GMK316AB7106KL-TR Prod Spec Datasheet by Taiyo Yuden

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Ref N0.MLCEE13058 PRODUCT SPECIFICATION P/N: GMKSIGAB7106KL-TR Type: High Value Multilayer Ceramic Capacitors Issue date: February 28.2013 Applicable products to RoHS restriction TAIYO YUDEN 00., LTD.
Document No Specifications High Value Multilayer Ceramic Capacitor MLCEE13058 (ngh dielectric type) 1, Scope This specification covers multilayer chip type ceramic capacitor (Pb-Free) for use(for reflow soldering) in electronic appliances and electric communication equipment. 2. Part Numbering System Part number is indicated as follows: (Example): G MK 316 A B7 106 K L -TR C E 75‘ l: Capacitance_® E? @ (DRated voltage @Size ®Control Code: F'er Table 1 Code Voltage [VDC] Code Size [mm] G 35 31 6 32x 1 .6 @Temperature Characteristic . t Capacitance Temperature Reference Characteristic change rate [%] range [‘C] temperature [‘C] B7 (X7R) 115 (EIA) —55 to +125 25 ®Tolerance Code Tolerance [%] K 11 O M 120 ©Thickness code Type Code Thickness [mm] 31 6 L i ,60 ® Packaging Code Packaging type -TR Taping
High Value Multilayer Ceramic Chip Capacitor 3. Test Conditions Standard test conditions shall be temperature of 5 to 35°C. relative humidity of 45 to 85% and air pressure of 86 to 106kPa. Tests shall be conducted at temperature of 25i3°C, relative humidity of 60 to 70% and air pressure of 86 to 106kPa if test results are suspicious. Unless otherwise specified. all tests shall be conducted under the standard test conditions. 4. Construction. Dimensions and Performance Details of construction. dimensions and performance shall be specified in the following pages. 5. Packaging Capacitors shall be packaged properly to avoid damage in the capacitors during transportation and storage. The package shall be marked with part number, quantity. lot number, and manufacturer‘s name at its appropriate position. (it Manufacturing site TAIYO YUDEN CO“ LTD (JAPAN) TAIYO YUDEN (SARAWAK) SDN, BHD. (MALAYSIA) KOREA KYONG NAM TAIYO YUDEN CO., LTD. (KOREA) TAIYO YUDEN (GUANG DONG) 00., LTDV (CHINA) TAIYO YUDEN (PHILIPPINES) INC. (PHILIPPINES) 7. Precautions ~This specification does not cover capacitors when Sn-Zn lead free solder is used. -If you need further information, please contact us 8. Storage conditions 4 Temperature and humidity in storage area shall be controlled carefully to maintain the solderability of terminal electrodes and to keep the packaging material in good condition. Humidity should especially be kept as low as possible. - Recommended conditions Ambient temperature: 30°C or below Humidity: 70% RH or below The ambient temperature must be kept below +40°Ci Even under ideal storage conditions. capacitor electrode solderability decreases with time. Therefore ceramic chip capacitors should be used within 6 months from the time of delivery. If the period is exceeded, please check solderability before using the capacitors. - The packaging material should be kept where no chlorine or sulfur exists in the air.
High Value Multilayer Ceramic Chip Capacitor Q. RoHS compliance - Our products conform to RoHS. - "RoHS compliance" means that the product does not contain lead, cadmium, mercury. hexavalent chromium, PBB or PBDE referring to EU Directive 2002/95/EC, except other non-restricted substances or impurities which cannot be technically removed at refining process. - Our products are halogen-free products. 10‘ Others Resin—coating: - Coating/molding capacitors with resin may have negative effects on the capacitor functions, ~ When capacitors are coated/molded with resin, please check effects on the capacitors by analyzing them in actual applications prior to use.
