SP3022 Series Datasheet by Littelfuse Inc.

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TVS Diode Arrays (SPA ® Diodes)
Low Capacitance ESD Protection - SP3022 Series
Description
Features
Applications
The SP3022 includes back-to-back TVS diodes fabricated
in a proprietary silicon avalanche technology to provide
protection for electronic equipment that may experience
destructive electrostatic discharges (ESD). These robust
diodes can safely absorb repetitive ESD strikes above the
maximum level specified in IEC 61000-4-2 international
standard without performance degradation. The back-to-
back configuration provides symmetrical ESD protection for
data lines when AC signals are present and the low loading
capacitance makes it ideal for protecting high speed data
lines such as HDMI,USB2.0, USB3.0 and eSATA.
RoHS compliant and lead-
free
ESD protection of ±20kV
contact discharge,
±30kV air discharge,
(IEC 61000-4-2)
• EFT, IEC 61000-4-4,
40A (5/50ns)
• IEC 61000-4-5, 2nd Edition:
8/20 Surge, 3A Surge
• Low capacitance of
0.35pF @ VR=0V (TYP)
Low leakage current of
100nA at 5.3V (MAX)
• Space efficient 0201 and
SOD882 footprint
• Extremely low dynamic
resistance (0.7Ω TYP)
• AEC-Q101 qualified
(SOD882 package)
• USB 3.0/USB 2.0/MHL
• MIPI Camera and Display
• HDMI 2.0, DisplayPort
1.3, eSATA
• Set Top Boxes, Game
Consoles
• Smart Phones
• External Storage
• Ultrabooks, Notebooks
Tablets, eReaders
• Automotive Electronics
Functional Block Diagram
12
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
RoHS
Pb
GREEN
SP3022 Series 0.35pF 20kV Bidirectional Discrete TVS
Pinout
12
0201 Flipchip
12
SOD882
(AEC-Q101 qualified)
Additional Information
Datasheet Samples
Resources
© 2018 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/15/18
% Litleltuse mm. mm. gum
TVS Diode Arrays (SPA ® Diodes)
Low Capacitance ESD Protection - SP3022 Series
SP3021
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the component. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of
this specification is not implied.
Absolute Maximum Ratings
Symbol Parameter Value Units
PPK Peak Pulse Power (tP=8/20µs) 20 W
IPP Peak Current (tp=8/20μs) 3.0 A
TOP Operating Temperature -40 to 125 °C
Electrical Characteristics (TOP=25ºC)
Parameter Symbol Test Conditions Min Typ Max Units
Reverse Standoff Voltage VRWM 5.3 V
Reverse Breakdown Voltage VBR 1R=1mA 6.8 7. 8 9.0 V
Reverse Leakage Current ILEAK VR=5.3V <10 100 nA
Clamp Voltage1VCIPP=1A, tp=8/20µs, Fwd 12.0 V
Dynamic Resistance2RDYN TLP, tp=100ns, I/O to GND 0.7 Ω
ESD Withstand Voltage1VESD
IEC 61000-4-2 (Contact) ±20 kV
IEC 61000-4-2 (Air) ±30 kV
Diode Capacitance1CDReverse Bias=0V 0.35 0.5 pF
8/20 Pulse Waveform
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
110%
0.05.0 10.015.020.025.030.0
Time (μs)
Percent of I
PP
Note:
1 Parameter is guaranteed by design and/or component characterization.
2 Transmission Line Pulse (TLP) with 100ns width and 200ps rise time.
Transmission Line Pulsing(TLP) Plot
0
2
4
6
8
10
12
14
16
18
20
22
0510 15 20 25 30
TLP Voltage (V)
TLP Current (A)
© 2018 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/15/18
% Litteltuse" wmmwm \ Amway: Dzlweved
TVS Diode Arrays (SPA ® Diodes)
Low Capacitance ESD Protection - SP3022 Series
Soldering Parameters
Time
Temperature
TP
TL
TS(max)
TS(min)
25
tP
tL
tS
time to peak temperature
Preheat
P
rehea
t
Ramp-up
R
amp-up
Ramp-down
R
amp-d
o
Critical Zone
TL to TP
ritical Zon
T
L
to
T
P
Reflow Condition Pb – Free assembly
Pre Heat
- Temperature Min (Ts(min)) 150°C
- Temperature Max (Ts(max)) 200°C
- Time (min to max) (ts) 60 – 180 secs
Average ramp up rate (Liquidus) Temp (TL)
to peak 3°C/second max
TS(max) to TL - Ramp-up Rate 3°C/second max
Reflow - Temperature (TL) (Liquidus) 217°C
- Temperature (tL) 60 – 150 seconds
Peak Temperature (TP) 260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)20 – 40 seconds
Ramp-down Rate 6°C/second max
Time 25°C to peak Temperature (TP) 8 minutes Max.
