KPS HT Series, X8L Datasheet by KEMET

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© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1038_X8L_KPS_150C_SMD • 1/9/2017 1
One world. One KEMET
Overview
KEMET Power Solutions High Temperature (KPS HT)
stacked capacitors utilize a proprietary lead-frame
technology to vertically stack one or two multilayer
ceramic chip capacitors into a single compact surface
mount package. The attached lead-frame mechanically
isolates the capacitor(s) from the printed circuit board,
thereby offering advanced mechanical and thermal stress
performance. Isolation also addresses concerns for
audible, microphonic noise that may occur when a bias
voltage is applied. A two-chip stack offers up to double
the capacitance in the same or smaller design footprint
when compared to traditional surface mount MLCC
devices. Providing up to 10 mm of board flex capability,
KPS Series capacitors are environmentally friendly and
in compliance with RoHS legislation. Combined with X8L
dielectric, these devices are capable of reliable operation up
to 150°C and are well suited for high temperature filtering,
bypass and decoupling applications.
X8L exhibits a predictable change in capacitance with
respect to time and voltage, and boasts a minimal change in
capacitance with reference to ambient temperature up to 125°C.
Beyond 125°C, X8L displays a wider variation in capacitance.
Capacitance change is limited to ±15% from −55°C to +125°C and
+15, −40% from 125°C to 150°C.
In addition to Commercial grade, Automotive grade devices
are available and meet the demanding Automotive Electronics
Council's AEC-Q200 qualification requirements.
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS HT Series, High Temperature 150°C, X8L Dielectric,
10 – 50 VDC (Commercial & Automotive Grade)
Ordering Information
C2220 C476 M 8 N 2 C 7186
Ceramic
Case Size
(L"x W")
Specification/
Series
Capacitance
Code (pF)
Capacitance
Tolerance1
Rated
Voltage
(VDC)
Dielectric FailureRate/
Design Leadframe Finish2Packaging/Grade
(C-Spec)
1210
2220
C = Standard Two significant
digits +
number of
zeros.
K = ±10%
M = ±20%
8 = 10
4 = 16
3 = 25
5 = 50
N = X8L 1 = KPS Single
Chip Stack
2 = KPS Double
Chip Stack
C = 100% Matte Sn See “Packaging
C-Spec Ordering
Options Table”
below
1 Double chip stacks ("2" in the 13th character position of the ordering code) are only available in M (±20%) capacitance tolerance.
Single chip stacks ("1" in the 13th character position of the ordering code) are available in K (±10%) or M (±20%) tolerances.
2 Additional leadframe finish options may be available. Contact KEMET for details.
Benefits
−55°C to +150°C operating temperature range
Reliable and robust termination system
EIA 1210 and 2220 case sizes
DC voltage ratings of 10 V, 16 V, 25 V, and 50 V
Capacitance offerings ranging from 0.47 μF up to 47 μF
• Available capacitance tolerances of ±10% and ±20%
Higher capacitance in the same footprint
Potential board space savings
Advanced protection against thermal and mechanical stress
Provides up to 10 mm of board flex capability
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© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1038_X8L_KPS_150C_SMD • 1/9/2017 2
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade)
Packaging C-Spec Ordering Options Table
Packaging Type1Packaging/Grade
Ordering Code (C-Spec)2
Commercial Grade
7" Reel (Embossed Plastic Tape)/Unmarked
7186
13" Reel (Embossed Plastic Tape)/Unmarked
7289
Automotive Grade
7" Reel (Embossed Plastic Tape)/Unmarked
AUTO
13" Reel (Embossed Plastic Tape)/Unmarked
AUTO7289
1 The terms "Marked" and "Unmarked" pertain to laser marking option of capacitors. All packaging options labeled as "Unmarked" will contain capacitors
that have not been laser marked. The option to laser mark is not available on these devices. For more information see "Capacitor Marking".
