2-1: Accuracy vs. Temperature
(TC77-XXMXX).
FIGURE 2-2: Supply Current vs. Supply
Voltage (TC77-XXMXX).
FIGURE 2-3: Supply Current vs.
Temperature.
FIGURE 2-4: Shutdown Current vs.
Temperature.
FIGURE 2-5: Power-On Reset Voltage vs.
Temperature (TC77-XXMXX).
FIGURE 2-6: Temperature Accuracy vs.
Supply Voltage (TC77-3.3MXX).
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
-3.5
-3
-2.5
-2
-1.5
-1
-0.5
0
0.5
1
1.5
2
2.5
3
3.5
-55 -35 -15 5 25 45 65 85 105 125
Reference Temperature (°C)
Temperature Error (°C)
Upper Specification Limit
Lower Specification Limit
Mean + 3V
Mean - 3V
Mean
200
210
220
230
240
250
2.7 3.1 3.5 3.9 4.3 4.7 5.1 5.5
Supply Voltage (V)
Supply Current (µA)
TA = +25°C
TA = +125°C
TA = -55°C
0
50
100
150
200
250
300
350
400
-55 -25 5 35 65 95 125
Temperature (°C)
Supply Current (µA)
TC77-5.0MXX
VDD = 5.0 V
TC77-3.3MXX
VDD = 3.3 V
0.0
0.1
0.2
0.3
-55 -25 5 35 65 95 125
Temperature (°C)
Shutdown Current (µA)
TC77-5.0MXX
VDD = 5.0 V
TC77-3.3MXX
VDD = 3.3 V
0.0
0.5
1.0
1.5
2.0
2.5
-55 -25 5 35 65 95 125
Temperature (°C)
Power-On Reset Voltage (V)
-0.4
-0.3
-0.2
-0.1
0
0.1
0.2
0.3
0.4
3 3.1 3.2 3.3 3.4 3.5 3.6
Supply Voltage (V)
Temperature Change (°C)
TC77-3.3MXX
TA = -25°C
TA = +25°C
TA = +85°C
TC77
DS20092B-page 6 2002-2012 Microchip Technology Inc.
FIGURE 2-7: Temperature Accuracy vs.
Supply Voltage (TC77-5.0MXX).
FIGURE 2-8: Histogram of Temperature
Accuracy at -55 Degrees C (TC77-XXMXX).
FIGURE 2-9: Histogram of Temperature
Accuracy at -40 Degrees C (TC77-XXMXX).
FIGURE 2-10: Histogram of Temperature
Accuracy at +25 Degrees C (TC77-XXMXX).
FIGURE 2-11: Histogram of Temperature
Accuracy at +65 Degrees C (TC77-XXMXX).
FIGURE 2-12: Histogram of Temperature
Accuracy at +85 Degrees C (TC77-XXMXX).
-0.4
-0.3
-0.2
-0.1
0
0.1
0.2
0.3
0.4
4.5 4.6 4.7 4.8 4.9 5 5.1 5.2 5.3 5.4 5.5
Supply Voltage (V)
Temperature Change (°C)
TC77-5.0MXX
TA = -25°C
TA = +25°C
TA = +85°C
0
5
10
15
20
25
30
35
-3 -2.5 -2 -1.5 -1 -0.5 0 0.5 1 1.5 2 2.5 3
Temperature Error (°C)
Percentage of Occurances (%)
Sample Size = 108
TA = -55°C
0
5
10
15
20
25
30
35
40
-2 -1.5 -1 -0.5 0 0.5 1 1.5 2
Temperature Error (°C)
Percentage of Occurances (%)
Sample Size = 108
TA = -40°C
0
5
10
15
20
25
30
35
40
45
50
-1 -0.75 -0.5 -0.25 0 0.25 0.5 0.75 1
Temperature Error (°C)
Percentage of Occurances (%)
Sample Size = 108
TA = +25°C
0
5
10
15
20
25
30
35
40
45
50
-1 -0.75 -0.5 -0.25 0 0.25 0.5 0.75 1
Temperature Error (°C)
Percentage of Occurances (%)
Sample Size = 108
TA = +65°C
0
10
20
30
40
50
60
70
80
90
-2 -1.5 -1 -0.5 0 0.5 1 1.5 2
Temperature Error (°C)
Percentage of Occurances (%)
Sample Size = 108
TA = +85°C
2002-2012 Microchip Technology Inc. DS20092B-page 7
TC77
FIGURE 2-13: Histogram of Temperature
Accuracy at +125 Degrees C (TC77-XXMXX).