Do not exceed 260°C
Product Characteristics of SOD882
Lead Plating Pre-Plated Frame
Lead Material Copper Alloy
Substrate material Silicon
Body Material Molded Compound
Flammability UL Recognized compound meeting
flammability rating V-0.
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
Clamping Voltage vs IPP
0.0
2.0
4.0
6.0
8.0
10.0
12.0
14.0
16.0
1.01.5 2.02.5 3.0
Clamp Voltage (V
C
)
Peak Pulse Current-I
PP
(A)
Capacitance vs. Reverse Bias
0.0
0.1
0.2
0.3
0.4
0.5
00.3 0.60.9 1.21.5 1.82.1 2.42.7 33.3
Capacitance (pF)
Bias Voltage (V)
Product Characteristics of 0201 Flipchip
Lead Plating Sn
Lead Material Copper
Lead Coplanarity 6µm(max)
Substrate material Silicon
Body Material Silicon
© 2018 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/15/18
E: SODSBZ nan I: TTTT
TVS Diode Arrays (SPA ® Diodes)
Low Capacitance ESD Protection - SP3022 Series
Package Dimensions — 0201 Flipchip
Symbol
0201 Flipchip
Millimeters Inches
Min Typ Max Min Typ Max
A0.595 0.620 0.645 0.0234 0.0244 0.0254
B0.295 0.320 0.345 0.0116 0.0126 0.0136
C0.245 0.275 0.305 0.0096 0.0108 0.0120
D0.145 0.150 0.155 0.0057 0.0059 0.0061
E0.245 0.250 0.255 0.0096 0.0098 0.0100
F0.245 0.250 0.255 0.0096 0.0098 0.0100
G0.005 0.010 0.015 0.0002 0.0004 0.0006
A
B
DED
F
C
G
0.28
0.30
0.75 0.19
Recommended Solder Pad Footprint
*Sizes in mm
Recommended Soldering Pad Layout
0.650
0.325
0.325
0.975
0.650
0.650
Package Dimensions — SOD882
Symbol
Package SOD882
JEDEC MO-236
Millimeters Inches
Min Typ Max Min Typ Max
A0.95 1. 0 0 1. 10 0.035 0.039 0.043
B0.50 0.60 0.70 0.020 0.024 0.028
C0.40 0.50 0.60 0.016 0.020 0.024
D0.45 0.018
E0.20 0.25 0.35 0.008 0.010 0.012
F0.45 0.50 0.55 0.018 0.020 0.022
Part Numbering System
SP 3022 01 xTG
Series
Number of
Channels
Package
T= Tape & Reel
G= Green
TVS Diode Arrays
(SPA® Diodes)
W: 0201 Flipchip
E: SOD882
Part Marking System
SP3022-01WTG SP3022-01ETG
Part Number Package Marking Min. Order Qty. Packaging Option P0/P1 Packaging Specification
SP3022-01WTG 0201 Flipchip -10000 Tape & Reel – 8mm tape/7” reel 4mm/2mm EIA RS-481
SP3022-01ETG SOD882 -10000 Tape & Reel – 8mm tape/7” reel 4mm/2mm EIA RS-481
Ordering Information
© 2018 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/15/18
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TVS Diode Arrays (SPA ® Diodes)
Low Capacitance ESD Protection - SP3022 Series
Embossed Carrier Tape & Reel Specification — 0201 Flipchip
A0 K0 B0
T
P2
P1
P0
D
D1
E
F
W
Symbol Millimeters
A0 0.41+/-0.03
B0 0.70+/-0.03
Dø 1.50 + 0.10
D1 ø 0.20 +/- 0.05
E1.75+/-0.10
F3.50+/-0.05
K0 0.38+/-0.03
P0 4.00+/-0.10
P1 2.00+/-0.05
P2 2.00+/-0.05
W8.00 + 0.30 -0.10
T0.23+/-0.02
Embossed Carrier Tape & Reel Specification — SOD882
Symbol Millimeters
A0 0.70+/-0.045
B0 1.10+/-0.045
K0 0.65+/-0.045
F3.50+/-0.05
P1 2.00+/-0.10
W8.00 + 0.30 -0.10
© 2018 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/15/18

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