2 For additional Information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information".
Benefits cont'd
Reduces audible, microphonic noise
Extremely low ESR and ESL
Lead (Pb)-free, RoHS and REACH compliant
Capable of Pb-free reflow profiles
• Non-polar device, minimizing installation concerns
Tantalum and electrolytic alternative
Commercial and Automotive (AEC-Q200) grades available
Applications
Typical applications include smoothing circuits, DC/DC converters, power supplies (input/output filters), noise reduction
(piezoelectric/mechanical), circuits with a direct battery or power source connection, critical and safety relevant circuits
without (integrated) current limitation and any application that is subject to extreme environments such as high temperature,
high levels of board flexure and/or temperature cycling. Markets include industrial, aerospace, automotive, and telecom.
Qualification/Certification
Commercial Grade products are subject to internal qualification. Details regarding test methods and conditions are
referenced in Table 4, Performance & Reliability.
Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details
regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive
Components. For additional information regarding the Automotive Electronics Council and AEC–Q200, please visit their
website at www.aecouncil.com.
Environmental Compliance
Lead (Pb)-free, RoHS, and REACH compliant without exemptions.
ammmc compmm KEIVIEI' crummy:
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1038_X8L_KPS_150C_SMD • 1/9/2017 3
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade)
Automotive C-Spec Information
KEMET Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council.
Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualifi cation for Passive
Components. These products are supported by a Product Change Notifi cation (PCN) and Production Part Approval Process
warrant (PPAP).
Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec,
AUTO”. This C-Spec was developed in order to better serve small and medium sized companies that prefer an automotive
grade component without the requirement to submit a customer Source Controlled Drawing (SCD) or specifi cation for review
by a KEMET engineering specialist. This C-Spec is therefore not intended for use by KEMET’s OEM Automotive customers
and are not granted the same “privileges” as other automotive C-Specs. Customer PCN approval and PPAP request levels are
limited (see details below).
Product Change Notifi cation (PCN)
The KEMET Product Change Notifi cation system is used to communicate primarily the following types of changes:
• Product/process changes that affect product form, fi t, function, and/or reliability
• Changes in manufacturing site
• Product obsolescence
KEMET Automotive
C-Spec
Customer Notifi cation due to: Days prior to
implementation
Process/Product change Obsolescence*
KEMET assigned1Yes (with approval and sign off) Yes 180 days Minimum
AUTO Yes (without approval) Yes 90 days Minimum
1 KEMET assigned C-Specs require the submittal of a customer SCD or customer specifi cation for review. For additional information contact KEMET.
Production Part Approval Process (PPAP)
The purpose of the Production Part Approval Process is:
• To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts.
• To provide the evidence that all customer engineering design record and specifi cation requirements are properly
understood and
fulfi lled by the manufacturing organization.
• To demonstrate that the established manufacturing process has the potential to produce the part
KEMET Automotive
C-Spec
PPAP (Product Part Approval Process) Level
12345
KEMET assigned1●●●●●
AUTO ○ ○
1 KEMET assigned C-Specs require the submittal of a customer SCD or customer specifi cation for review. For additional information contact KEMET.
