BLM18xZ1D Ref Sheet Datasheet by Murata Electronics

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Sgec. N0. JEN F243Ar9122L701
Spec. No. JENF243A-9122L-01 P.1/11
MURATA MFG.CO., LTD.
Reference Only
Chip Ferrite Bead BLM18□□□□□□Z1D
Murata Standard Reference Specification [AEC-Q200]
1.Scope
This reference specification applies to Chip Ferrite Bead BLM18_Z Series for Automotive Electronics based on
AEC-Q200 except for Power train and Safety.
2.Part Numbering
(ex.) BL M 18 AG 121 S Z 1 D
(1) (2) (3) (4) (5) (6) (7) (8) (9)
(1)Product ID (4)Characteristics (7)Category(for Automotive Electronics)
(2)Type (5)Typical Impedance at 100MHz (8)Numbers of Circuit
(3)Dimension (L×) (6)Performance (9)Packaging (D:Taping)
3.Rating
Customer
Part Number MURATA
Part Number
Impedance (Ω)
(at 100MHz)(*1)
(refer to below
comment)
Rated
Current
(mA)
DC Resistance
(Ω max.) (*1)
(refer to below
comment) Remark ESD Rank
2:2kV
Initial
Values Values
After
Testing
Typical at
85 at
125
BLM18PG300SZ1D
20 min. 30 1000 0.05 0.10
For DC
power line
2
BLM18PG330SZ1D
33±25% 33 3000*2 1000*2 0.025 0.050
BLM18PG600SZ1D
40 min. 60 1000 0.1 0.2
BLM18PG121SZ1D
120±25% 120 2000*2 1000*2 0.05 0.10
BLM18PG181SZ1D
180±25% 180 1500*2 1000*2 0.09 0.18
BLM18PG221SZ1D
220±25% 220 1400*2 1000*2 0.10 0.14
BLM18PG331SZ1D
330±25% 330 1200*2 1000*2 0.15 0.20
BLM18PG471SZ1D
470±25% 470 1000 0.20 0.26
BLM18KG221SZ1D 220±25% 220
2200*2 1500*2 0.050 0.060
BLM18KG331SZ1D 330±25% 330
1700*2 1200*2 0.080 0.095
BLM18KG471SZ1D 470±25% 470
1500*2 1000*2 0.130 0.145
BLM18KG601SZ1D 600±25% 600
1300*2 1000*2 0.150 0.165
BLM18KG102SZ1D
1000±25 1000 1000*2 800*2 0.200 0.230
BLM18AG121SZ1D 120±25% 120 800 0.18 0.28
For
general
use
BLM18AG151SZ1D
150±25% 150 700 0.25 0.35
BLM18AG221SZ1D
220±25% 220 700 0.25 0.35
BLM18AG331SZ1D
330±25% 330 600 0.30 0.40
BLM18AG471SZ1D
470±25% 470 550 0.35 0.45
BLM18AG601SZ1D
600±25% 600 500 0.38 0.48
BLM18AG102SZ1D
1000±25% 1000 450 0.50 0.60
BLM18BB050SZ1D 5±25% 5 800 0.05 0.10
For
high speed
signal line
BLM18BA050SZ1D
5±25% 5 500 0.2 0.3
BLM18BB100SZ1D
10±25% 10 700 0.10 0.20
BLM18BA100SZ1D 10±25% 10 500 0.25 0.35
BLM18BB220SZ1D 22±25% 22 700 0.20 0.30
BLM18BA220SZ1D 22±25% 22 500 0.35 0.45
BLM18BB470SZ1D 47±25% 47 600 0.25 0.35
BLM18BD470SZ1D
47±25 47 500 0.3 0.4
BLM18BA470SZ1D 47±25% 47 300 0.55 0.65
BLM18BB600SZ1D 60±25% 60 600 0.25 0.35
BLM18BA750SZ1D 75±25% 75 300 0.70 0.80
BLM18BB750SZ1D 75±25% 75 600 0.30 0.40
BLM18BB121SZ1D 120±25% 120 550 0.30 0.40
: Sgec. N0. JEN F243Ar9122L701
Spec. No. JENF243A-9122L-01 P.2/11
MURATA MFG.CO., LTD.
