BLM31KNyyySH1L Ref Sheet Datasheet by Murata Electronics

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Reference On y Spec. No. JENF243AV9148A701
Spec. No. JENF243A-9148A-01 P.1/8
MURATA MFG.CO., LTD.
Reference Only
Chip Ferrite Bead BLM31KN□□□SH1L
Murata Standard Reference Specification [AEC-Q200]
1. Scope
This reference specification applies to Chip Ferrite Bead for Automotive Electronics BLM31KN_SH Series based on AEC-Q200.
2. Part Numbering
(ex.) BL M 31 KN 121 S H 1 L
(1) (2) (3) (4) (5) (6) (7) (8) (9)
(1)Product ID (4)Characteristics (7)Category (for Automotive Electronics)
(2)Type (5)Typical Impedance at 100MHz (8)Numbers of Circuit
(3)Dimension (L×) (6)Performance (9)Packaging (L:Taping)
3. Rating
Customer
Part Number
MURATA
Part Number
Impedance (Ω)
(at 100MHz, Under Standard
Testing Condition)
Rated
Current
(mA)
(Note1)
DC Resistance
(Ω max.) ESD Rank
6:25kV
Initial
Values
Values
After
Testing
at 85 at 125
BLM31KN121SH1L 120±25% 6000 4000 0.009 0.011
6
BLM31KN271SH1L 270±25% 4500 3000 0.016 0.019
BLM31KN471SH1L 470±25% 4000 2700 0.02 0.024
BLM31KN601SH1L 600±25% 2900 2000 0.038 0.045
BLM31KN801SH1L 800±25% 2500 1700 0.05 0.06
BLM31KN102SH1L 1000±25% 2000 1400 0.075 0.09
Operating Temperature: -55°C to +125°C Storage Temperature: -55°C to +125°C
Standard Testing Conditions
< Unless otherwise specified > < In case of doubt >
Temperature : Ordinary Temp. (15 °C to 35 °C ) Temperature : 20°C±2 °C
Humidity : Ordinary Humidity (25%(RH) to 85%(RH)) Humidity : 60%(RH) to 70%(RH)
Atmospheric pressure : 86kPa to 106kPa
(Note1) Rated Current is derated as right figure
depending on the operating temperature.
4. Style and Dimensions
Equivalent Circuit
Unit Mass (Typical value)
0.041 g
5.Marking
No marking.
Operating Temperature (°C)
x
1
85 125
0
Rated Current (A)
Describe the Rated current as x[A]
in case of more than 1A.
85℃
125℃
Resistance element becomes
dominant at high frequencies.
()
:Electrode
3.2±0.2 1.6±0.2
0.7±0.3
1.1±0.2
(in mm)
1.6±0.2
Sgec. N0. JENF243AV9148A701 No. n Table A Table B
Spec. No. JENF243A-9148A-01 P.2/8
MURATA MFG.CO., LTD.
Reference Only
6. Specifications
6-1. Electrical
No. Item Specification Test Method
6-1-1 Impedance Meet item 3.
Measuring Frequency : 100MHz±1MHz
Measuring Equipment : KEYSIGHT4291A or the equivalent
Test Fixture : KEYSIGHT16192A or the equivalent
6-1-2 DC Resistance Meet item 3.
Measuring Equipment : Digital multi meter
*Except resistance of the Substrate and Wire
6-2. Mechanical Performance (based on Table 13 for FILTER EMI SUPPRESSORS/ FILTERS)
AEC-Q200 Rev.D issued June. 1 2010
AEC-Q200 Murata Specification / Deviation
No. Stress Test Method
3 High
Temperature
Exposure
1000hours at 125 deg C
Set for 24hours at room temperature, then
measured.
Meet Table A after testing.
Table A
4 Temperature Cycling 1000cycles
-55 deg C to +125 deg C
Set for 24hours at room temperature, then
measured.
Meet Table A after testing.
5 Destructive
Physical Analysis Per EIA469
No electrical tests No defects
7 Biased Humidity 1000hours at 85 deg C, 85%RH
Apply max rated current. Meet Table A after testing.