Part Number specifi c PPAP available
Product family PPAP only
ammm Compancnls KEIVIEI' EHARGED! Smgm 01 0000/2 :01): Snack TV P544 . A} Double cm): Slack 0 T1 Sing/e cm): Slack fifi 4Q, H 4d A )v 3.50 (0.130) 2.00 (0.102) 3.35 (0,132) 0.50 (0.032) 20.30 (0.012) 20.30 (0.012) 20.10 (0.004) 20.15 (0,000) 0.00 (0.230) 5.00 (0.107) 3.50 (0.130) 1.00 (0.003) 20.50 (0,020) 20.50 (0.020) 20.30 (0,012) 20.30 (0.012) 3.50 (0.130) 2.00 (0.102) 0.15 (0,242) 0.00 (0.031) 20.30 (0.012) 20.30 (0.012) 20.15 (0.000) 20.15 (0,000) 0.00 (0.230) 5.00 (0.107) 5.00 (0,197) 1.00 (0.003) 20.50 (0,020) 20.50 (0.020) 20.50 (0.020) 20.30 (0.012)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1038_X8L_KPS_150C_SMD • 1/9/2017 4
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade)
Dimensions – Millimeters (Inches)
L
L
H
H
W
LW LW
Chip
Stack
EIA
Size Code
Metric Size
Code
L
Length
W
Width
H
Height
LW
Lead Width
Mounting
Technique
Single
1210 3225
3.50 (0.138)
±0.30 (0.012)
2.60 (0.102)
±0.30 (0.012)
3.35 (0.132)
±0.10 (0.004)
0.80 (0.032)
±0.15 (0.006)
Solder Reflow
Only
2220 5650
6.00 (0.236)
±0.50 (0.020)
5.00 (0.197)
±0.50 (0.020)
3.50 (0.138)
±0.30 (0.012)
1.60 (0.063)
±0.30 (0.012)
Double
1210 3225
3.50 (0.138)
±0.30 (0.012)
2.60 (0.102)
±0.30 (0.012)
6.15 (0.242)
±0.15 (0.006)
0.80 (0.031)
±0.15 (0.006)
2220 5650
6.00 (0.236)
±0.50 (0.020)
5.00 (0.197)
±0.50 (0.020)
5.00 (0.197)
±0.50 (0.020)
1.60 (0.063)
±0.30 (0.012)
Electrical Parameters/Characteristics
Item Parameters/Characteristics
Operating Temperature Range −55°C to +150°C
Capacitance Change with Reference to
+25°C and 0 VDC Applied (TCC) ±15% (−55ºC to 125ºC), +15, −40% (125ºC to 15C)
1Aging Rate (Maximum % Capacitance Loss/Decade Hour) 3.0%
2Dielectric Withstanding Voltage (DWV)
250% of rated voltage
(5±1 seconds and charge/discharge not exceeding 50 mA)
3Dissipation Factor (DF) Maximum Limit at 25°C 3.5% ( ≤ 16V) and 2.5% ( ≥ 25V)
4Insulation Resistance (IR) Minimum Limit at 25°C
500 megohm microfarads or 10 GΩ
(Rated voltage applied for 120±5 seconds at 25°C)
1 Regarding Aging Rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours.
2 DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the
capacitor.
3 Capacitance and dissipation factor (DF) measured under the following conditions:
1kHz ± 50Hz and 1.0 ± 0.2 Vrms if capacitance ≤ 10µF
120Hz ± 10Hz and 0.5 ± 0.1 Vrms if capacitance > 10µF
4 To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 & Agilent E4980 have a feature known as
Automatic Level Control (ALC). The ALC feature should be switched to "ON".
ammmc compmm KEIVIEI' crummy: Iplc am FV FW GR JP JR 121D 121D 1812 Z220 Z220 335:0JU 6J5:0J5 500:050 350:03U 500:050 ooooo 60D 300 40D 300 2% LOUD LUOO L7U0 L300 800
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1038_X8L_KPS_150C_SMD • 1/9/2017 5
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade)
Post Environmental Limits
High Temperature Life, Biased Humidity, Moisture Resistance
Dielectric Rated DC
Voltage
Capacitance
Value
Dissipation Factor
(Maximum %)
Capacitance
Shift
Insulation
Resistance
X8L ≥ 25 All 3.0 ±20% 10% of Initial
Limit
≤ 16 5.0
Table 1 – Capacitance Range/Selection Waterfall (1210 – 2220 Case Sizes)
Capacitance Cap
Code
Case Size/
Series C1210C C1812C C2220C
Voltage Code 84351A4351A84351A
Rated Voltage (VDC) 10 16 25 50 100 250 16 25 50 100 250 10 16 25 50 100 250
Capacitance
Tolerance
Product Availability and Chip Thickness Codes – See Table 2 for Chip Thickness Dimensions
Single Chip Stack
0.47 µF 474 K M FV FV FV FV
1.0 µF 105 K M FV FV FV FV
2.2 µF 225 K M FV FV FV JP JP JP
3.3 µF 335 K M FV FV FV JP JP JP
4.7 µF 475 K M FV FV FV JP JP JP
10 µF 106 K M JP JP JP
15 µF 156 K M JP
22 µF 226 K M JP
Double Chip Stack
1.0 µF 105 MFW FW FW FW
2.2 µF 225 MFW FW FW FW
3.3 µF 335 MFW FW FW
4.7 µF 475 MFW FW FW GR GR GR JR JR JR
10 µF 106 MFW FW FW JR JR JR
22 µF 226 MJR JR JR
33 µF 336 MJR
47 µF 476 M JR
Capacitance Cap
Code
Rated Voltage (VDC) 10 16 25 50 100 250 4351A10 16 25 50 100 250
Voltage Code 8 4 3 5 1 A 16 25 50 100 250 8 4 3 5 1 A
Case Size/
Series C1210C C1812C C2220C
These products are protected under US Patent 8,331,078 other patents pending, and any foreign counterparts.