No. Item Specified Value Remarks Operating Temperature Range Capable of continuous operation under these ~55 to +125‘L‘ conditions. 2 Shape and Dimensions Per Fig.1 and Table 1 3 Heat Treatment Initial value shall be measured after test sample is heat-treated at 150 +0/-1D°C for an hour and kept at room temperature for 2412hours. 4 Voltage Treatment Initial value shall be measured after test sample is voltage-treated for an hour at temperature and voltage which are specified as test conditions, and kept at room temperature for 2412hours. 5 Dielectric Withstanding No abnormality Conforming to ElA RS498 (1991). Voltage 250% of DC rated voltage shall be applied for 1 to 5 (between terminals) seconds. Charging and discharging current shall be 50mA or less. 6 Insulation Resistance (IR) 100MQ . )1. F min. Conforming to ElA RS-l 98 (1991 ). Rated voltage shall be applied to test sample for 1 minuteis seconds. Charging and discharging current shall be 50mA or less. 7 Capacitance (Cap) 10.0u F Conforming to EIA RS498 (1991 ). Heat treahnent specified in this specification shall be conducted prior to measurement. Measuring frequency and voltage shall conform to the table below. Measuring Frequency Measuring Voltage 1kHZilU% 1,0i0.2Vrms 3 Dissipation Factor (DF) 10.0%max Conforming to EIA R8498 (1991). Heat treanment specified in this specification shall be conducted prior to measurement. Measuring frequency and voltage shall conform to the table below. Measuring Frequency 1kHZ:l: 10% Measuring Voltage 1,0:02Vrms
No. Item Speoiiied Value Remarks 9 Temperature Characteristic Per P,1 for Conforming to EIA R8498 (1991). @Temperature Heat treatment specified in this specification shall be Characteristic conducted prior to measurement. Maximum capacitance deviation in both (+) and (-) sides in range of lowest temperature to highest temperature for capacitor shall be indicated in ratio of variation in reference to capacitance value at reference temperature. 10 Adhesive Force of Terminal Terminal electrodes Test sample shall be soldered to test board shown in Electrodes shall be no exfoliation Fig.2 and a force of 5N(0.51kgf} shall be applied in or a sign of exfoliation, vertically downward direction for 3015 seconds. 11 Vibration Initial performance shall be satisfied. Conforming to EIA RS498 (1991). Test sample shall be soldered to board shown in Fig.2. Heat treatment specified in this specification shall be conducted prior to test. Test conditions: Frequency range: 10-55Hz Overall amplitude: 1.5mm Sweeping method: 10-55-10HZ for 1 min. Each two hours in X,Y,Z direction: 6 hours in total
No. item Specified Value Remarks 12 Soiderability More than 95% of [Eutectic] terminal electrode shall Solder used shall be [Jls z 3282 H60A or H63A]. be covered With “95h Test sample shall be completely submerged in 50'del- molten solder at 23015°C for 411 seconds. [Pb free] Solder used shall be [Sn/3.0Ag/O.50u], Test sample shall be completely submerged in molten solder at 24523°C for 411 seconds 13 Resistance Appearance No abnormality Conforming to EIA R84 98 (1991). to Ch 0 Solder used shall be [JIS Z 3282 H60A or H63A]. Soldering Cap. ange i7-5/‘7 Test sample shall be completely submerged in Heat molten solder of 270t5“C for 3:0.5 seconds. DF 10.0%max Preheating as shown in the table below shall be continuously conducted before submersion and test IR Initial value shall be sample shall be Kept at ambient temperature after satisfied test. Dielectric No dielectric Sequence Temperature Time (min) Withstanding breakdown or damage (DC) Voltage 1 80 to 100 5 to 10 (between 2 150 to 200 5 to 10 terminals) Heat treatment specified in this specification shall be conducted prior to test. Measurement shall be conducted after test sample is kept at ambient temperature for 24:2 hours. 14 Thermal Appearance No abnormality Conforming to EIA RS~1 98 (1991). Shock Test sample shall be soldered to board shown in Fig.2. Heat treatment 5 ecified in this specification Cap Change 115% shall be conducted prior f0 test. Test sample shall be exposed to each of temperature DF 10.0%max conditions in the following Steps 1 to 4 in sequence for the specified time. IR Initial value shall be Time satisfied. Step Temperature (‘0) (min) Dielectric No dielectric 1 Lowesl Operating 3013 Withstanding breakdown or damage temperature Voltage 2 Amfiient temperature 2 to 3 between Hig est operating ( terminals) 3 temperature 30:3 4 Ambient temperature 2 to 3 Temperature cycle shall be repeated five times in this method, and measurement shall be conducted after test sample is kept at ambient temperature for 2412 hours.
No. Item Specified Value Remarks 15 Humidity Appearance No abnormality Conforming to EIA RS-198(1991). (Steady Heat treatment specified in this specification shall be State) Cap. Change 112.5% conducted prior to test. Test sample shall be put into constant DF 15.0%max temperature/humidity bath at 4012 ”C and 90 to 95%RH for 500 +24/-0 hours. IR SOMQ . AF min. Measurement shall be conducted after test sample is kept for 2412 hours. 16 High Appearance No abnormality Conforming to EIA RS-198 (1991), Temperature Voltage treatment specified in this specification shall Loading Cap. Change 120.0% be conducted prior to test. Test sample shall be put in thermostatic oven at DF 15.0%max maximum operating temperature and 150% of DC voltage shall be continuously applied for 1000 +48/-0 hours. IR 50M§l “me' Charging and discharging current shall be 50mA or less, Measurement shall be conducted after test sample is kept at ambient temprature for 24:2 hours, 17 Humidity Appearance No abnormality Conforming to ElA RS-198(1991), Loading Voltage treatment specified in the specification shall Cap. Change 120.0% be conducted priorto test. Test sample shall be put into constant DF 15.0%max temperature/humidity bath at 4012 “C and 90 to 95%RH, and DC rated voltage shall be continuously IR ‘ ZSMQ . MF min. applied for 500 +24/—0 hours. Charging and discharging current shall be 50mA or less, Measurement shall be conducted after test sample is kept at ambient temperature for 24:22 hours. 18 Bending Appearance No abnormality Test sample shall be soldered to test board as Strength shown in Fig.3. Cap. Change 112.5% Sample shall be carefully soldered to avoid abnormality such as heat shock. The board is bent 1.0mm for 10 seconds as shown in Fig.4. Measurement shall be conducted as the board is bent 1.0mm.
