ASMB-TTF0-0A20B~ Datasheet by Broadcom Limited

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Data Sheet
Broadcom ASMB-TTF0-0A20B-DS101
October 23, 2017
Overview
The Broadcom® ASMB-TTF0 is a tricolor PLCC6 LED with
individually addressable pins for each color. It is designed
specifically for outdoor full color display whereby the black
outer appearance provides enhanced display contrast
without sacrificing its brightness. The short-lead design
enables easier potting process.
To facilitate easy pick-and-place assembly, the LEDs are
packed in a tape and reel format. Every reel is shipped in
single intensity and color bin to ensure uniformity.
Features
PLCC-6 package with black outer appearance
Diffused encapsulation
Compatible with reflow soldering process
MSL 5a
Applications
Outdoor full color display
CAUTION!
This LED is ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to application
note AN-1142 for additional details.
ASMB-TTF0-0A20B
3735 Tricolor PLCC-6 LED
2.80fl 5 mus: mama
Broadcom ASMB-TTF0-0A20B-DS101
2
ASMB-TTF0-0A20B Data Sheet 3735 Tricolor PLCC-6 LED
Figure 1: Package Drawing
NOTE:
1. Tolerance is ±0.20 mm unless otherwise specified.
2. Encapsulation = epoxy.
3. Terminal finish = silver plating.
Table 1: Pin Configuration
Pin No. Configuration
1 Red Anode
2 Red Cathode
3 Green Anode
4 Green Cathode
5 Blue Anode
6 Blue Cathode
Broadcom ASMB-TTF0-0A20B-DS101
3
ASMB-TTF0-0A20B Data Sheet 3735 Tricolor PLCC-6 LED
Absolute Maximum Ratings
Optical Characteristics (TJ = 25°C, IF = 20 mA)
Electrical Characteristics (TJ = 25°C)
Parameters Red Green Blue Units
DC Forward Currenta
a. Derate linearly as shown in Figure 8 and Figure 9.
50 30 30 mA
Peak Forward Currentb
b. Duty factor = 10%, frequency = 1 kHz.
100 100 100 mA
Power Dissipation 120 108 108 mW
Reverse Voltage Not recommended for reverse bias
LED Junction Temperature 105 °C
Operating Temperature Range –40 to +100 °C
Storage Temperature Range –40 to +100 °C
Color
Luminous Intensity, IV (mcd)a
a. The luminous intensity, IV is measured at the mechanical axis of LED package and it is tested with mono pulse condition. The actual peak
of the spatial radiation pattern may not be aligned with the axis.
Dominant Wavelength, λd (nm)b
b. The dominant wavelength, λd is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.
Peak
Wavelength, λp
(nm)
Viewing Angle,
2θ½ (°)c
c. θ½ is the off-axis angle where the luminous intensity is half of the peak intensity.
Min. Typ. Max. Min. Typ. Max. Typ. Typ.
Red 640 710 910 618 620 628 628 110
Green 1600 1840 2210 519 524 529 518 110
Blue 355 410 490 464 471 474 467 110
Color
Forward Voltage VF (V)a
a. Tolerance =± 0.1V.
Reverse Voltage, VR (V)
at IR = 10 µAb
b. Indicates product final testing. Long term reverse bias is not recommended.
Thermal Resistance, RθJ-S
(°C/W)c
c. Thermal resistance from LED junction to solder point.
1 Chip On 3 Chips On
Min. Typ. Max. Max. Typ. Typ.
Red 1.80 2.10 2.40 4.0 314 314
Green 2.70 2.90 3.60 4.0 360 360
Blue 2.70 2.90 3.60 4.0 410 410
ASMB-TTF0-0A20B Data Sheet 3735 Tricolor PLCC-6 LED
Broadcom ASMB-TTF0-0A20B-DS101
4
Part Numbering System
Luminous Bin Limits (CAT)
Tolerance = ±12%
Bin Information
Example of bin information on reel and packaging label:
Color Bin Limits (BIN) – Red
Tol er an ce = ± 1 n m
ASMB - TTx
10-0x
2x3x4x5
Code Description Option
x1Package Type F Black outer appearance
x2Minimum Intensity Bin A Red: bin J5 Red: bin J5, J6
Green: bin S2, T2
Blue: bin H2, H3
Green: bin S2
Blue: bin H2
x3Number of Intensity Bins 2 2 intensity bins from minimum
x4Color Bin Combination 0 Red: full distribution
Green: bin G, H, P, J, K, L, M, N
Blue: bin B, C, D, E, F, W, X, Y
x5Test Option B Test Current = 20 mA
Bin ID
Luminous Intensity, IV (mcd)
Min. Max.