Table 2 – Chip Thickness/Tape & Reel Packaging Quantities
Thickness
Code
Case
Size
Thickness ±
Range (mm)
Paper Quantity Plastic Quantity
7" Reel 13" Reel 7" Reel 13" Reel
FV
1210
3.35 ± 0.10
0
0
600
2,000
FW
1210
6.15 ± 0.15
0
0
300
1,000
GR
1812
5.00 ± 0.50
0
0
400
1,700
JP
2220
3.50 ± 0.30
0
0
300
1,300
JR
2220
5.00 ± 0.50
0
0
200
800
Package quantity based on finished chip thickness specifications.
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© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1038_X8L_KPS_150C_SMD • 1/9/2017 6
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade)
Table 3 – KPS Land Pattern Design Recommendations (mm)
EIA SIZE
CODE
METRIC
SIZE
CODE
Median (Nominal) Land
Protrusion
C
Y
X
V1
V2
1210 3225 1.50 1.14 1.75 5.05 3.40
2220 5650 2.69 2.08 4.78 7.70 6.00
Image at right based on an EIA 1210 case size.
Soldering Process
KEMET’s KPS Series devices are compatible with IR
reflow techniques. Preheating of these components is
recommended to avoid extreme thermal stress. KEMET's
recommended profile conditions for IR reflow reflect the
profile conditions of the IPC/J–STD–020D standard for
moisture sensitivity testing.
To prevent degradation of temperature cycling capability,
care must be taken to prevent solder from flowing into
the inner side of the lead frames (inner side of "J" lead in
contact with the circuit board).
After soldering, the capacitors should be air cooled to
room temperature before further processing. Forced air
cooling is not recommended.
Hand soldering should be performed with care due to the
difficulty in process control. If performed, care should be
taken to avoid contact of the soldering iron to the capacitor
body. The iron should be used to heat the solder pad,
applying solder between the pad and the lead, until reflow
occurs. Once reflow occurs, the iron should be removed
immediately. (Preheating is required when hand soldering to
avoid thermal shock.)
Profile Feature SnPb Assembly Pb-Free Assembly
Preheat/Soak
Temperature Minimum (T
Smin
)100°C 150°C
Temperature Maximum (T
Smax)
150°C 200°C
Time (t
s
) from T
smin
to T
smax
) 60 – 120 seconds 60 – 120 seconds
Ramp-up Rate (T
L
to T
P
)3°C/seconds maximum 3°C/seconds maximum
Liquidous Temperature (T
L
)183°C 217°C
Time Above Liquidous (t
L
) 60 – 150 seconds 60 – 150 seconds
Peak Temperature (T
P
)235°C 250°C
Time within 5°C of Maximum
Peak Temperature (t
P
)20 seconds maximum 10 seconds maximum
Ramp-down Rate (T
P
to T
L
)6°C/seconds maximum 6°C/seconds maximum
Time 25°C to Peak
Temperature 6 minutes maximum 8 minutes maximum
Note: All temperatures refer to the center of the package, measured on the
package body surface that is facing up during assembly reflow.
