T510 Series Datasheet by KEMET

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© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com T2014_T510 • 12/5/2017 1
One world. One KEMET
Benefits
Meets or exceeds EIA Standard 535BAAC
Taped and reeled per EIA 481
High surge current capability
Optional gold-plated terminations
• High ripple current capability
100% surge current test
• 100% steady-state accelerated aging
• Capacitancevaluesof10μFto1,000μF
Tolerances of ±10% and ±20%
Voltage rating of 4 to 50 VDC
Case sizes E and X
• ESRaslowas10mΩ
RoHS Compliant and lead-free terminations
• Operatingtemperaturerangeof−55°Cto+125°C
Overview
The low ESR, surge-robust T510 is designed for demanding
applications that require high surge current and high ripple
current capability. This series builds upon the proven
capabilities of our industrial grade tantalum chip capacitors
to offer several advantages such as low ESR, high ripple
current capability, excellent capacitance stability, and
improvedresistancetohighin-rushcurrents.Thesebenefits
are achieved though the utilization of multiple anodes as
well as high-stress, low impedance electrical conditioning
performedpriortoscreening.Thisseriesisclassified
as MSL (Moisture Sensitivity Level) 1 under J STD 020:
unlimitedfloorlifetimeat≤30°C/85%RH.
Tantalum Surface Mount Capacitors – Low ESR
T510 Multiple Anode MnO2
Applications
Typicalapplicationsincludedecouplingandfilteringinindustrialandautomotiveendapplications,suchasDC/DC
converters, portable electronics, telecommunications, and control units requiring high ripple current capability.
Environmental Compliance
RoHS Compliant (6/6) according to Directive 2002/95/EC when ordered with 100% Sn solder.
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© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com T2014_T510 • 12/5/2017 22
Tantalum Surface Mount Capacitors – Low ESR
T510 Multiple Anode MnO2
K-SIM
Foradetailedanalysisofspecificpartnumbers,pleasevisitksim.kemet.comtoaccessKEMETsK-SIMsoftware.KEMET
K-SIM is designed to simulate behavior of components with respect to frequency, ambient temperature, and DC bias levels.
Ordering Information
T510 X477 M006 AT E800
Capacitor
Class Series
Case
Size
Capacitance
Code(pF)
Capacitance
Tolerance
Rated
Voltage
(VDC)
FailureRate/
Design TerminationFinish ESR Packaging
(C-Spec)
T =
Tantalum
Multiple
Anode
Low ESR
E
X
Firsttwodigits
represent
significant
figures.Thirddigit
specifiesnumber
of zeros.
K = ±10%
M = ±20%
004 = 4
006 = 6.3
010 = 10
016 = 16
020 = 20
025 = 25
035 = 35
050 = 50
A = N/A
Z = N/A
T = 100% Matte Tin
(Sn) Plated
H = Standard Solder
Coated
(SnPb 5% Pb minimum)
G = Gold Plated
(A, B, C, D, X only)
Last three
digits specify
ESRinmΩ.