Red
J5 640 830
J6 700 910
Green
S2 1600 2080
T2 1700 2210
Blue
H2 355 462
H3 380 490
CAT : J2 R2 G2 Red intensity bin J2
Green intensity bin R2
Blue intensity bin G2
BIN : GB Green color bin G
Blue color bin B
Bin ID
Dominant Wavelength, λd
(nm)
Chromaticity
Coordinates
(for Reference)
Min. Max. x y
618.0 628.0 0.6873 0.3126
0.6837 0.3128
0.7014 0.2952
0.7052 0.2948
ASMB-TTF0-0A20B Data Sheet 3735 Tricolor PLCC-6 LED
Broadcom ASMB-TTF0-0A20B-DS101
5
Color Bin Limits (BIN) – Green
Tolerance = ±1 nm
Color Bin Limits (BIN) – Blue
Tol er an ce = ± 1 n m
Bin ID
Dominant Wavelength, λd
(nm)
Chromaticity
Coordinates
(for Reference)
Min Max x y
G 519 522 0.0667 0.8322
0.1254 0.7225
0.1435 0.7233
0.0899 0.8333
H 520 523 0.0743 0.8338
0.1313 0.7237
0.1497 0.7220
0.0979 0.8316
P 521 524 0.0821 0.8341
0.1373 0.7239
0.1560 0.7201
0.1060 0.8292
J 522 525 0.0899 0.8333
0.1435 0.7233
0.1624 0.7178
0.1142 0.8262
K 523 526 0.0979 0.8316
0.1497 0.7220
0.1688 0.7151
0.1223 0.8228
L 524 527 0.1060 0.8292
0.1560 0.7201
0.1751 0.7121
0.1305 0.8189
M 525 528 0.1142 0.8262
0.1624 0.7178
0.1815 0.7089
0.1387 0.8148
N 526 529 0.1223 0.8228
0.1688 0.7151
0.1878 0.7054
0.1468 0.8104
Bin ID
Dominant Wavelength, λd
(nm)
Chromaticity
Coordinates
(for Reference)
Min Max x y
B 464 467 0.1374 0.0374
0.1452 0.0492
0.1394 0.0574
0.1314 0.0459
C 465 468 0.1355 0.0399
0.1434 0.0516
0.1373 0.0608
0.1291 0.0495
D 466 469 0.1335 0.0427
0.1415 0.0543
0.1349 0.0646
0.1267 0.0534
E 467 470 0.1314 0.0459
0.1394 0.0574
0.1325 0.0688
0.1241 0.0578
F 468 471 0.1291 0.0495
0.1373 0.0608
0.1299 0.0734
0.1215 0.0626
W 469 472 0.1267 0.0534
0.1349 0.0646
0.1273 0.0784
0.1187 0.0678
X 470 473 0.1241 0.0578
0.1325 0.0688
0.1245 0.0840
0.1158 0.0736
Y 471 474 0.1215 0.0626
0.1299 0.0734
0.1216 0.0900
0.1128 0.0799
Broadcom ASMB-TTF0-0A20B-DS101
6
ASMB-TTF0-0A20B Data Sheet 3735 Tricolor PLCC-6 LED
Figure 2: Spectral Power Distribution Figure 3: Forward Current vs. Forward Voltage
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
380 430 480 530 580 630 680 730 780
RELATIVE INTENSITY
WAVELENGTH - nm
Red
Green
Blue
0
20
40
60
80
100
0.0 1.0 2.0 3.0 4.0 5.0
FORWARD CURRENT - mA
FORWARD VOLTAGE - V
Red
Green/ Blue
Figure 4: Relative Luminous Intensity vs. Mono Pulse Current
Figure 5: Dominant Wavelength Shift vs. Mono Pulse Current
0.0
0.5
1.0
1.5
2.0
2.5
0 102030405060
RELATIVE LUMINOUS INTENSITY - mcd
(NORMALIZED AT 20mA)
MONO PULSE CURRENT- mA
Red
Green
Blue
-4.0
-2.0
0.0
2.0
4.0
6.0
8.0
10.0
0 102030405060
DOMINANT WAVELENGTH SHIFT - nm
(NORMALIZED AT 20mA)
MONO PULSE CURRENT - mA
Red
Green
Blue
Figure 6: Relative Light Output vs. Junction Temperature Figure 7: Forward Voltage Shift vs. Junction Temperature
CAUTION: This LED is ESD sensitive. Please observe approp
application note AN-1142 for additional details.