Reference Only
Customer
Part Number MURATA
Part Number
Impedance (Ω)
(at 100MHz)(*1)
(refer to below comment)
Rated
Current
(mA)
DC Resistance
(Ω max.) (*1)
(refer to below
comment) Remark ESD Rank
2:2kV
Initial
Values
Values
After
Testing
Typical at
85 at
125
BLM18BD121SZ1D 120±25% 120 300 0.4 0.5
For
high speed
signal line
2
BLM18BA121SZ1D 120±25% 120 200 0.9 1.0
BLM18BB141SZ1D 140±25% 140 500 0.35 0.45
BLM18BB151SZ1D 150±25% 150 450 0.37 0.47
BLM18BD151SZ1D 150±25% 150 300 0.4 0.5
BLM18BB221SZ1D 220±25% 220 450 0.45 0.55
BLM18BD221SZ1D 220±25% 220 250 0.45 0.55
BLM18BB331SZ1D 330±25% 330 400 0.58 0.68
BLM18BD331SZ1D 330±25% 330 250 0.5 0.6
BLM18BD421SZ1D 420±25% 420 250 0.55 0.65
BLM18BB471SZ1D 470±25% 470 300 0.85 0.95
BLM18BD471SZ1D 470±25% 470 250 0.55 0.65
BLM18BD601SZ1D 600±25% 600 200 0.65 0.75
BLM18BD102SZ1D 1000±25% 1000 200 0.85 0.95
BLM18BD152SZ1D 1500±25% 1500 150 1.2 1.3
BLM18BD182SZ1D 1800±25% 1800 150 1.5 1.6
BLM18BD222SZ1D 2200±25% 2200 150 1.5 1.6
BLM18BD252SZ1D
2500±25% 2500 150 1.5 1.6
BLM18SG260TZ1D 26±25% 26
6000*2 1000*2 0.007 0.012
For DC
power line
(Thin type)
BLM18SG700TZ1D 70±25% 70
4000*2 1000*2 0.020 0.030
BLM18SG121TZ1D 120±25% 120
3000*2 1000*2 0.025 0.035
BLM18SG221TZ1D 220±25% 220
2500*2 1000*2 0.040 0.055
BLM18SG331TZ1D 330±25% 330
1500*2 1000*2 0.070 0.085
BLM18SN220TZ1D 22±7% 22
8000*2 5000*2 0.004 0.005
BLM18KG260TZ1D 26±25% 26
6000*2 4000*2 0.007 0.012
BLM18KG300TZ1D 30±25% 30
5000*2 3300*2 0.010 0.015
BLM18KG700TZ1D 70±25% 70
3500*2 2200*2 0.022 0.032
BLM18KG101TZ1D 100±25% 100
3000*2 1900*2 0.030 0.040
BLM18KG121TZ1D 120±25% 120
3000*2 1900*2 0.030 0.040
Operating Temperature : -55°C to +125°C Storage Temperature : -55°C to +125°C
(*1)
Standard Testing Conditions
< Unless otherwise specified > < In case of doubt >
Temperature : Ordinary Temp. (15 °C to 35 °C ) Temperature : 20°C±2 °C
Humidity : Ordinary Humidity (25%(RH) to 85%(RH)) Humidity : 60%(RH) to 70%(RH)
Atmospheric pressure : 86kPa to 106kPa
(*2)In case of Rated current is more than 1A,
Rated Current is derated as right figure
depending on the operating temperature.
Operating Temperature (°C)
85 125
0
Rated Current (A)
at 85°C
Rated current
at 125°C
Rated current
: Sgec. N0. JENF243AV9122L701
Spec. No. JENF243A-9122L-01 P.3/11
MURATA MFG.CO., LTD.
Reference Only
4.Style and Dimensions
Equivalent Circuit
(in mm) Unit Mass (Typical value)
T BLM18SG***TZ1D 0.5±0.15mm BLM18*****TZ1D 0.004g
BLM18KG***TZ1D 0.6±0.15mm BLM18*****SZ1D 0.005g
BLM18SN***TZ1D
BLM18*****SZ1D 0.8±0.15mm
5.Marking
No marking.