0
10
20
30
40
50
60
-3 -2.5 -2 -1.5 -1 -0.5 0 0.5 1 1.5 2 2.5 3
Temperature Error (°C)
Percentage of Occurances (%)
Sample Size = 108
TA = +125°C
TC77
DS20092B-page 8 2002-2012 Microchip Technology Inc.
3.0 FUNCTIONAL DESCRIPTION
The TC77 consists of a band-gap type temperature
sensor, a 12-bit plus sign (13-bit) Sigma-Delta Analog-
to-Digital Converter (ADC), an internal conversion
oscillator (~30 kHz) and a serial input/output port.
These devices feature a three-wire serial interface that
is fully compatible with SPI and MICROWIRE specifica-
tions and, therefore, allows simple communications
with common microcontrollers and processors. The
Shutdown mode can be used to reduce supply current
for power sensitive applications. A Manufacturer’s ID
register identifies the TC77 as a Microchip Technology
product.
FIGURE 3-1: Temperature To Digital Transfer Function (Non-linear Scale).
Temp
Temp
Output
Code
+125°C
-55°C
+25°C
-25°C
+0.0625°C
-0.0625°C
0+0111 1101 0000
0+0001 1001 0000
0+0000 0000 0001
0+0000 0000 0000
1+1111 1111 1111
1+1110 0111 0000
1+1100 1001 0000
0°C
2002-2012 Microchip Technology Inc. DS20092B-page 9
TC77
3.1 Temperature Data Format
A 13-bit two’s complement digital word is used to rep-
resent the temperature. The Least Significant Bit (LSb)
is equal to 0.0625°C. Note that the last two LSb bits (Bit
0 and 1) are tri-stated and are represented as a logic ‘1
in the table. Bit 2 is set to logic1’ after the completion
of the first temperature conversion following a power-
up or voltage reset event.
TABLE 3-1: TC77 OUTPUT
An over-temperature condition can be determined by
reading only the first few Most Significant Bits (MSb) of
the temperature data. For example, the microprocessor
could read only the first four bits of the Temperature
register in order to determine that an over-temperature
condition exists.
3.2 Power-Up And Power-Down
The TC77 is in the Continuous Temperature Conver-
sion mode at power-up. The first valid temperature con-
version will be available approximately 300 ms (refer to
“Temperature to Bits Converter” section listed in the DC
characteristics table) after power-up. Bit 2 of the Tem-
perature register is set to a logic ‘1’ after the completion
of the first temperature conversion following a power-
up or voltage reset event. Bit 2 is set to logic ‘0’ during
the time needed to complete the first temperature con-
version. Thus, the status of bit 2 can be monitored to
indicate the completion of the first temperature conver-
sion.
A supply voltage lower than 1.6V (typ.) is considered a
power-down state for the TC77. The device will reset
itself and continue its normal Continuous Conversion
mode of operation when the supply voltage rises above
the nominal 1.6V. A minimal supply voltage of 2.7V is
required in order to ensure proper operation of the
device.
3.3 Serial Bus Interface
The serial interface consists of the Chip Select (CS),
Serial Clock (SCK) and Serial Data (SI/O) signals. The
TC77 meets the SPI and MICROWIRE bus specifica-
tions, with the serial interface designed to be compati-
ble with the Microchip PIC® family of microcontrollers.
The CS input is used to select the TC77 when multiple
devices are connected to the serial clock and data
lines. The CS line is also used to synchronize the data,
which is written to, or read from, the device when CS is
equal to a logic ‘0’ voltage. The SCK input is disabled
when CS is a logic ‘1’. The falling edge of the CS line
initiates communication, while the rising edge of CS
completes the communication.
The SCK input is provided by the external microcon-
troller and is used to synchronize the data on the SI/O
line. The Temperature and Manufacturer ID registers
are read only while the Configuration register is a read/
write register.
Figure 3-2 provides a timing diagram of a read opera-
tion of the Temperature register. Communication with
the TC77 is initiated when the CS goes to a logic ‘0’.
The Serial I/O signal (SI/O) then transmits the first bit of
data. The microcontroller serial I/O bus master clocks
the data in on the rising edge of SCK. The falling edge
of SCK is then used to clock out the rest of the data.
After 14 bits of data (thirteen temperature bits and Bit 2)
have been transmitted, the SI/O line is then tri-stated.
Note that CS can be taken to a logic ‘1’ at any time dur-
ing the data transmission if only a portion of the temper-
ature data information is required. The TC77 will
complete the conversion, and the output shift register
will be updated, if CS goes to the inactive state while in
the middle of a conversion.