0
20
40
60
80
100
120
140
160
-50 -25 0 25 50 75 100 125
RELATIVE LIGHT OUTPUT - %
(NORMALIZED AT 25°C)
JUNCTION TEMPERATURE, TJ - °C
Red
Green
Blue
precautions during handling and processing. Refer to
-0.20
-0.10
0.00
0.10
0.20
0.30
0.40
-50 -25 0 25 50 75 100 125
FORWARD VOLTAGE SHIFT - V
(NORMALIZED AT 25°C)
JUNCTION TEMPERATURE, TJ - °C
Red
Green
Blue
Broadcom ASMB-TTF0-0A20B-DS101
7
ASMB-TTF0-0A20B Data Sheet 3735 Tricolor PLCC-6 LED
Figure 8: Maximum Forward Current vs. Ambient
Temperature for Red, Green and Blue (1 chip and 3 chips on)
Figure 9: Maximum Forward Current vs. Solder Temperature
for Red, Green, and Blue (1 chip and 3 chips on)
0
10
20
30
40
50
60
0 20 40 60 80 100 120
MAX. ALLOWABLE DC CURRENT - mA
AMBIENT TEMPERATURE, T
A
- °C
Red
Green
Blue
0
10
20
30
40
50
60
0 20 40 60 80 100 120
MAX. ALLOWABLE DC CURRENT - mA
SOLDER POINT TEMPERATURE, T
S
- °C
Red
Green
Blue
NOTE: Maximum forward current graphs based on ambient temperature (TA) above are with reference to the thermal
resistance RqJ-A in the following table. See Precautionary Notes for more details.
Condition
Thermal Resistance from LED Junction to Ambient, RqJ-A (°C/W)
Red Green Blue
1 chip and 3 chips on 644 690 740
Figure 10: Radiation Pattern for x-axis Figure 11: Radiation Pattern for y-axis
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
-90 -60 -30 0 30 60 90
RELATIVE INTENSITY
ANGULAR DISPLACEMENT - DEGREES
Red
Green
Blue
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
-90 -60 -30 0 30 60 90
RELATIVE INTENSITY
ANGULAR DISPLACEMENT - DEGREES
Red
Green
Blue
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Broadcom ASMB-TTF0-0A20B-DS101
8
ASMB-TTF0-0A20B Data Sheet 3735 Tricolor PLCC-6 LED
Figure 12: Recommended Soldering Land Pattern
NOTE: All dimensions are in millimeters (mm).
Figure 13: Carrier Tape Dimensions
NOTE:
1. All dimensions are in millimeters (mm).
2. Tolerance is ±0.20 mm unless otherwise specified.
Figure 14: Reel Dimensions
NOTE: All dimensions are in millimeters (mm).
1.6
0.7
0.35
4.6
1.6
0
0
0
14.3 ±0.2
16.7 ±0.3
330.2 ±2.0
79.5
12.7 ±0.3
255 — 160T % l—l 217°C / EDD DDD‘ / /,¥ G / / \ EDD, \DDD \ / REFLDW museum
ASMB-TTF0-0A20B Data Sheet 3735 Tricolor PLCC-6 LED
Broadcom ASMB-TTF0-0A20B-DS101
9
Precautionary Notes
Soldering
Do not perform reflow soldering more than twice.
Observe necessary precautions of handling moisture-
sensitive devices as stated in the following section.
Do not apply any pressure or force on the LED during
reflow and after reflow when the LED is still hot.
Use reflow soldering to solder the LED. Use hand
soldering only for rework if unavoidable, but it must be
strictly controlled to following conditions:
Soldering iron tip temperature = 315°C maximum
Soldering duration = 3s maximum
Number of cycles = 1 only
Power of soldering iron = 50W maximum
Do not touch the LED package body with the soldering
iron except for the soldering terminals, because it may
cause damage to the LED.
Confirm beforehand whether the functionality and
performance of the LED is affected by soldering with
hand soldering.
Figure 15: Recommended Lead-Free Reflow Soldering Profile
Figure 16: Recommended Board Reflow Direction
Handling Precautions
Special handling precautions must be observed during
assembly of epoxy encapsulated LED products. Failure to
comply might lead to damage and premature failure of the
LED.
Do not stack assembled PCBs together. Use an
appropriate rack to hold the PCBs.
For automated pick-and-place, Broadcom has tested a
nozzle size with OD 3.5 mm to work with this LED.
However, due to the possibility of variations in other
parameters, such as pick-and-place machine maker/
model, and other settings of the machine, verify that the
selected nozzle will not cause damage to the LED.
Handling of Moisture-Sensitive Devices
This product has a Moisture Sensitive Level 5a rating per
JEDEC J-STD-020. Refer to Broadcom Application Note
AN5305, Handling of Moisture Sensitive Surface Mount
Devices for additional details and a review of proper
handling procedures.
Before use:
An unopened moisture barrier bag (MBB) can be
stored at <40°C/90% RH for 12 months. If the actual
shelf life has exceeded 12 months and the humidity
indicator card (HIC) indicates that baking is not
required, it is safe to reflow the LEDs per the original
MSL rating.