6.Specifications
6-1.Electrical Performance
No. Item Specification Test Method
6-1-1 Impedance Meet item 3. Measuring Frequency : 100MHz±1MHz
Measuring Equipment : KEYSIGHT 4991A or the equivalent
Test Fixture : KEYSIGHT 16192A or the equivalent
6-1-2 DC Resistance Meet item 3. Measuring Equipment : Digital multi meter
For BLM18SN
Measuring Equipment : YOKOGAWA 755611 or the equivalent
Test Fixture : KEYSIGHT 16044A or the equivalent
Except resistance of the Substrate and Wire
Resistance element becomes
dominant at high frequencies.
()
: Electrode
1.6±0.15 0.8±0.15
0.4±0.2
0.8±0.15
T
: Sgec. N0. JENF243AV9122L701 Tab‘e A TabIeB TableC ms Tab‘e D
Spec. No. JENF243A-9122L-01 P.4/11
MURATA MFG.CO., LTD.
Reference Only
6-2. Mechanical Performance(based on Table 13 for FILTER EMI SUPPRESSORS/FILTERS)
AEC-Q200 Rev.D issued June. 1 2010
AEC-Q200 Murata Specification / Deviation
No. Stress Test Method
3 High
Temperature
Exposure
1000hours at 125 deg C
Set for 24hours at room
temperature, then measured.
Meet Table A after testing.
Table A
4 Temperature Cycling 1000cycles
-55 deg C to +125 deg C
Set for 24hours at room
temperature, then measured.
Meet Table B after testing.
TableB
Appearance No damage
Impedance
Change
(at 100MHz)
Within ±30%
for BLM18SN
Within ±50%
(for BLM18KG
Within-10%to+50%)
DC Resistance Meet item 3.
5 Destructive
Physical Analysis Per EIA469
No electrical tests No defects
7 Biased Humidity 1000hours at 85 deg C, 85%RH
Apply max rated current. Meet Table C after testing.
TableC
Appearance No damage
Impedance
Change
(at 100MHz)
Within ±30%
for BLM18KG/SN
Within ±50%
DC
Resistance Meet item 3.
8 Operational Life Apply 125 deg C 1000hours
Set for 24hours at room
temperature, then measured
Meet Table C after testing.
If the rated current of parts exceed 1A,
the operating temperature should be 85 deg C.
9 External Visual Visual inspection No abnormalities
10 Physical Dimension Meet ITEM 4
Style and Dimensions No defects
12 Resistance to Solvents Per MIL-STD-202
Method 215 Not Applicable
13 Mechanical Shock Per MIL-STD-202 Method 213
Condition F
1500g's (14.7N)/0.5ms/
Half sine
Meet Table D after testing.
Table D
Appearance No damage
Impedance
Change
(at 100MHz)
Within ±30%
DC Resistance Meet item 3.
14 Vibration 5g's(0.049N) for 20 minutes,
12cycles each of 3 orientations
Test from 10-2000Hz.
Meet Table D after testing.
15 Resistance
to Soldering Heat Solder temperature
260C+/-5 deg C
Immersion time 10s
Pre-heating:150C +/-10 deg,60s to 90s
Meet Table C after testing.
Appearance No damage
Impedance
Change
(at 100MHz)
Within ±30%
for BLM18SN
Within ±50%
DC
Resistance Meet item 3.
E Sgec. No. JENF243AV9122L701
Spec. No. JENF243A-9122L-01 P.5/11
MURATA MFG.CO., LTD.
Reference Only
AEC-Q200 Murata Specification / Deviation
No. Stress Test Method
17 ESD
Per AEC-Q200-002 Meet Table D after testing.
ESD Rank: Meet Item 3. (Rating)
18 Solderability
Per J-STD-002 Method b : Not Applicable
95% of the terminations is to be soldered.