(800 = 800
mΩ)
Blank = 7" Reel
7280 = 13" Reel
Performance Characteristics
Item Performance Characteristics
Operating Temperature −55°Cto125°C
Rated Capacitance Range 10–1,000µFat120Hz/25°C
Capacitance Tolerance K Tolerance (10%), M Tolerance (20%)
Rated Voltage Range 4 – 50 V
DF(120Hz) RefertoPartNumberElectricalSpecificationTable
ESR (100 kHz) RefertoPartNumberElectricalSpecificationTable
Leakage Current ≤0.01CV(µA)atratedvoltageafter5minutes
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© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com T2014_T510 • 12/5/2017 33
Tantalum Surface Mount Capacitors – Low ESR
T510 Multiple Anode MnO2
Qualification
Test Condition Characteristics
Endurance 85°Catratedvoltage,2,000hours
125°Cat2/3ratedvoltage,2,000hours
ΔC/C Within ±10% of initial value
DF Within initial limits
DCL Within 1.25 x initial limit
ESR Within initial limits
Storage Life 125°C@0volts,2,000hours
ΔC/C Within ±10% of initial value
DF Within initial limits
DCL Within 1.25 x initial limit
ESR Within initial limits
Thermal Shock MIL–STD–202, Method 107, Condition B, mounted,
−55C°to125°C,1,000cycles
ΔC/C Within ±5% of initial value
DF Within initial limits
DCL Within 1.25 x initial limit
ESR Within initial limits
Temperature Stability
Extreme temperature exposure at a
successionofcontinuousstepsat+25°C,
−55°C,+25°C,+85°C,+125°C,+25°C
+25°C −5C +85°C +125°C
ΔC/C IL* ±10% ±10% ±20%
DF IL IL 1.5 x IL 1.5 x IL
DCL IL n/a 10 x IL 12 x IL
Surge Voltage 85°C,1.32xratedvoltage1,000cycles
(125°C,1.2xratedvoltage)
ΔC/C Within ±5% of initial value
DF Within initial limits
DCL Within initial limits
ESR Within initial limits
Mechanical Shock/
Vibration
MILSTD–202, Method 213, Condition I, 100 G peak
MILSTD–202, Method 204, Condition D, 10 Hz to
2,000 Hz, 20 G peak
ΔC/C Within ±10% of initial value
DF Within initial limits
DCL Within initial limits
*IL = Initial limit
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© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com T2014_T510 • 12/5/2017 44
Tantalum Surface Mount Capacitors – Low ESR
T510 Multiple Anode MnO2
Electrical Characteristics
1
10
100
100 1,000 10,000 100,000 1,000,000 10,000,000
Capacitance (μF)
Frequency (Hz)
T510X226M035ATE100
T510X336M035ATE065
T510E476M035ATE050
Capacitancevs.Frequency
Impedance,ESRvs.Frequency
0.01
0.1
1
10
100
100 1,000 10,000 100,000 1,000,000 10,000,000
Impedance, ESR (Ohms)
Frequency (Hz)
T510X226M035ATE100_IMP
T510X336M035ATE065_IMP
T510E476M035ATE050_IMP
T510X226M035ATE100_ESR
T510X336M035ATE065_ESR
T510E476M035ATE050_ESR
Dimensions – Millimeters (Inches)
Metric will govern
H
X
T
B
B
G
F
E
A
L
R
P
SIDE VIEW
ANODE (+) END VIEW BOTTOM VIEW
CATHODE (-) END VIEW
W
S
S
Termination cutout
at KEMET's option,
either end
Case Size Component Total
Weight
KEMET EIA L W H F±0.1
±(.004)
S ±0.3
±(.012)
B ±0.15
(Ref) ±.006
X
(Ref)
P
(Ref)
R
(Ref)
T
(Ref)
A
(Min)
G
(Ref)
E
(Ref) (mg)
X7343–43
4.3 ±0.3
(0.169 ±0.012)
4.0 ±0.3
(0.157 ±0.012)
2.4
(0.094)
1.3
(0.051)
0.5
(0.020)
1.7
(0.067)
1.0
(0.039)
0.13
(0.005)
3.8
(0.150)
3.5
(0.138)
3.5
(0.138)
430.15
E7360–38
6.0 ±0.3
(0.236 ±0.012)
3.6 ±0.2
(0.142 ±0.008)
4.1
(0.161)
1.3
(0.051)
0.5
(0.020)
n/a n/a
0.13
(0.005)
3.8
(0.150)
3.5
(0.138)
3.5
(0.138)
500.73
Notes: (Ref) – Dimensions provided for reference only. For low profile cases, no dimensions are provided for B, P or R because these cases do not have a bevel or
a notch.