8 Operational Life Apply 125 deg C 1000hours
Set for 24hours at room temperature, then
measured
Meet Table A after testing.
If the rated current of parts exceed 1A,
the operating temperature should be 85 deg C.
9 External Visual Visual inspection No abnormalities
10 Physical Dimension Meet ITEM 4
Style and Dimensions No defects
12 Resistance to Solvents Per MIL-STD-202 Method 215 Not Applicable
13 Mechanical Shock
Per MIL-STD-202 Method 213
Condition F:
1500g’s(14.7N)/0.5ms/
Half sine
Meet Table B after testing.
Table B
Appearance No damage
Impedance
Change
(at 100MHz)
Within ±30%
DC
Resistance Meet item 3.
14 Vibration 5g's(0.049N) for 20 minutes, 12cycles
each of
3 orientations
Test from 10-2000Hz.
Meet Table B after testing.
Appearance No damage
Impedance
Change
(at 100MHz)
Within ±50%
DC
Resistance Meet item 3.
Refe re nce Only Spec. No. JENF243AV9148A701
Spec. No. JENF243A-9148A-01 P.3/8
MURATA MFG.CO., LTD.
Reference Only
AEC-Q200 Murata Specification / Deviation
No. Stress Test Method
15 Resistance
to Soldering Heat Solder temperature
260C+/-5 deg C
Immersion time 10s
Reflow soldering method:
Solder : Sn-3.0Ag-0.5Cu
Pre-Heating : 150°C-180°C, 90±30s
Heating : above 220°C, 60±30s
Peak temperature: 260°C
Cycle of reflow: 2times
Then measured after exposure in the room
condition for 48h±4h.
Meet Table A after testing.
17 ESD
Per AEC-Q200-002 Meet Table A after testing.
ESD Rank: Refer to Item 3. Rating
18 Solderability
Per J-STD-002 Method b : Not Applicable
95% of the terminations is to be soldered.
19 Electrical
Characterization Measured : Impedance No defects
20 Flammability Per UL-94 Not Applicable
21 Board Flex Epoxy-PCB(1.6mm)
Deflection 2mm(min)
60s minimum holding time
Meet Table B after testing.
22 Terminal Strength
Per AEC-Q200-006
No defects
30 Electrical
Transient
Conduction
Per ISO-7637-2 Not Applicable
7. Specification of Packaging
7-1. Appearance and Dimensions
(8mm-wide plastic tape)
*
Dimension of the Cavity is measured at the bottom side.
(1) Taping
Products shall be packaged in the each embossed cavity of 8mm-wide, 4mm-pitch and plastic tape
continuously and sealed by cover tape.
(2) Sprocket hole : Sprocket hole shall be located on the left hand side toward the direction of feed.
(3) Spliced point : The cover tape has no spliced point.
(4) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,
and are not continuous. The specified quantity per reel is kept.
0.2±0.1
φ
1.5
Direction of feed
4.0±0.1 4.0±0.1
3.5±0.1
2.0±0.05
3.5±0.05 1.75±0.1
8.0±0.3
+0.1
-0
1.9±0.1
φ
1.0
+0.3
-
0
1.3±0.1
(in mm)
1.75±0.1
Refe re nce On y Sgec. N0. JENF243AV9148A701 m% P‘s ber (» 7 0000 XXX
Spec. No. JENF243A-9148A-01 P.4/8
MURATA MFG.CO., LTD.
Reference Only
7-2. Tape Strength
(1) Pull Strength
Plastic tape 5N min.
Cover tape 10N min.
(2) Peeling off force of Cover tape
0.2N to 0.7N (Minimum value is typical.)
*Speed of Peeling off:300mm/min
7-3. Taping Condition
(1) Standard quantity per reel
Quantity per 180mm reel : 2500 pcs. / reel
(2) There shall be leader-tape (cover tape only and empty tape ) and trailer- tape (empty tape) as follows.
(3) Marking for reel
The following items shall be marked on a label and the label is stuck on the reel.