19 Electrical
Characterization Measured : Impedance No defects
20 Flammability Per UL-94 Not Applicable
21 Board Flex Epoxy-PCB(1.6mm)
Deflection 2mm(min)
60s minimum holding tim
Meet Table C after testing.
22 Terminal Strength
Per AEC-Q200-006 No defects
30 Electrical
Transient
Conduction
Per ISO-7637-2 Not Applicable
7.Specification of Packaging
7-1.Appearance and Dimensions
(8mm-wide paper tape)
Part Number Type Appearance and Dimensions
BLM18PG***SZ1D
BLM18AG***SZ1D
BLM18B****SZ1D
BLM18SN***TZ1D
BLM18KG****Z1D
8mm-
wide Paper tape
4mm-pitch
Item Dimension “a”
BLM18*****SZ1D 1.1 max.
BLM18KG***TZ1D 0.85 max.
BLM18SN***TZ1D
BLM18SG***TZ1D
8mm-
wide Paper tape
2mm-pitch
(in mm)
φ
1.5
a
Direction of feed
4.0±0.1 4.0±0.1
1.85±0.1
2.0±0.
05
3.5±0.05 1.75±0.1
8.0±0.3
+0.1
-0
1.05±0.1
0.9max.
2.0±0.05
2.0±0.1 4.0±0.1
φ
1.5
+0.1
-0
1.75±0.1
3.5±0.05
8.0±0.3
Direction of Feed
1.85±0.1
1.05±0.1
2.0±0.05
: Sgec. N0. JENF243AV9122L701 %~ BLM1 mexcep: BLMWESG) 4000 pcs. / veel ber(»1 0000 ><><><>
Spec. No. JENF243A-9122L-01 P.6/11
MURATA MFG.CO., LTD.
Reference Only
(1) Taping
Products shall be packaged in the cavity of the base tape of 8mm-wide,4mm-pitch continuously
and sealed by top tape and bottom tape.
(2) The sprocket holes are to the right as the tape is pulled toward the user.
(3) Spliced point:The base tape and top tape have no spliced point
(4) Cavity:There shall not be burr in the cavity.
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,
and are not continuous. The specified quantity per reel is kept.
7-2.Tape Strength
(1)Pull Strength
Top tape 5N min.
Bottom tape
(2)Peeling off force of Top tape
0.1N to 0.6N (Minimum value is typical.)
*Speed of Peeling off:300mm/min
7-3.Taping Condition
(1)Standard quantity per reel
Type Quantity per 180mm reel
BLM18(except BLM18SG) 4000 pcs. / reel
BLM18SG 10000 pcs. / reel
(2)There shall be leader-tape (top tape and empty tape ) and trailer- tape(empty tape) as follows.
(3)On paper tape, the top tape and the base tape shall not be adhered at the tip of the empty leader tape
for more than 5 pitch.
(4)Marking for reel
The following items shall be marked on a label and the label is stuck on the reel.
(Customer part number, MURATA part number, Inspection number(1) , RoHS marking (2) , Quantity, etc)
1) « Expression of Inspection No. » □□ OOOO ×××
(1) (2) (3)
(1) Factory Code
(2) Date First digit : Year/ Last digit of year
Second digit : Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
Third, Fourth digit : Day
(3) Serial No.
2) « Expression of RoHS marking » ROHS – Y ()
(1) (2)
(1) RoHS regulation conformity parts.
(2) MURATA classification number
(5)Outside package
These reels shall be packed in the corrugated cardboard package and the following items shall be marked
on a label and the label is stuck on the box.
(Customer name, Purchasing order number, Customer part number, MURATA part number,
RoHS discrimination(2) ,Quantity, etc)
(6)Dimensions of reel and taping(leader-tape, trailer-tape)
(in mm)
Top tape
Bottom tape Base tape
165 to 180 degree F
Empty tape
190 min.
Leader
Trailer
2.0±0.5
φ
13.0±0.2
φ
21.0±0.8
φ
180
φ
60
9.0
13.0±1.4
+1
-
0
+0
-3
Direction of feed
210 min.
160 min.