Figt1: Shape W T (6 H | e | © | a | No Name Material (D Terminal Electrodes (Surface) Sn Plating ‘ Ni Plating ® Terminal Electrodes Cu Plating ® External Electrodes Ni @ internal Electrodes Ni ® Dielectric Barium titanate Table 1: Dimensions Dimension [Unit mm] Item type Control Bode L w T e 316 A 3.2102 1.62:0.2 1.6102 0.5+O.35I-0i25
b c Fig.2: Board/Test Jig of Adhesive Force of Terminal Electrodes. Vibration, and Thermal Shock Size (LXW) a 3.2X1.6 2.2 5.0 2.0 [Unit: mm] Scratch tool 1/ \ Material: Glass epoxy board [JIS C 6484] l I] g f a Chip Olmsedion l:l Copper foil (Thickness: 0,035mm) . Solder resist Remarks: Uniform soldering shall be conducted with solder (H60A or H63A in JIS Z 3282) by using soldering iron or soldering oven. Soldering shall be conducted with care to avoid abnormality such as heat shock. Fig.3: Test Board Fig.4: Applled V/—Z°—a ‘0 /- pressure ! deflection *F_MI l .ng ._ 100 o_. Material: Glass epoxy board [JIS C 6484] 45:2 45:2 l:| Copper foil (Thickness: 0.035mm) [Unit mm] Solder resist Apply pressure at the rate of 0.5mm/sec. until amount of deflection reaches 1.0mm. Size (LXW) a b c 3.2“ .6 2.2 5.0 2.!) [Unit: mm]
Tape Packaging 107 ' 212 . 316 - 325 Type © Tape packaging type: - Paper (ape: 107-case-type products and products with 0.85mm—thickness; - Embossed tape: Products with 1.15mm-lhickness or over and 325-case-type products with 0.85mm~thickness. Dimensions Unit: mm >C<1 type="" b="" type="" a="" b="" 1,810.2="" 2.0302="" 3.6:02="" “37="" 1.9:02="">z<2 316="" 2.1202="">:<3 3.7:02="">263 212 2.4:02 325 2.8102 3.6202 3.1102 X4 4.02112 X4 Dimensions Un mm Type C D E F G H J K>Ié1 1X1 1.1 max. (Paper _ tape) 10“ 325 8 0+0 3 3 5+0 05 ‘ (Paper 1'2 max' 0 . _ . . _ . $1.5 tape) (Paper 1.75:0.1 4010.1 202005 40:04 +0114) tape) >I<2 3.4="" max.="" 0.6="" max.="" 325="">§<4 12,0i0.3="" 5.5i0.05="" 3.7="" max.="" x1:="" a.="" b.="" k,="" 1:="" sufficient="" clearances="" are="" secured.="" x2:="" 'mk107b"“““t="" x3:="" *mk31sb“"""t="" x4:="" amk325aej227mm-t="" smucket="" hole="" chin="" cavitv="" embossed="" tape="" papertape="" 710,="">
Tape Packaging 107 ~ 212 - 316 - 325 Type Dimensions of Reel Unit: mm Type A B C D E W t R 107 to 325 (A178t2.0 (950 min. $13.0:02 $210108 2.0:05 10011.5 2.5max. 1.0 325% $178120 $50 min. <1) 13.0:02="" $210208="" 2.0:05="" 14.0215="" 2.5max.="" 1.0="" x1amk325abj227mm-t="" 711-="">
Tape Packaging 107, 212, 316, 325 TYPE 1. Taping shall be right-sided wound. Sprocket hole shall be on the right side against the pull-out direction. 2. Either the width side (W) or the thickness side (t) of the components below faces up at random when the components are inserted in the chip cavities. 107(0603) type with 0.8mm-thickness, 212(0805) type with 1 ,25mm-thickness, 316(1206) type with 1.6mm-thickness, 325(1210) type with 2.5mm-thickness 3. There shall be blank spaces in each reel tape as shown in the following figure. - Leader part 400mm min. - Leader part (Blank part) 100mm min, - Trailer (Blank part) 160mm min, Trailer Chip packaging area Leader part Edoo ——————— o O------OO —————— 00 SM n y 7 a D Dm-D El- -D D \\ Blank part Blank part e—H %——> No shorter than 160m No shorter than 100mm No shorter than 400mm Feeding direction —, 4. Neither top/bottom tapes of paper tape nor top tape of embossed tape shall cover sprocket holes. 5. There shall no seam on paper tape and embossed tape, 6. Tensile strength of the tape shall be 5N (0.51 kgf) or over. 7. The number of the chip missing from tape reel shall be 1 piece at a maximum per reel. 8. The number of packaged chips per reel is shown in the table below. 9. Label indicating part No,' quantity and control No. shall be attached to the outside of reel, 10. Feeling strength of top tape shall be 0.1 to 0.7N (10.2 to 71 ,4gf) when top tape is peeled from carrier /? tape at an angle of 0 to 20 degrees. C 0 to 20° Quantity of taping package Thickness . Thickness . Type [Unit mm] Qgspég Carrier tape Type [Unit: mm] ($3333) Carrier tape (Thickness code) (p ) (Thickness code) p 107 0,45(K) (185(0) O.80(A) 4,000 Paper 1.15(F) 0.45(K) 1.50(H) 00 0 35(0) 325 1 90(N) 2'0 Embmed 212 ' Embossed ' (Plastic) 125(G) 3,000 (Plastic) 1.9+0.1/—0.2(Y) 035(0) 4000 Paper 2.50(M)>Z< 500="" or="" 1000="" 316="" 112;?)="" 3,000="" embossed="" 1.60(l)="" 2,000="" “2'35"”="" xfor="" 325="" type="" with="" 2.50(m)—thickness="" products,="" packaging="" code="" "—t"="" means="" 500="" pcs="" per="" reel="" and="" "-p"="" means="" 1000="" pcs="" per="" reel.="" 712,="">