These weights are provided as reference. If exact weights are needed, please contact your KEMET Sales Representative
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© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com T2014_T510 • 12/5/2017 55
Tantalum Surface Mount Capacitors – Low ESR
T510 Multiple Anode MnO2
Table 1 – Ratings & Part Number Reference
Rated
Voltage
Rated
Cap
Case
Code/
Case
Size
KEMET Part
Number
DC
Leakage DF ESR Maximum Allowable
Ripple Current
Maximum
Operating
Temp
MSL
VDC @ 85°C µF KEMET/EIA (See below for
part options) µA @ +20°C
Max/5 Min % @ +20°C
120 Hz Max
mΩ @ 20°C
100 kHz
Max
mA @ +25°C
100 kHz mA @ +85°C
100 kHz
mA @ +125°C
100 kHz °C
Reflow
Temp
260°C
4680 X/7343-43 T510X687(1)004A(2)E030 27.2 6.0 30 3000 2700 1200 125 1
41000 X/7343-43 T510X108(1)004A(2)E018 40.0 6.0 18 3873 3486 1549 125 1
41000 X/7343-43 T510X108(1)004A(2)E023 40.0 6.0 23 3426 3083 1370 125 1
41000 X/7343-43 T510X108(1)004A(2)E030 40.0 6.0 30 3000 2700 1200 125 1
41000 X/7343-43 T510X108(1)004A(2)E035 40.0 6.0 35 2777 2499 1111 125 1
41000 E/7360-38 T510E108(1)004A(2)E018 40.0 6.0 18 3979 3581 1592 125 1
41000 E/7360-38 T510E108(1)004A(2)E010 40.0 6.0 10 5339 4805 2136 125 1
6.3 470 X/7343-43 T510X477(1)006A(2)E030 29.6 6.0 30 3000 2700 1200 125 1
6.3 680 X/7343-43 T510X687(1)006A(2)E023 42.8 6.0 23 3426 3083 1370 125 1
6.3 680 X/7343-43 T510X687(1)006A(2)E045 42.8 12.0 45 2449 2204 980 125 1
6.3 680 E/7360-38 T510E687(1)006A(2)E023 42.8 6.0 23 3520 3168 1408 125 1
6.3 680 E/7360-38 T510E687(1)006A(2)E012 42.8 6.0 12 4873 4386 1949 125 1
10 330 X/7343-43 T510X337(1)010A(2)E035 33.0 6.0 35 2777 2499 1111 125 1
16 150 X/7343-43 T510X157(1)016A(2)E030 24.0 6.0 30 3000 2700 1200 125 1
16 150 X/7343-43 T510X157(1)016A(2)E040 24.0 6.0 40 2598 2338 1039 125 1
16 220 X/7343-43 T510X227(1)016A(2)E040 35.2 10.0 40 2598 2338 1039 125 1
16 220 X/7343-43 T510X227(1)016A(2)E025 35.2 10.0 25 3286 2957 1314 125 1
20 68 X/7343-43 T510X686(1)020A(2)E055 14.0 6.0 55 2216 1994 886 125 1
20 68 X/7343-43 T510X686(1)020A(2)E045 14.0 6.0 45 2449 2204 980 125 1
20 100 X/7343-43 T510X107(1)020A(2)E035 20.0 8.0 35 2777 2499 1111 125 1
20 100 X/7343-43 T510X107(1)020A(2)E040 20.0 6.0 40 2598 2338 1039 125 1
20 100 X/7343-43 T510X107(1)020A(2)E045 20.0 6.0 45 2449 2204 980 125 1
20 100 X/7343-43 T510X107(1)020A(2)E055 20.0 6.0 55 2216 1994 886 125 1
25 68 X/7343-43 T510X686(1)025A(2)E045 17.0 8.0 45 2449 2204 980 125 1
25 100 E/7360-38 T510E107(1)025A(2)E050 25.0 8.0 50 2387 2148 955 125 1
35 22 X/7343-43 T510X226(1)035A(2)E100 7.7 6.0 100 1643 1479 657 125 1
35 22 X/7343-43 T510X226(1)035A(2)E080 7.7 6.0 80 1837 1653 735 125 1
35 22 X/7343-43 T510X226(1)035A(2)E060 7.7 6.0 60 2121 1909 848 125 1
35 33 X/7343-43 T510X336(1)035A(2)E065 11.6 6.0 65 2038 1834 815 125 1
35 33 X/7343-43 T510X336(1)035A(2)E050 11.6 6.0 50 2324 2092 930 125 1
35 47 X/7343-43 T510X476(1)035A(2)E055 16.5 8.0 55 2216 1994 886 125 1
35 47 X/7343-43 T510X476(1)035A(2)E065 16.5 8.0 65 2038 1834 815 125 1
35 47 E/7360-38 T510E476(1)035A(2)E050 16.5 8.0 50 2387 2148 955 125 1
50 10 X/7343-43 T510X106(1)050A(2)E120 5.0 8.0 120 1500 1350 600 125 1
50 10 X/7343-43 T510X106(1)050A(2)E090 5.0 8.0 90 1732 1559 693 125 1
50 22 X/7343-43 T510X226(1)050A(2)E100 11.0 8.0 100 1643 1479 657 125 1
50 22 X/7343-43 T510X226(1)050A(2)E075 11.0 8.0 75 1897 1707 759 125 1
VDC @ 85°C µF KEMET/EIA (See below for
part options) µA @ +20°C
Max/5 Min % @ +20°C
120 Hz Max
mΩ @ 20°C
100 kHz
Max
mA @ +25°C
100 kHz mA @ +85°C
100 kHz
mA @ +125°C
100 kHz °C
Reflow
Temp
260°C
Rated
Voltage Rated
Cap Case Code/
Case Size KEMET Part Number DC
Leakage DF ESR Maximum Allowable
Ripple Current
Maximum
Operating
Temp MSL
(1) To complete KEMET part number, insert M for ±20% or K for ±10%. Designates Capacitance tolerance.