Time
Temperature
Tsmin
25
Tsmax
TL
TPMaximum Ramp Up Rate = 3ºC/sec
Maximum Ramp Down Rate = 6ºC/sec
tP
tL
ts
25ºC to Peak
Y
C C
X X V2
Grid Placement Courtyard
Y
V1
Ermmmc Compancnl: KEIl/IEI' CHARGED! MlLiSTDiZDZ Method 106 MlLiSTDiZDZ Method 107 MlLiSTDiZDZ Method 103 MlLiSTDiZDZ Method 103 5 g‘s tor 20 minutes, 12 cycles each at 3 orientations. Note: Use 3" X 5" PCB .031" thick, 7 secure points on one long side and 2 secure points at corners of mounted Within 2" from any secure DDIHL Test (mm 10 7 2,000 Hz. MlLiSTDiZDZ Method 213 MlLiSTDiZDZ Method 215
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1038_X8L_KPS_150C_SMD • 1/9/2017 7
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade)
Table 4 – Performance & Reliability: Test Methods and Conditions
Stress Reference Test or Inspection Method
Terminal Strength JIS–C–6429 Appendix 1, Note: Force of 1.8 kg for 60 seconds.
Board Flex JIS–C–6429 Appendix 2, Note: 5.0 mm minimum
Solderability J–STD–002
Magnification 50 X. Conditions:
a) Method B, 4 hours at 155°C, dry heat at 235°C
b) Method B at 215°C category 3
c) Method D, category 3 at 25C
Temperature Cycling JESD22 Method JA–104 1,000 cycles (−55°C to +150°C). Measurement at 24 hours +/−4 hours after test conclusion.
Biased Humidity MIL–STD–202 Method
103
Load Humidity: 1,000 hours 85°C/85% RH and rated voltage. Add 100 K ohm resistor.
Measurement at 24 hours +/−4 hours after test conclusion.
Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor.
Measurement at 24 hours +/−4 hours after test conclusion.
Moisture Resistance
MILSTD202 Method
106
t = 24 hours/cycle. Steps 7a and 7b not required.
Measurement at 24 hours +/−4 hours after test conclusion.
Thermal Shock
MILSTD202 Method
107
−55°C/+150°C. Note: Number of cycles required – 300, maximum transfer time – 20
seconds, Dwell time – 15 minutes. Air – Air.
High Temperature Life
MILSTD202 Method
108
1,000 hours at 150°C with rated voltage applied.
Storage Life
MILSTD202 Method
108
150°C, 0 VDC for 1,000 hours.
Vibration MIL–STD–202 Method
204
5 g's for 20 minutes, 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB .031" thick,
7 secure points on one long side and 2 secure points at corners of opposite sides. Parts
mounted within 2" from any secure point. Test from 10 – 2,000 Hz.
Mechanical Shock
MILSTD202 Method
213
Figure 1 of Method 213, Condition F.
Resistance to Solvents
MILSTD202 Method
215
Add aqueous wash chemical, OKEM Clean or equivalent.
Storage & Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in
other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,
and long term storage. In addition, packaging materials will be degraded by high temperature–reels may soften or warp
and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum
storage humidity not exceed 70% relative humidity. Temperature fluctuations should be minimized to avoid condensation on
the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock
should be used promptly, preferably within 1.5 years of receipt.
.................... CHARGED!
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1038_X8L_KPS_150C_SMD • 1/9/2017 8
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade)
Construction
Dielectric Material
(BaTiO3)
Detailed Cross Section
Barrier Layer
(Ni)
Inner Electrodes
(Ni)
Termination Finish
(Sn)
Barrier Layer
(Ni)
Termination Finish
(Sn)
Inner Electrodes
(Ni)
Dielectric Material
(BaTiO3)
Leadframe Attach
(High Melting Point Solder)
Leadframe
(Phosphor Bronze - Alloy 510)
End Termination/
External Electrode
(Cu)
End Termination/
External Electrode
(Cu)
Product Marking
Laser marking option is not available on:
C0G, Ultra Stable X8R and Y5V dielectric devices
EIA 0402 case size devices
EIA 0603 case size devices with Flexible Termination option.
KPS Commercial and Automotive grade stacked devices.
These capacitors are supplied unmarked only.