Tape Packaging 107, 212, 316, 325 TYPE [Packaging Mode] Tape packaging Customer Label contents / 1. Manufacturer Name ‘, 2. Customer Parts No. Unreeling direction 3. Our parts no. 4. Quantity 5. Control No. (Shipping lot number) X 6. Manufacturing site b | /\/ Customerla e MADElN OOO >Z
Shigging Lot No. 3 A BOX 'AAAAA YW Month Sequential No (D (2 ® (D First digit of lot No.: Production year (Last number of the Christian era) Example: 201§year —> g ® Second digit of lot No.: Month of production (See the table below.) ® Sequence number of lot No: Alphanumeric characters including space Month 1 N w e or m V co co 8 Code A B C D E F G H J K L .14,
Recommended Soldering Profiles for Lead-free Solder Paste Reflow soldering no 300 Peak 260°C max‘ - m 10sec E g 200 . ; E- l I Gradually ’1: : j: E E cooling . . . . 100 I Preheaiing l I I . < ---------=""> v . <~ -=""> : i 15o“c : : . Healing above 230% 0 l 6056: min I I : 4059c max >ZZ
Operating conditions for guarantee of products are as shown in the specification. Please note that TAIYO YUDEN 00., LTD. shall not be responsible for a failure and/or abnormality which are caused by use under the conditions other than aforesaid operating conditions. I All electronic components listed in this specification are developed, designed and intended for use in general electronics equipment.(for AV, office automation, household, office supply, information service, telecommunications, (such as mobile phone or PC) etc), Before incorporating the components or devices Into any equipment in the field such as transportation, (automotive control, train control. ship control), transportation signal, disaster prevention, medical, public information network(telephone exchange, base station) etc. which may have direct influence to harm or injure a human body, please contact TAlYO YUDEN (20., ND for more detail in advance. Do not incorporate the components into any equipment in fields such as aerospace, aviation, nuclear control, submarine system, military, etc. where higher safety and reliability are especially required. In addition, even electronic components or functional modules that are used for the general electronic equipment, if the equipment or the electric circuit require high safety or reliability function or performances, a sufficient reliability evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to install a protective circuit is strongly recommended at customer's design stage. I Please conduct validation and verification of products in actual condition of mounting and operating environment before commercial shipment of the equipment. I The contents of this specification are applicable to the components which are purchased from our sales offices or distributors (so called TAlYO YUDEN‘s official sales channel), It is only applicable to the components purchased from any of TAIYO YUDEN's official sales channel. I Please note that TAIYO YUDEN 00.. LTD. shall have no responsibility for any controversies or disputes that may occur in connection with a third party's intellectual property rights and other related rights arising from your usage of products in this specification. Taiyo Yuden Co., Ltd. grants no license for such rights. I Caution for export Certain items in this specification may require specific procedures for export according to Foreign Exchange and Foreign Trade Control Law of Japan, U.S. Export Administration Regulations, and other applicable regulations. Should you have any question or inquiry on this matter, please contact our sales staff. 715,

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