(2) To complete KEMET part number, insert T = 100% Matte Tin (Sn) Plated, G = Gold Plated, H = Standard Solder coated (SnPb 5% Pb minimum).
Designates Termination Finish.
Refer to Ordering Information for additional detail.
Higher voltage ratings and tighter tolerance product including ESR may be substituted within the same size at KEMET's option. Voltage substitution will
be marked with the higher voltage rating. Substitutions can include better than series.
Electronic Compancnl: KEIl/IEI' EHARGED! ”is Change in Working DC Voltage with Temperature Recommended Maximum Application Voltage Maximum Power ssipatinn (P max) mWatts @ 25°C wl+20°c Rise Temperature Compensation Multipliers far Maximum Ripple Current
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com T2014_T510 • 12/5/2017 66
Tantalum Surface Mount Capacitors – Low ESR
T510 Multiple Anode MnO2
Recommended Voltage Derating Guidelines
−55°Cto85°C 85°Cto125°C
% Change in Working DC
Voltage with Temperature
VR67% of VR
Recommended Maximum
Application Voltage
50% of VR33% of VR
Ripple Current/Ripple Voltage
Permissible AC ripple voltage and current are related to
equivalent series resistance (ESR) and the power dissipation
capabilities of the device. Permissible AC ripple voltage
which may be applied is limited by two criteria:
1. The positive peak AC voltage plus the DC bias voltage,
if any, must not exceed the DC voltage rating of the
capacitor.
2. The negative peak AC voltage in combination with
bias voltage, if any, must not exceed the allowable limits
specifiedforreversevoltage.SeetheReverseVoltage
section for allowable limits.
The maximum power dissipation by case size can be
determined using the table at right. The maximum power
dissipation rating stated in the table must be reduced with
increasing environmental operating temperatures. Refer to
the table below for temperature compensation requirements.
Temperature Compensation Multipliers
for Maximum Ripple Current
T≤25°C
T≤85°C
T≤125°C
1.00
0.90
0.40
T = Environmental Temperature
The maximum power dissipation rating must be reduced with increasing
environmental operating temperatures. Refer to the Temperature
Compensation Multiplier table for details.
KEMET
Case Code
EIA
Case Code
Maximum Power
Dissipation (P max)
mWatts @ 25°C
w/+20°C Rise
A
3216–18
75
B
3528–21
85
C
6032–28
110
D
7343–31
150
X
7343–43
165
E
7360–38
200
S
3216–12
60
T
3528–12
70
U
6032–15
90
V
7343–20
125
T510X
7343–43
270
T510E
7360–38
285
Using the P max of the device, the maximum allowable rms
ripple current or voltage may be determined.
I(max) = √P max/R
E(max) = Z √P max/R
I = rms ripple current (amperes)
E = rms ripple voltage (volts)
P max = maximum power dissipation (watts)
R = ESR at specified frequency (ohms)
Z = Impedance at specified frequency (ohms)
0%
20%
40%
60%
80%
100%
120%
55 25 85 125
% Working Voltage
% Change in Working DC Voltage
with Temperature
Temperature (°C)
67%
33%
Recommended Maximum
Application Voltage
(As % of Rated Voltage)
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© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com T2014_T510 • 12/5/2017 77
Tantalum Surface Mount Capacitors – Low ESR
T510 Multiple Anode MnO2
Reverse Voltage
Solid tantalum capacitors are polar devices and may be permanently damaged or destroyed if connected with the wrong
polarity.Thepositiveterminalisidentifiedonthecapacitorbodybyastripeplusinsomecasesabevelededge.Asmall
degree of transient reverse voltage is permissible for short periods per the table. The capacitors should not be operated
continuously in reverse mode, even within these limits.