Embossed Calriel Embossmem '3 130mm (7.0“) or mmm (13.0”) Top Tape Thickness / .10mm{.m4‘] Max Thickness ammmc Compononl: KEIVIEI' CHARGED.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1038_X8L_KPS_150C_SMD • 1/9/2017 9
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade)
Tape & Reel Packaging Information
KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with
EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for
details on reeling quantities for commercial chips.
Table 4 – Carrier Tape Confi guration – Embossed Plastic (mm)
EIA Case Size Tape Size (W)* Pitch (P
1
)*
01005 – 0402 8 2
0603 – 1210 8 4
1805 – 1808 12 4
≥ 1812 12 8
KPS 1210 12 8
KPS 1812 & 2220 16 12
Array 0508 & 0612 8 4
*Refer to Figure 1 for W and P1 carrier tape reference locations.
*Refer to Table 5 for tolerance specifi cations.
Eiecxmmc Compancnls KEIVIEI' EHARGED: ‘ 1 (i ‘> c tawny: D, Minimum R Reference 8, Minimum T T, Nme 1 Nme 2 Note 3 Maximum Maximim 1.0 25 0 (0.039) (0.984) BY Maximum T2 W Nme 4 Maximum Maximum 4 35 6 25 3.51005 4.01010 2.5 8 3 (0171) (0.246) (013810.002) (015710 004) (0.098) (0.327) Slngle (4 mm) 8 8.2 10.25 5 510.05 8.01010 4.6 12.3 Daubie (0 mm) (0.323) (0 404) (0.21710 002) (0 315:0 004) (0.101) (0.404) 12.1 14.25 7.51005 12 .10 4.6 16.3 (0476) (0 561) (013810.002) (015710 004) (0181) (0.642)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1038_X8L_KPS_150C_SMD • 1/9/2017 10
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
Po
T
F
W
Center Lines of Cavity
Ao
Bo
User Direction of Unreeling
Cover Tape
Ko
B
1
is for tape feeder reference only,
including draft concentric about B
o
.
T
2
ØD
1
ØDo
B
1
S
1
T
1
E
1
E
2
P
1
P
2
Embossment
For cavity size,
see Note 1 Table 4
[10 pitches cumulative
tolerance on tape ± 0.2 mm]
Table 5 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size D0
D
1
Minimum
Note 1
E1P0P2
R Reference
Note 2
S
1
Minimum
Note 3
T
Maximum
T
1
Maximim
8 mm
1.5+0.10/0.0−0.0
(0.059+0.004/−0.0)
1.0
(0.039)
1.75±0.10
(0.060.004) 4.0±0.10
(0.157±0.004) 2.0±0.05
(0.070.002)
25.0
(0.984)
0.600
(0.024) 0.600
(0.024) 0.100
(0.004)
12 mm 1.5
(0.059) 30
(1.181)
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size Pitch
B
1
Maximum
Note 4
E2 Minimum F P1
T
2
Maximum
W
Maximum
A0, B0 & K0
8 mm Single (4 mm)
4.35
(0.171)
6.25
(0.246)
3.5±0.05
(0.138±0.002)
4.0±0.10
(0.157±0.004)
2.5
(0.098)
8.3
(0.327)
Note 512 mm
Single (4 mm) &
Double (8 mm)
8.2
(0.323)
10.25
(0.404)
5.5±0.05
(0.217±0.002)
8.0±0.10
(0.315±0.004)
4.6
(0.181)
12.3
(0.484)
16 mm Triple (12 mm)
12.1
(0.476)
14.25
(0.561)
7.5±0.05
(0.138±0.002)
12.0±0.10
(0.157±0.004)
4.6
(0.181)
16.3
(0.642)
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment
location and hole location shall be applied independent of each other.
2. The tape with or without components shall pass around R without damage (see Figure 5).
3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b).
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity defi ned by A0, B0 and K0 shall surround the component with suffi cient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 2).
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see
Figure 3).
(e) for KPS Series product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
cccccccccccccccccccc Emma): e 7/////////////////////l‘ e O @379
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1038_X8L_KPS_150C_SMD • 1/9/2017 11
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade)
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 Kg minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width Peel Strength
8 mm 0.1 to 1.0 Newton (10 to 100 gf)
12 and 16 mm 0.1 to 1.3 Newton (10 to 130 gf)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be
165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of
300 ±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA
Standards 556 and 624.