(Customer part number, MURATA part number, Inspection number (1), RoHS marking (2), Quantity, etc)
1) « Expression of Inspection No. » □□
OOOO
×××
(1) (2) (3)
(1)
Factory Code
(2)
Date First digit : Year / Last digit of year
Second digit : Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
Third, Fourth digit : Day
(3)
Serial No.
2) « Expression of RoHS marking » ROHS – Y ()
(1) (2)
(1)
RoHS regulation conformity parts.
(2)
MURATA classification number
(4) Outside package
These reels shall be packed in the corrugated cardboard package and the following items shall be marked
on a label and the label is stuck on the box.
(Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS marking (2), Quantity, etc)
(5) Dimensions of reel and taping (leader-tape, trailer-tape)
(in mm)
7-4.
Specification of Outer Case
Outer Case Dimensions
(mm) Standard Reel Quantity in Outer Case
(Reel)
W D H
186 186 93 5
Above Outer Case size is typical. It depends on a quantity of an order.
165 to 180 degree FCover tape
Plastic tape
Empty tape
190 min.
Leader
Trailer
2.0±0.5
φ
13.0±0.2
φ
21.0±0.8
φ
180
φ
60
9.0
13.0±1.4
+1
-
0
+0
-3
Direction of feed
210 min.
160 min.
Cover tape
+1
-0
Label
W
D
Label
H
Sgec. No. JENF243AV9148A701 A Reference On y 2,5 2,9 ”1:8, , 2,4 L8 L8 1.8 1.8
Spec. No. JENF243A-9148A-01 P.5/8
MURATA MFG.CO., LTD.
Reference Only
8. Caution
8-1. Rating
Do not use products beyond the Operating Temperature Range and Rated Current.
8-2. Surge current
Excessive surge current (pulse current or rush current) than specified rated current applied to the product
may cause a critical failure, such as an open circuit, burnout caused by excessive temperature rise.
Please contact us in advance in case of applying the surge current.
8-3. Fail Safe
Be sure to provide an appropriate fail-safe function on your product to prevent from a second damage
that may be caused by the abnormal function or the failure of our products.
8-4. Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1)Aircraft equipment (6)Disaster prevention / crime prevention equipment
(2)Aerospace equipment (7)Traffic signal equipment
(3)Undersea equipment (8)Transportation equipment (trains, ships, etc.)
(4)Power plant control equipment (9) Data-processing equipment
(5)Medical equipment (10) Applications of similar complexity and /or reliability requirements
to the applications listed in the above
9. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
9-1. Land pattern designing
Standard land dimensions (Reflow soldering)
Rated
Current
(A)
Land pad thickness and
dimension d
18µm 35µm 70µm
2 1.8 1.8 1.8
2.52.9 2.4 1.8 1.8
46 6.4 3.3 1.8
(in mm)
*The excessive heat by land pads may cause
deterioration at joint of products with substrate.
9-2. Soldering Conditions
Products can be applied to reflow soldering.
(1) Flux,Solder
Flux Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Do not use water-soluble flux.
Solder Use Sn-3.0Ag-0.5Cu solder
Standard thickness of solder paste : 100 µm to 200 μm
(2) Soldering conditions
Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited
to 150 max. Also cooling into solvent after soldering should be in such a way that the temperature difference
is limited to 100 max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
Type Soldering a b c
BLM31KN Reflow 2.0 4.3 1.8
a
b
Chip Ferrite Bead
Solder Resist
Pattern
d
c
Reference Only Sgec. N0. JENF243AV9148A701 $ I“ \
Spec. No. JENF243A-9148A-01 P.6/8
MURATA MFG.CO., LTD.
Reference Only
(3) Soldering profile
Reflow soldering profile
Standard Profile Limit Profile
Pre-heating 150180°C 90s±30s
Heating above 220°C30s60s above 230°C60s max.
Peak temperature 245±3°C 260°C, 10s
Cycle of reflow 2 times 2 times
9-3. Reworking with soldering iron
Pre-heating: 150°C, 1 min Soldering iron output: 80W max.