Temperature Permissible Transient Reverse Voltage
25°C
15% of Rated Voltage
85°C
5% of Rated Voltage
125°C
1% of Rated Voltage
Table 2 – Land Dimensions/Courtyard
KEMET
Metric
Size
Code
Density Level A:
Maximum (Most) Land
Protrusion (mm)
Density Level B:
Median (Nominal) Land
Protrusion (mm)
Density Level C:
Minimum (Least) Land
Protrusion (mm)
Case EIA W L S V1 V2 W L S V1 V2 W L S V1 V2
E17360–38 3.25 2.77 3.67 10.22 7.30 3.13 2.37 3.87 9.12 6.80 3.03 1.99 4.03 8.26 6.54
X17343–43 2.55 2.77 3.67 10.22 5.60 2.43 2.37 3.87 9.12 5.10 2.33 1.99 4.03 8.26 4.84
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow
solder processes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform
qualification testing based on the conditions outlined in IPC standard 7351 (IPC–7351).
1 Height of these chips may create problems in wave soldering.
2 Land pattern geometry is too small for silkscreen outline.
L
S
W W
L
V1
V2
Grid Placement Courtyard
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© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com T2014_T510 • 12/5/2017 88
Tantalum Surface Mount Capacitors – Low ESR
T510 Multiple Anode MnO2
Soldering Process
KEMETsfamiliesofsurfacemountcapacitorsare
compatible with wave (single or dual), convection, IR,
orvaporphasereflowtechniques.Preheatingofthese
components is recommended to avoid extreme thermal
stress.KEMET'srecommendedprofileconditionsfor
convectionandIRreflowreflecttheprofileconditionsofthe
IPC/J–STD–020D standard for moisture sensitivity testing.
Thedevicescansafelywithstandamaximumofthreereflow
passes at these conditions.
Please note that although the X/7343–43 case size can
withstandwavesoldering,thetallprofile(4.3mmmaximum)
dictates care in wave process development.
Hand soldering should be performed with care due to the
difficultyinprocesscontrol.Ifperformed,careshouldbe
taken to avoid contact of the soldering iron to the molded
case. The iron should be used to heat the solder pad,
applying solder between the pad and the termination, until
reflowoccurs.Oncereflowoccurs,theironshouldbe
removed immediately. “Wiping” the edges of a chip and
heating the top surface is not recommended.
Duringtypicalreflowoperations,aslightdarkeningofthe
gold-colored epoxy may be observed. This slight darkening is
normal and not harmful to the product. Marking permanency
is not affected by this change.
Profile Feature SnPb Assembly
Pb-Free Assembly
Preheat/Soak
Temperature Minimum (T
Smin
)100°C 150°C
Temperature Maximum (T
Smax
)150°C 200°C
Time (t
s
) from T
smin
to T
smax
) 60 – 120 seconds 60 – 120 seconds
Ramp-up Rate (T
L
to T
P
)3°C/secondmaximum 3°C/secondmaximum
Liquidous Temperature (T
L
)183°C 217°C
Time Above Liquidous (t
L
) 60 – 150 seconds 60 – 150 seconds
Peak Temperature (TP)
220°C*
235°C**
250°C*
260°C**
Timewithin5°CofMaximum
Peak Temperature (tP)
20 seconds maximum 30 seconds maximum
Ramp-down Rate (T
P
to T
L
)6°C/secondmaximum 6°C/secondmaximum
Time25°CtoPeak
Temperature
6 minutes maximum 8 minutes maximum
Note: All temperatures refer to the center of the package, measured on the
package body surface that is facing up during assembly reflow.