Top tape
+1
-0
Label
E S ec. No. JENF243AV9122L701 3A I G J V “fix/w $74Lrfiutd , 0.8 2.5 0.7 ” VA |:|
Spec. No. JENF243A-9122L-01 P.7/11
MURATA MFG.CO., LTD.
Reference Only
7-4.
Specification of Outer Case
Outer Case Dimensions
(mm) Standard Reel Quantity in Outer Case
(Reel)
W D H
186 186 93 5
Above Outer Case size is typical. It depends on a quantity of an order.
8. Caution
8-1.Rating
Do not use products beyond the Operating Temperature Range and Rated Current.
8-2.Surge current
Excessive surge current (pulse current or rush current) than specified rated current applied to the product may cause a
critical failure, such as an open circuit, burnout caused by excessive temperature rise.
Please contact us in advance in case of applying the surge current.
8-3.Fail Safe
Be sure to provide an appropriate fail-safe function on your product to prevent from a second damage
that may be caused by the abnormal function or the failure of our products.
8-4.Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.
(1)Aircraft equipment (6)Disaster prevention / crime prevention equipment
(2)Aerospace equipment (7)Traffic signal equipment
(3)Undersea equipment (8)Transportation equipment (trains,ships,etc.)
(4)Power plant control equipment (9)Data-processing equipment
(5)Medical equipment (10)Applications of similar complexity and /or reliability requirements
to the applications listed in the above
9. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
9-1.Land pattern designing
Standard land dimensions
< For BLM18 series (except BLM18P/BLM18S/BLM18K type) >
Type Soldering a b c
BLM18 (except18P/18S/
BLM18K type) Flow 0.8 2.5 0.7
Reflow 0.7 2.0 0.7
(in mm)
< For BLM18P/BLM18S/BLM18K type >
The excessive heat by land pads may cause deterioration
at joint of products with substrate.
Type Rated
Current
(A) Soldering a b c
Land pad thickness
and dimension d
18µm 35µm 70µm
BLM18P
BLM18S
BLM18K
0.5 to 1.5
Flow/
Reflow
Flow
0.8
Reflow
0.7
Flow
2.5
Reflow
2.0
0.7
0.7 0.7 0.7
1.7 to 2.5 1.2 0.7 0.7
3 to 4 2.4 1.2 0.7
5 to 6 6.4 3.3 1.65
BLM18SN 8 - 6.4 3.3
a
b
Chip Ferrite Bead
Solder Resist
Pattern
c
a
b
Chip Ferrite Bead
Solder Resist
Pattern
d
c
W
D
Label
H
(in mm)
: Sgec. N0. JENF243AV9122L701
Spec. No. JENF243A-9122L-01 P.8/11
MURATA MFG.CO., LTD.
Reference Only
9-2.Soldering Conditions
Products can be applied to reflow and flow soldering.
(1) Flux,Solder
Flux Use rosin-based flux, but not highly acidic flux (with chlorine content exceeding 0.2(wt)%. )
Do not use water-soluble flux.
Solder Use Sn-3.0Ag-0.5Cu solder
Standard thickness of solder paste : 100 µm to 200 μm
(2) Soldering conditions
Pre-heating should be in such a way that the temperature difference between solder and ferrite surface is limited
to 150 max. Also cooling into solvent after soldering should be in such a way that the temperature difference
is limited to 100 max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
(3)soldering profile
Flow soldering profile
Standard Profile Limit Profile
Pre-heating 150℃、60s min.
Heating 250℃、46s 265℃±3℃、5s max.
Cycle of flow 2 times 2 times
Reflow soldering profile
Standard Profile Limit Profile
Pre-heating 150180°C 90s±30s
Heating above 220°C30s60s above 230°C60s max.
Peak temperature 245±3°C 260°C,10s
Cycle of reflow 2 times 2 times
Limit Profile
Standard Profile
90s±30s
230℃
260
245℃±3
220℃
30s~60s
60s max.
180
150
Temp.
(s)
(℃)
Time.
250
Heating Time
150
Limit Profile
Standard Profile
(s)Time.
Temp.
(℃)
60s min.