Do not open the MBB prior to assembly (for
example, for IQC). If unavoidable, the MBB must be
properly resealed with fresh desiccant and HIC. The
exposed duration must be taken in as floor life.
Control after opening the MBB:
Read the HIC immediately upon opening of MBB.
Keep the LEDs at <30°C/60% RH at all times, and
complete all high temperature-related processes,
i
ncluding soldering, curing, or rework within 24 hours.
Control for unfinished reel:
Store unused LEDs in a sealed MBB with desiccant or a
desiccator at <5% RH.
Control of assembled boards:
If the PCB soldered with the LEDs is to be subjected to
other high-temperature processes, store the PCB in a
sealed MBB with desiccant or desiccator at <5% RH to
ensure that all LEDs have not exceeded their floor life of
24 hours.
10 to 30 SEC.
6°C/SEC. MAX.
255 – 260°C
3°C/SEC. MAX.
217°C
200°C
150°C
3°C/SEC. MAX.
60 – 120 SEC. 100 SEC. MAX.
TIME
TEMPERATURE
Ts Point mm: mm
ASMB-TTF0-0A20B Data Sheet 3735 Tricolor PLCC-6 LED
Broadcom ASMB-TTF0-0A20B-DS101
10
Baking is required if:
The HIC indicator indicates a change in color for
10% and 5%, as stated on the HIC.
The LEDs are exposed to conditions of > 30°C/60%
RH at any time.
The LED's floor life exceeded 24 hours.
The recommended baking condition is: 65°C ± 5ºC for
24 hours.
Baking can only be done once.
Storage:
The soldering terminals of these Broadcom LEDs are
silver plated. If the LEDs are exposed in ambient
environments for too long, the silver plating might be
oxidized, thus affecting its solderability performance. As
such, keep unused LEDs in a sealed MBB with
desiccant or in a desiccator at < 5% RH.
Application Precautions
The drive current of the LED must not exceed the
maximum allowable limit across temperature as stated
in the data sheet. Constant current driving is
recommended to ensure consistent performance.
Circuit design must cater to the whole range of forward
voltage (VF) of the LEDs to ensure the intended drive
current can always be achieved.
The LED exhibits slightly different characteristics at
different drive currents, which may result in a larger
variation of performance (meaning: intensity,
wavelength, and forward voltage). Set the application
current as close as possible to the test current to
minimize these variations.
The LED is not intended for reverse bias. Use other
appropriate components for such purposes. When
driving the LED in matrix form, ensure that the reverse
bias voltage does not exceed the allowable limit of the
LED.
As actual application might not be exactly similar to the
test conditions, do verify that the LED will not be
damaged by prolonged exposure in the intended
environment.
Avoid rapid changes in ambient temperature, especially
in high-humidity environments, because they cause
condensation on the LED.
If the LED is intended to be used in harsh or outdoor
environments, protect the LED against damages
caused by rain water, water, dust, oil, corrosive gases,
external mechanical stresses, and so on.
Thermal Management
The optical, electrical, and reliability characteristics of the
LED are affected by temperature. Keep the junction
temperature (TJ) of the LED below the allowable limit at all
times. TJ can be calculated as follows:
TJ = TA + RθJ-A × IF × VFmax
where;
TA = ambient temperature (°C)
RθJ-A = thermal resistance from LED junction to ambient
(°C/W)
IF = forward current (A)
VFmax = maximum forward voltage (V)
The complication of using this formula lies in TA and RθJ-A.
Actual TA is sometimes subjective and hard to determine.
RθJ-A varies from system to system depending on design
and is usually not known.
Another way of calculating TJ is by using the solder point
temperature, TS as follows:
TJ = TS + RθJ-S × IF × VFmax
where;
TS = LED solder point temperature as shown in the
following figure (°C)
RθJ-S = thermal resistance from junction to solder point
(°C/W)
IF = forward current (A)
VFmax = maximum forward voltage (V)
Figure 17: Solder Point Temperature on PCB
TS can be easily measured by mounting a thermocouple on
the solder joint as shown in preceding figure, while RθJ-S is
provided in the data sheet. Verify the TS of the LED in the
final product to ensure that the LEDs are operating within all
maximum ratings stated in the data sheet.
ASMB-TTF0-0A20B Data Sheet 3735 Tricolor PLCC-6 LED
Broadcom ASMB-TTF0-0A20B-DS101
11
Eye Safety Precautions
LEDs may pose optical hazards when in operation. Do not
look directly at operating LEDs because it might be harmful
to the eyes. For safety reasons, use appropriate shielding or
personal protective equipment.
9 BROADCOM”
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