Figure 3-3 provides a timing diagram of a multi-byte
communication operation consisting of a read of the
Temperature Data register, followed by a write to the
Configuration register. The first 16 SCK pulses are
used to transmit the TC77's temperature data to the
microcontroller. The second group of 16 SCK pulses
are used to receive the microcontroller command to
place the TC77 either in Shutdown or Continuous Tem-
perature Conversion mode. Note that the TC77 is in the
Continuous Temperature Conversion mode at power-
up.
The data written to the TC77’s Configuration register
should be either all 0’s or all 1s, corresponding to
either the Continuous Temperature Conversion or
Shutdown mode, respectively. The TC77 is in Shut-
down mode when Bits C0 to C7 are all equal to 1’s. The
TC77 will be in the Continuous Conversion mode if a ‘0
in any bit location from C0 to C7 is written to the
Configuration register.
Temperature Binary
MSB / LSB Hex
+125°C 0011 1110 1000 0111 3E 87h
+25°C 0000 1100 1000 0111 0B 87h
+0.0625°C 0000 0000 0000 1111 00 0Fh
0°C 0000 0000 0000 0111 00 07h
-0.0625°C 1111 1111 1111 1111 FF FFh
-25°C 1111 0011 1000 0111 F3 87h
-55°C 1110 0100 1000 0111 E4 87h
WEDGE—
TC77
DS20092B-page 10 2002-2012 Microchip Technology Inc.
FIGURE 3-2: Temperature Read Timing Diagram - (Reading only the first 13 Bits of the
Temperature Register).
FIGURE 3-3: Temperature Read Followed By A Write To The Configuration Register Timing.
Diagram.
It is recommended that the user write all 0’s or all ‘1’s
to the Configuration register. While the following codes
can be transmitted to the TC77, any other code may
put the TC77 into a test mode reserved by Microchip for
calibration and production verification tests.
00 hex
01 hex
03 hex
07 hex
•0F hex
•1F hex
•3F hex
•7F hex
•FF hex
The following communication steps can be used to
obtain the Manufacturer's ID and put the device into the
Continuous Conversion mode. The Manufacturer’s ID
register is only accessible for a read operation, if the
TC77 is in Shutdown mode.
1. CS goes low to initiate the communication cycle.
2. Read 16 bits of temperature data from the
Temperature register.
3. Write 16 bits of data (i.e. XXFF hex) to the Con-
figuration register to enter Shutdown mode.
4. Read the 16 bits from the Manufacturer's ID reg-
ister (C15:C8 = 54 hex) to verify that the sensor
is a Microchip device.
5. Write 8 to 16 bits of data (00 or 0000 hex) to
enter Continuous Conversion Mode.
6. Return CS high to terminate the communication
cycle.
The time between a complete temperature conversion
and data transmission is approximately 300 msec.
CS
CLK
SI/O
tCS-SCK
HI-Z HI-Z
TTT
12 11 10 T
9T
7T
6T
5T
4T
3T
2T
1T
0
1813
T
8
CS
CLK
SI/O
tCS-SCK
HI-Z
18 8 8 81
HI-Z
11
HI-Z
TEMPERATURE REGISTER
Notes:
1. Bit 2 = 0 during power-up for the first
temperature conversion.
2. Bit 2 =1 after the completion of the first tem-
perature conversion following power-up or a
reset event.
3. Bits 1 and 0 are “DON”T CARES”.
CONFIGURATION REGISTER
Notes:
1. XX00 = Continuous Conversion Mode
2. XXFF = Shutdown Mode
T
12 T
11 T
10 T
9T
8T
7T
6T
5
T
4T
3T
2T
1T
0BIT
2C
15 C
14 C
13 C
12 C
11 C
10 C
9C
8C
7C
6C
5C
4C
3C
2C
1C
0
2002-2012 Microchip Technology Inc. DS20092B-page 11
TC77
4.0 INTERNAL REGISTER
STRUCTURE
The TC77 Internal register structure consists of three
registers. The Temperature and Manufacturers Identi-
fication registers are read only, while the Configuration
register is write only.
TABLE 4-1: REGISTERS FOR TC77
4.1 Configuration Register (CONFIG)
The Configuration register is write only. This register
selects either Shutdown, Continuous Conversion or
Test modes:
C15:C0 = XXXX/XXXX 1111/1111 (Shutdown
mode)
C15:C0 = XXXX/XXXX 0000/0000 (Continuous
Conversion mode)
The TC77 is in Shutdown mode when bits C0 to
C7 are all equal to ‘1’s. The TC77 will be in the
Continuous Conversion mode if a ‘0’ in any bit
location from C0 to C7 is written to the Configura-
tion register. The TC77 is in the Continuous
Conversion mode at power-up.