*Case Size D, E, P, Y, and X
**Case Size A, B, C, H, I, K, M, R, S, T, U, V, W, and Z
Storage
Tantalum chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in
other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,
and long term storage. In addition, packaging materials will be degraded by high temperature – reels may soften or warp
andtapepeelforcemayincrease.KEMETrecommendsthatmaximumstoragetemperaturenotexceed40°Candmaximum
storagehumiditynotexceed60%relativehumidity.Temperaturefluctuationsshouldbeminimizedtoavoidcondensation
onthepartsandatmospheresshouldbefreeofchlorineandsulphurbearingcompounds.Foroptimizedsolderabilitychip
stock should be used promptly, preferably within three years of receipt.
Time
Temperature
Tsmin
25
Tsmax
TL
TPMaximum Ramp Up Rate = 3°C/second
Maximum Ramp Down Rate = 6°C/second
tP
tL
ts
25°C to Peak
am ..... Companm; KEIVIEI' EHARGED!
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com T2014_T510 • 12/5/2017 99
Tantalum Surface Mount Capacitors – Low ESR
T510 Multiple Anode MnO2
Construction
Leadframe
( Cathode)
Leadframe
(+ Anode)
Tantalum Wire
Molded Epoxy
Case
Molded Epoxy
Case
Polarity
Bevel (+)
Weld
(to attach wire)
Silver Adhesive
Detailed Cross Section
Tantalum Wire
Tantalum
Silver Paint
(Fourth Layer)
Washer
Washer
Polarity Stripe (+)
Ta2O5 Dielectric
(First Layer)
Carbon
(Third Layer)
MnO2
(Second Layer)
Capacitor Marking
* 230 = 30th week of 2012
KEMET
Multi-Anode
MnO2
Polarity
Indicator (+)
Rated
Voltage
Picofarad
Code
KEMET
ID
Date
Code*
Date Code *
1st digit = last number of year 2 = 2012
3 = 2013
4 = 2014
5 = 2015
6 = 2016
7 = 2017
2nd and 3rd digit = week of the
year
01 = 1st week of the year to
52 = 52nd week of the year
Ehcuomc Compcnonu KEIVIEI' CHARGED! S 3216712 0 2,500 10,000 T 3520712 0 2,500 10,000 M 3528715 0 2,000 0,000 U 6032715 12 1,000 5,000 L 6032719 12 1,000 3,000 W 7343715 12 1,000 3,000 Z 7343717 12 1,000 3,000 V 7343720 12 1,000 3,000 A 3216718 0 2,000 9,000 B 3528721 0 2,000 0,000 C 6032728 12 500 3,000 0 7343731 12 500 2,500 0 7343712 12 1,000 3,000 V 7343740 12 500 2,000 X 7343743 12 500 2,000 E/T428P 7360730 12 500 2,000 H 7360720 12 1,000 2,500
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com T2014_T510 • 12/5/2017 1010
Tantalum Surface Mount Capacitors – Low ESR
T510 Multiple Anode MnO2
Tape & Reel Packaging Information
KEMET’smoldedchipcapacitorfamiliesarepackagedin8and12mmplastictapeon7"and13"reelsinaccordancewith
EIA Standard 481: Embossed Carrier Taping of Surface Mount Components for Automatic Handling. This packaging system
is compatible with all tape-fed automatic pick-and-place systems.
Embossment
8 mm (0.315”) or
12 mm (0.472”)
Embossed carrier
Right hand
orientation
only
(+) ()
Top tape thickness
0.10 mm (0.004”)
maximum thickness
180 mm (7.0”) or
330 mm (13.”)
Table 3 – Packaging Quantity
Case Code
Tape Width
(mm) 7" Reel* 13" Reel*
KEMET
EIA
S
3216-12
8
2,500
10,000
T
3528-12
8
2,500
10,000
M
3528-15
8
2,000
8,000
U
6032-15
12
1,000
5,000
L
6032-19
12
1,000
3,000
W
7343-15
12
1,000
3,000
Z
7343-17
12
1,000
3,000
V
7343-20
12
1,000
3,000
A
3216-18
8
2,000
9,000
B
3528-21
8
2,000
8,000
C
6032-28
12
500
3,000
D
7343-31
12
500
2,500
Q
7343-12
12
1,000
3,000
Y
7343-40
12
500
2,000
X
7343-43
12
500
2,000
E/T428P
7360-38
12
500
2,000
H
7360-20
12
1,000
2,500
* No C-Spec required for 7" reel packaging. C-7280 required for 13" reel packaging.