265℃±3
E Sgec. N0. JENF243A79122L701 1 E 0000:)0000: *1 A > D is valid when sire If a Cullmg [use ‘5 used‘ 5 (a) Mountmg Components Neal! 3 When a componenl \s mounled Ihe lwghtemng ol the screw. Mcu ICU-NEE Screw Hme
Spec. No. JENF243A-9122L-01 P.9/11
MURATA MFG.CO., LTD.
Reference Only
9-3.Reworking with soldering iron
Pre-heating: 150°C, 1 min Soldering iron output: 80W max.
Tip temperature: 350°C max. Tip diameter:φ3mm max.
Soldering time : 3(+1,-0) seconds. Times : 2times max.
Note :Do not directly touch the products with the tip of the soldering iron in order to prevent the crack
on the ferrite material due to the thermal shock.
9-4.Solder Volume
Solder shall be used not to be exceeded as shown below.
1/3TtT
(T:Chip thickness)
Accordingly increasing the solder volume, the mechanical stress to product is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
9-5.Attention regarding P.C.B. bending
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress for board warpage.
<Products direction>
Products shall be located in the sideways
direction (Length:a<b) to the mechanical
stress.
(2)Components location on P.C.B. separation.
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Contents of Measures Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1
(2) Add slits in the board separation part. A > B
(3) Keep the mounting position of the component away from the board separation surface. A > C
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
(3)
Mounting Components Near Screw Holes
When a component is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.
Recommendable
Upper Limit
t
Poor example
Good example
b
a
Screw Hole
Recommended
Perforation
Slit
A
B
C
D
: Sgec. N0. JENF243A79122L701
Spec. No. JENF243A-9122L-01 P.10/11
MURATA MFG.CO., LTD.
Reference Only
9-6.Mounting density
Add special attention to radiating heat of products when mounting the inductor near the products with heating.
The excessive heat by other products may cause deterioration at joint of this product with substrate.
9-7. Operating Environment
Do not use this product under the following environmental conditions, on deterioration of the Insulation
Resistance of the Ferrite material and/or corrosion of Inner Electrode may result from the use.
(1) in the corrodible atmosphere such as acidic gases, alkaline gases, chlorine, sulfur gases, organic gases
and etc. (the sea breeze, Cl2, H2S, NH3, SO2, NO2,etc)
(2) in the atmosphere where liquid such as organic solvent, may splash on the products.
(3) in the atmosphere where the temperature / humidity changes rapidly and it is easy to dew.
9-8. Resin coating
The impedance value may change and/or it may affect on the product's performance due to high cure-stress of
resin to be used for coating / molding products. So please pay your careful attention when you select resin. In prior to
use, please make the reliability evaluation with the product mounted in your application set.
9-9.Cleaning Conditions
Products shall be cleaned on the following conditions.
(1)Cleaning temperature shall be limited to 60°C max. (40°C max. for IPA.)
(2)Ultrasonic cleaning shall comply with the following conditions, avoiding the resonance phenomenon
at the mounted products and P.C.B.
Power:20W/ max. Frequency:28kHz to 40kHz Time:5 min max.
(3)Cleaner
1.Alternative cleaner
Isopropyl alcohol (IPA)
2.Aqueous agent
PINE ALPHA ST-100S
(4)There shall be no residual flux and residual cleaner after cleaning.
In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water
in order to remove the cleaner.
(5)Other cleaning
Please contact us.
9-10. Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to
the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending Twisting
9-11.Storage Conditions
(1)Storage period
Use the products within 6 months after delivered.
Solderability should be checked if this period is exceeded.
(2)Storage conditions
Products should be stored in the warehouse on the following conditions.
Temperature : -10°C to 40°C
Humidity : 15% to 85% relative humidity
No rapid change on temperature and humidity
Don't keep products in corrosive gases such as sulfur, chlorine gas or acid, or it may cause oxidization
of electrode, resulting in poor solderability.
Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
Products should be stored under the airtight packaged condition.
(3)Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
: Sgec. N0. JENF243A79122L701 A
Spec. No. JENF243A-9122L-01 P.11/11
MURATA MFG.CO., LTD.
Reference Only
10. Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.

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