It is recommended that the user write all 0’s or all ‘1’s
to the Configuration register because other bit codes
may put the TC77 in a test mode used for calibration
and production verification tests. Section 3.3 lists the
Configuration register bit codes that can be written to
the TC77 without having the device enter a production
test mode.
During Shutdown mode, the serial bus is still active.
The current consumption of the TC77 will be less than
1 µA during the time between serial communication.
4.2 Temperature Register (TEMP)
The Temperature register is read only and holds the
temperature conversion data. Bits 0 and 1 are unde-
fined and will be tri-state outputs during a read
sequence. Bit 2 is set to a logic ‘1’ after completion of
the first temperature conversion following a power-up
or reset event. Bit 2 is set to a logic ‘0’ during the time
needed to complete the first temperature conversion.
Therefore, the status of bit 2 can be monitored to indi-
cate that the TC77 has completed the first temperature
conversion. Bits 15:3 contain the 13 bit two’s comple-
ment data from the temperature conversion.
4.3 Manufacturer’s ID Register (M_ID)
The Manufacturer’s Identification code is contained in
this read only register. The Manufacturer ID register is
only available for a read operation when the TC77 is in
Shutdown mode. The Manufacturer’s ID code is con-
tained in bits 15:8 and is equal to 54 hex to indicate a
Microchip device. Bits 1:0 are undefined and will be tri-
state outputs during a read sequence, while bits 7:2 are
set to ‘0’.
Name Bit
15 Bit
14 Bit
13 Bit
12 Bit
11 Bit
10 Bit
9Bit
8Bit
7Bit
6Bit
5Bit
4Bit
3Bit
2Bit
1Bit
0Value at Powerup/Reset
CONFIG C15 C14 C13 C12 C11 C10 C9 C8 C7 C6 C5 C4 C3 C2 C1 C0 XXXX/XXXX 0000/0000
TEMP T12T11T10T9 T8 T7T6T5T4T3T2T1T0 * x x1111/1111 0000/0*XX
M_ID 01010100000000xx0101/0100 0000/00XX
* Bit 2 = 0 during power-up; otherwise, bit 2 =1
TC77
DS20092B-page 12 2002-2012 Microchip Technology Inc.
5.0 APPLICATION INFORMATION
The TC77 does not require any additional components
in order to measure temperature. However, it is recom-
mended that a decoupling capacitor of 0.1 µF to 1 µF
be provided between the VDD and VSS (Ground) pins (a
high frequency ceramic capacitor should be used). It is
necessary for the capacitor to be located as close as
possible to the integrated circuit (IC) power pins in
order to provide effective noise protection to the TC77.
The TC77 measures temperature by monitoring the
voltage of a diode located on the IC die. A low-imped-
ance thermal path between the die and the printed cir-
cuit board (PCB) is provided by the IC pins of the TC77.
Therefore, the TC77 effectively monitors the tempera-
ture of the PCB board. The thermal path between the
ambient air is not as efficient because the plastic IC
housing package functions as a thermal insulator.
Thus, the ambient air temperature (assuming that a
large temperature gradient exists between the air and
PCB) has only a small effect on the temperature
measured by the TC77.
A potential for self-heating errors can exist if the TC77
SPI communication lines are heavily loaded. Typically,
the self-heating error is negligible because of the rela-
tively small current consumption of the TC77. A tem-
perature accuracy error of approximately 0.5°C will
result from self-heating if the SPI communication pins
sink/source the maximum current specified for the
TC77. Therefore, to maximize the temperature accu-
racy, the output loading of the SPI signals should be
minimized.
HHHH UUUU
2002-2012 Microchip Technology Inc. DS20092B-page 13
TC77
6.0 PACKAGING INFORMATION
6.1 Package Marking Information
Legend: XX...X Customer specific information*
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
*Standard marking consists of Microchip part number, year code, week code, and traceability code.
Please check with your Microchip Sales Office.
5-Lead SOT-23 Example:
XXNN CP57
TC77-3.3MCTTR = CN
TC77-5.0MCTTR = CP
8-Lead SOIC (150 mil) Example:
XXXXXXXX
XXXXYYWW
NNN
TC77-33
I/SN0222
057
TC77
DS20092B-page 14 2002-2012 Microchip Technology Inc.