Eiecxmmc Compancnls KEIVIEI' EHARGED: ‘ ' F ‘ , mum: nuiumeling D‘ Minimum R Reference SY Minimum TY Note 1 Note 2 Maximum 3‘ Maximum Note 4 Singie (4 mm) Z.0:0.05(0.07910.00Z)0r & Double 4.030.10 (0157:0004) 0 (8 mm) 8.010 in (0.31510 004)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com T2014_T510 • 12/5/2017 1111
Tantalum Surface Mount Capacitors – Low ESR
T510 Multiple Anode MnO2
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
P
0
T
F
W
Center Lines of Cavity
A
0
B
0
User Direction of Unreeling
Cover Tape
K
0
B
1
is for tape feeder reference only,
including draft concentric about B
0
.
T
2
ØD
1
ØD
0
B
1
S
1
T
1
E
1
E
2
P
1
P
2
Embossment
For cavity size,
see Note 1 Table 4
[10 pitches cumulative
tolerance on tape ±0.2 mm]
Table 4 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size D0
D
1
Minimum
Note 1
E1P0 P2
R Reference
Note 2
S
1
Minimum
Note 3
T Maximum
T
1
Maximum
8 mm 1.5+0.10/-0.0
(0.059+0.004/-0.0)
1.0
(0.039) 1.75±0.10
(0.060.004)
4.0±0.10
(0.157±0.004)
2.0±0.05
(0.070.002)
25.0
(0.984) 0.600
(0.024)
0.600
(0.024)
0.100
(0.004)
12 mm 1.5
(0.059)
30
(1.181)
Variable Dimensions — Millimeters (Inches)
Tape Size Pitch
B
1
Maximum
Note 4
E2 Minimum F P1 T2 Maximum W Maximum A0, B0 & K0
8 mm Single (4 mm) 4.35
(0.171)
6.25
(0.246)
3.5±0.05
(0.138±0.002)
2.0±0.05 or 4.0±0.10
(0.079±0.002 or 0.157±0.004)
2.5
(0.098)
8.3
(0.327)
Note 5
12 mm
Single (4 mm)
& Double
(8 mm)
8.2
(0.323)
10.25
(0.404)
5.5±0.05
(0.210.002)
2.0±0.05 (0.079±0.002) or
4.0±0.10 (0.157±0.004) or
8.0±0.10 (0.315±0.004)
4.6
(0.181)
12.3
(0.484)
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment
location and hole location shall be applied independent of each other.
2. The tape, with or without components, shall pass around R without damage (see Figure 4).
3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481–D, paragraph 4.3, section b).
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity defi ned by A0, B0 and K0 shall surround the component with su cient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes (see Figure 2).
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 mm and 12 mm wide tape (see Figure 3).
(e) see Addendum in EIA Standard 481–D for standards relating to more precise taping requirements.
cccccccccccccccccccc Emma): e 7/////////////////////l‘ e w J
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com T2014_T510 • 12/5/2017 1212
Tantalum Surface Mount Capacitors – Low ESR
T510 Multiple Anode MnO2
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 kg minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width Peel Strength
8 mm 0.1 to 1.0 Newton (10 to 100 gf)
12 mm 0.1 to 1.3 Newton (10 to 130 gf)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be
165°to180°fromtheplaneofthecarriertape.Duringpeeling,thecarrierand/orcovertapeshallbepulledatavelocityof
300 ±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA
Standards 556 and 624.