Tip temperature: 350°C max. Tip diameter: φ3mm max.
Soldering time : 3 (+1, -0) seconds. Times : 2times max.
Note: Do not directly touch the products with the tip of the soldering iron in order to prevent the crack
on the ferrite material due to the thermal shock.
9-4. Solder Volume
Solder shall be used not to be exceed as shown below.
1/3TtT
(T: Chip thickness)
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
9-5. Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
<Products direction>
Products shall be located in the sideways
direction (Length: a<b) to the mechanical
stress.
Recommendable
Upper Limit
t
Poor example
Good example
b
a
Limit Profile
Standard Profile
90s±30s
230℃
260℃
245±3
220
30s~60s
60s max.
180
150
Temp.
(s)
(℃)
Time.
Sgec. No. JENF243A79148A701 WE“? i Ioooot )oooot ETD m ‘1 A > D is valid when sliess is added vertically to the perturatlcn as with Hand Separation. If 3 Cutting Disc is used. stress le be diagonal lo the PCB, thelefure A > D is invalid. (3) Mounting Components Near Sclew Holes When a component is mounted near a screw hole, it may be allecied oy the board delleciion that occurs during the tightening ol the screw. Mount the component in a position as lar away trom the screw holes as possible. (CED-ND] 9-6. Mounting density Add special attention to radiating heat ol products when mounting the inductor near the products with heating. The excesslve heat oy other products may cause deterioration at ioint ol this product with substrate. 9-7. Operating Environment Do not use tnls product under the foliowing envlmnmentai conditions. on deleriolation of the insulatlcn Reslstance of the Ferrite maleriai and/or colmslun oi Inner Eiecllcde may lesuit from the use. (1) in the corrcdiole atmosphere such as acidic gases, alkaline gases. chlorine. sullur gases, organic gases and etc (the sea breeze. Cl2, H28, NHG. 802, N02,elc) (2) in the atmosphere where liquid such as organic solvent, may splash on the products. (3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew. 9-8. Resin coating The impedance value may change and/or it may altect on the product‘s pertormance due to high cure-stress ol resin to be used fol coating / molding products. So please pay your caretul attention when you select resin. In prior to use, please make the reliability evaluation with the product mounted in your application set. MUHATA MFG.CO., LTD.
Spec. No. JENF243A-9148A-01 P.7/8
MURATA MFG.CO., LTD.
Reference Only
(2)Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1
(2) Add slits in the board separation part. A > B
(3) Keep the mounting position of the component away from the board separation surface. A > C
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3) Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
9-6. Mounting density
Add special attention to radiating heat of products when mounting the inductor near the products with heating.
The excessive heat by other products may cause deterioration at joint of this product with substrate.
9-7. Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the Insulation
Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use.
(1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases and etc
(the sea breeze, Cl
2
, H
2
S, NH
3
, SO
2
, NO
2
,etc)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.
9-8. Resin coating
The impedance value may change and/or it may affect on the product's performance due to high cure-stress of
resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to
use, please make the reliability evaluation with the product mounted in your application set.
Perforation
Slit
A
B
C
D
Screw Hole
Recommended
Reference Only Spec. No. JENF243A79148A701
Spec. No. JENF243A-9148A-01 P.8/8
MURATA MFG.CO., LTD.
Reference Only
9-9. Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max. for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon
at the mounted products and P.C.B.
Power:20W/ max. Frequency:28kHz to 40kHz Time:5 min max.
(3) Cleaner
1.Alternative cleaner
Isopropyl alcohol (IPA)
2.Aqueous agent
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water
in order to remove the cleaner.
(5) Other cleaning
Please contact us.
9-10. Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to
the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending Twisting
9-11. Storage Conditions
(1) Storage period
Use the products within 6 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
Products should be stored in the warehouse on the following conditions.
Temperature : -10°C to 40°C
Humidity : 15% to 85% relative humidity
No rapid change on temperature and humidity
Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization
of electrode, resulting in poor solderability.
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
Products should be stored under the airtight packaged condition.
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
10 . ! Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the agreed specifications.
(3)The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.

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