5-Lead Plastic Small Outline Transistor (OT) (SOT23)
10501050
Mold Draft Angle Bottom
10501050
Mold Draft Angle Top
0.500.430.35.020.017.014BLead Width
0.200.150.09.008.006.004
c
Lead Thickness
10501050
Foot Angle
0.550.450.35.022.018.014LFoot Length
3.102.952.80.122.116.110DOverall Length
1.751.631.50.069.064.059E1Molded Package Width
3.002.802.60.118.110.102EOverall Width
0.150.080.00.006.003.000A1Standoff §
1.301.100.90.051.043.035A2Molded Package Thickness
1.451.180.90.057.046.035AOverall Height
1.90.075
p1
Outside lead pitch (basic)
0.95
.038
p
Pitch
55
n
Number of Pins
MAXNOMMINMAXNOMMINDimension Limits
MILLIMETERSINCHES*Units
1
p
D
B
n
E
E1
L
c
A2
A
A1
p1
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-178
Drawing No. C04-091
§ Significant Characteristic
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
2002-2012 Microchip Technology Inc. DS20092B-page 15
TC77
8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC)
Foot Angle 048048
1512015120
Mold Draft Angle Bottom
1512015120
Mold Draft Angle Top
0.510.420.33.020.017.013BLead Width
0.250.230.20.010.009.008
c
Lead Thickness
0.760.620.48.030.025.019LFoot Length
0.510.380.25.020.015.010hChamfer Distance
5.004.904.80.197.193.189DOverall Length
3.993.913.71.157.154.146E1Molded Package Width
6.206.025.79.244.237.228EOverall Width
0.250.180.10.010.007.004
A1
Standoff §
1.551.421.32.061.056.052A2Molded Package Thickness
1.751.551.35.069.061.053AOverall Height
1.27.050
p
Pitch
88
n
Number of Pins
MAXNOMMINMAXNOMMINDimension Limits
MILLIMETERSINCHES*Units
2
1
D
n
p
B
E
E1
h
L
c
45
A2
A
A1
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
§ Significant Characteristic
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
TC77
DS20092B-page 16 2002-2012 Microchip Technology Inc.
NOTES:
2002-2012 Microchip Technology Inc. DS20092B-page 17
TC77
THE MICROCHIP WEB SITE
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
Business of Microchip Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com. Under “Support”, click on
“Customer Change Notification” and follow the
registration instructions.
CUSTOMER SUPPORT
Users of Microchip products can receive assistance
through several channels:
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Customers should contact their distributor,
representative or field application engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical support is available through the web site
at: http://microchip.com/support
TC77
DS20092B-page 18 2002-2012 Microchip Technology Inc.
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip
product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our
documentation can better serve you, please FAX your comments to the Technical Publications Manager at
(480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
TO: Technical Publications Manager
RE: Reader Response Total Pages Sent ________
From: Name
Company
Address
City / State / ZIP / Country
Telephone: (_______) _________ - _________
Application (optional):
Would you like a reply? Y N
Device: Literature Number:
Questions:
FAX: (______) _________ - _________
DS20092BTC77
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
PART NO. —X.X 44x Sales and Suggort
2002-2012 Microchip Technology Inc. DS20092B-page19
TC77
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-
mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
PART NO. XXX
PackageTemperature
Range
Device
Device: TC77: Thermal Sensor with SPI Interface
Supply Voltage: 3.3 = VDD = Accuracy optimized for 3.3V
5.0 = VDD = Accuracy optimized for 5.0V
Temperature Range: M = -55C to +125C
Package: CTTR = Plastic Small Outline Transistor (SOT-23),
5-lead (Tape and Reel only)
OA = Plastic SOIC, (150 mil Body), 8-lead
Examples:
a) TC77-3.3MOA: 3.3V Thermal Sensor in
SOIC package.
b) TC77-5.0MOA: 5.0V Thermal Sensor in
SOIC package.
c) TC77-3.3MOATR: 3.3V Thermal Sensor in
SOIC package, Tape and Reel.
d) TC77-5.0MOATR: 5.0V Thermal Sensor in
SOIC package, Tape and Reel.
e) TC77-3.3MCTTR: 3.3V Thermal Sensor in
SOT-23 package, Tape and Reel.
f) TC77-5.0MCTTR: 5.0V Thermal Sensor in
SOT-23 package, Tape and Reel.
-X.X
Supply
Voltage
TC77
DS20092B-page 20 2002-2012 Microchip Technology Inc.
NOTES:
YSTEM <2>
2002-2012 Microchip Technology Inc. DS20092B-page 21
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. & KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2002-2012, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620767511
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT S
CERTIFIED BY DNV
== ISO/TS 16949 ==
6‘ ‘MICRDCHIP
DS20092B-page 22 2002-2012 Microchip Technology Inc.
AMERICAS
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Worldwide Sales and Service
10/26/12

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