Figure 2 – Maximum Component Rotation
Ao
Bo
°
T
°
s
Maximum Component Rotation
Top View
Maximum Component Rotation
Side View
Tape Maximum
Width (mm) Rotation (°
T)
8,12 20
16 – 200 10 Tape Maximum
Width (mm) Rotation ( °
S)
8,12 20
16 – 56 10
72 – 200 5
Typical Pocket Centerline
Typical Component Centerline
Figure 3 – Maximum Lateral Movement
0.5 mm maximum
0.5 mm maximum
8 mm & 12 mm Tape
1.0 mm maximum
1.0 mm maximum
16 mm Tape
Figure 4 – Bending Radius
RR
Bending
Radius
Embossed
Carrier
Punched
Carrier
ammm Compancnls KEIVIEI' Emma): 3.4+1 5/70 0 (a 331+0.059/70.o) 12.4+2 0/70 0 (0.4mm 07340.0) 16 4410/7041 (044640378400) 14.4 (a 567) 15.4 (0.724) 22.4 (o 882)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1038_X8L_KPS_150C_SMD • 1/9/2017 12
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade)
Figure 5 – Reel Dimensions
AD(See Note)
Full Radius,
See Note
B(see Note)
Access Hole at
Slot Location
(Ø 40 mm minimum)
If present,
tape slot in core
for tape start:
2.5 mm minimum width x
10.0 mm minimum depth
W3 (Includes
flange distortion
at outer edge)
W2 (Measured at hub)
W1 (Measured at hub)
C
(Arbor hole
diameter)
Note: Drive spokes optional; if used, dimensions B and D shall apply.
N
Table 6 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size A B Minimum CD Minimum
8 mm 178±0.20
(7.008±0.008)
or
330±0.20
(13.000±0.008)
1.5
(0.059) 13.0+0.5/−0.2
(0.521+0.02/−0.008) 20.2
(0.795)
12 mm
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size N Minimum W1 W2 Maximum W3
8 mm
50
(1.969)
8.4+1.5/0.0
(0.331+0.059/0.0)
14.4
(0.567)
Shall accommodate tape
width without interference
12 mm
12.4+2.0/0.0
(0.488+0.078/0.0)
18.4
(0.724)
16 mm
16.4+2.0/0.0
(0.646+0.078/0.0)
22.4
(0.882)
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© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1038_X8L_KPS_150C_SMD • 1/9/2017 13
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade)
Figure 6 – Tape Leader & Trailer Dimensions
Trailer
160 mm Minimum
Carrier Tape
END START
Round Sprocket Holes
Elongated Sprocket Holes
(32 mm tape and wider)
Top Cover Tape
Top Cover Tape
Punched Carrier
8 mm & 12 mm only
Embossed Carrier
Components
100 mm
Minimum Leader
400 mm Minimum
Figure 7 – Maximum Camber
Carrier Tape
Round Sprocket Holes
1 mm Maximum, either direction
Straight Edge
250 mm
Elongated sprocket holes
(32 mm & wider tapes)
ammm Compancnls KEIVIEI' cumin:
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1038_X8L_KPS_150C_SMD • 1/9/2017 14
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KPS HT Series, High Temperature 150°C, X8L Dielectric, 10 VDC – 50 VDC (Commercial & Automotive Grade)
KEMET Electronic Corporation Sales Offi ces
For a complete list of our global sales offi ces, please visit www.kemet.com/sales.
Disclaimer
All product specifi cations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for
checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed.
All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.
Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET) knowledge of typical operating conditions for such
applications, but are not intended to constitute – and KEMET specifi cally disclaims – any warranty concerning suitability for a specifi c customer application or use.
The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any
technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no
obligation or liability for the advice given or results obtained.
Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component
failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards
(such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or
property damage.
Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other
measures may not be required.
KEMET is a registered trademark of KEMET Electronics Corporation.

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