Figure 2 – Maximum Component Rotation
Ao
Bo
°
T
°
s
Maximum Component Rotation
Top View
Maximum Component Rotation
Side View
Tape
Width (mm)
Maximum
Rotation (°
T)
8, 12 20 Tape
Width (mm)
Maximum
Rotation (
8, 12 20
°
S)
Typical Pocket Centerline
Typical Component Centerline
Figure 3 – Maximum Lateral Movement
0.5 mm maximum
0.5 mm maximum
8 mm & 12 mm Tape
Figure 4 – Bending Radius
RR
Bending
Radius
Embossed
Carrier
Punched
Carrier
ammm Compancnls KEIVIEI' Emma): 17810 20 0:0 0? 33020.20 (13.00010 008) 0m 5/70 0 14.4 (a 331+0.059/70.0) (a 567) 12.4+2 0/70 0 10.4 (0.4mm 070/700) (0.724)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com T2014_T510 • 12/5/2017 1313
Tantalum Surface Mount Capacitors – Low ESR
T510 Multiple Anode MnO2
Figure 5 – Reel Dimensions
AD(See Note)
Full Radius,
See Note
B(see Note)
Access Hole at
Slot Location
(Ø 40 mm minimum)
If present,
tape slot in core
for tape start:
2.5 mm minimum width x
10.0 mm minimum depth
W
3
(Includes
flange distortion
at outer edge)
W
2
(Measured at hub)
W
1
(Measured at hub)
C
(Arbor hole
diameter)
Note: Drive spokes optional; if used, dimensions B and D shall apply.
N
Table 5 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size A B Minimum C D Minimum
8 mm
178±0.20
(7.008±0.008)
or
330±0.20
(13.000±0.008)
1.5
(0.059)
13.0+0.5/−0.2
(0.521+0.02/−0.008)
20.2
(0.795)
12 mm
Variable Dimensions — Millimeters (Inches)
Tape Size N Minimum W1 W2 Maximum W3
8 mm 50
(1.969)
8.4+1.5/0.0
(0.331+0.059/0.0)
14.4
(0.567)
Shall accommodate tape
width without interference
12 mm
12.4+2.0/0.0
(0.488+0.078/0.0)
18.4
(0.724)
EHARGED! 1 fi%¢ee¢o¢¢ o¢ as» ¢¢‘eo¢»$—e¢¢ / u )) rH/mm‘ yllm‘ #e4 keH/ +4 #:4 #é+\#++ \ \LLJ LLW (Lu ‘9900099fl/60fi999wv99 \‘ 90999990 Waif¢‘W¢oe6Too‘6o1 lg: Qiiiggfi1u9M133333§L @y’émawmammm gag“? HHHHH H‘HHHHH
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com T2014_T510 • 12/5/2017 1414
Tantalum Surface Mount Capacitors – Low ESR
T510 Multiple Anode MnO2
Figure 6 – Tape Leader & Trailer Dimensions
Trailer
160 mm minimum
Carrier Tape
END START
Round Sprocket Holes
Elongated Sprocket Holes
(32 mm tape and wider)
Top Cover Tape
Top Cover Tape
Punched Carrier
8 mm & 12 mm only
Embossed Carrier
Components
100 mm
minimum Leader
400 mm minimum
Figure 7 – Maximum Camber
Carrier Tape
Round Sprocket Holes
1 mm maximum, either direction
Straight Edge
250 mm
Elongated Sprocket Holes
(32 mm & wider tapes)
ammmc compmm KEIVIEI' cumin:
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com T2014_T510 • 12/5/2017 1515
Tantalum Surface Mount Capacitors – Low ESR
T510 Multiple Anode MnO2
KEMET Electronics Corporation Sales Offi ces
Foracompletelistofourglobalsalesoffices,pleasevisitwww.kemet.com/sales.
Disclaimer
Allproductspecifications,statements,informationanddata(collectively,the“Information”)inthisdatasheetaresubjecttochange.Thecustomerisresponsiblefor
checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed.
All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.
StatementsofsuitabilityforcertainapplicationsarebasedonKEMETElectronicsCorporation’s(“KEMET)knowledgeoftypicaloperatingconditionsforsuch
applications,butarenotintendedtoconstitute–andKEMETspecificallydisclaims–anywarrantyconcerningsuitabilityforaspecificcustomerapplicationoruse.
The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any
technicaladviceinferredfromthisInformationorotherwiseprovidedbyKEMETwithreferencetotheuseofKEMET’sproductsisgivengratis,andKEMETassumesno
obligation or liability for the advice given or results obtained.
Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component
failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards
(suchasinstallationofprotectivecircuitryorredundancies)inordertoensurethatthefailureofanelectricalcomponentdoesnotresultinariskofpersonalinjuryor
property damage.
Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other
measures may not be required.
KEMET is a registered trademark of KEMET Electronics Corporation.

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