B57703M Series Datasheet by EPCOS - TDK Electronics

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@TDK
NTC thermistors for
temperature measurement
Probe assemblies
Series/Type: B57703M
Date: January 2018
© EPCOS AG 2018. Reproduction, publication and dissemination of this publication, enclosures hereto and the
information contained therein without EPCOS' prior express consent is prohibited.
EPCOS AG is a TDK Group Company.
@TDK - 6.5 max 0 5 3 520 5 . A 3 m ’ EB , i E + m ' 1 . x E Awe 26 or 9 Awe an I E rwosnu
1) Depends on mounting situation.
Applications
Surface temperature measurement,
e.g. on housings and heat sinks
Features
High accuracy
Easy mounting
Good thermal coupling through metal tag
Thermistor encapsulated in metal-tag case
AWG 30, PTFE-insulated leads of
silver-plated nickel wire or AWG 26
(stranded, 7 x AWG 34), PTFE-insulated
leads of silver-plated copper wire
UL approval (E69802)
Options
Alternative resistance ratings, rated
temperatures, resistance tolerances, lead
lengths and AWG 28 stranded wires
available on request.
Delivery mode
Bulk
Dimensional drawing
Dimensions in mm
Approx. weight 0.8 g
Ordering code Wire length
"l" in mm
B57703M0103A017 115 ±10
B57703M0103A018 200 ±10
B57703M0103A019 500 ±10
B57703M0103G040 45 ±3
B57703M0303G040 45 ±3
B57703M0502G040 45 ±3
General technical data
Climatic category (IEC 60068-1) 55/125/56
Max. power (at 25 °C) P25 150 mW
Resistance tolerance RR/RR±2 %
Rated temperature TR25 °C
Dissipation factor (in air) δth1) approx. 3 mW/K
Thermal cooling time constant (in air) τc1) approx. 50 s
Heat capacity Cth1) approx. 150 mJ/K
Test voltage (t = 1 s) Vtest 1000 V AC
Temperature measurement B57703M
Probe assemblies M703
Page 2 of 12Please read Cautions and warnings and
Important notes at the end of this document.
@TDK
Electrical specification and ordering codes
R25
No. of R/T
characteristic
B25/100
K
Wire
length "l"
in mm
Wire Ordering code
10 k 8016 3988 ±1% 115 ±10 AWG 26 B57703M0103A017
10 k 8016 3988 ±1% 200 ±10 AWG 26 B57703M0103A018
10 k 8016 3988 ±1% 500 ±10 AWG 26 B57703M0103A019
5 k 8016 3988 ±1% 45 ±3 AWG 30 B57703M0502G040
10 k 8016 3988 ±1% 45 ±3 AWG 30 B57703M0103G040
30 k 8018 3964 ±1% 45 ±3 AWG 30 B57703M0303G040
Note: AWG 26 (stranded, 7 x AWG 34), PTFE-insulated wire of silver-plated copper wire.
AWG 30, PTFE-insulated wire of silver-plated nickel wire.
Reliability data
Test Standard Test conditions R25/R25
(typical)
Remarks
Storage in
dry heat
IEC
60068-2-2
Storage at upper
category temperature
T: 125 °C
t: 1000 h
< 1%1) No visible
damage
Storage in damp
heat, steady state
IEC
60068-2-78
Temperature of air: 40 °C
Relative humidity of air: 93%
Duration: 56 days
< 1%1) No visible
damage
Rapid temperature
cycling
IEC
60068-2-14
Lower test temperature: 55 °C
Upper test temperature: 125 °C
Number of cycles: 10
< 0.5%1) No visible
damage
Endurance Pmax: 150 mW
t: 1000 h
< 1%1) No visible
damage
Long-term stability
(empirical value)
Temperature: 70 °C
t: 10000 h
< 2% No visible
damage
1) Except: B57703M0103A017, B57703M0103A018, B57703M0103A019 R25/R25 (typical) < 2%
Note
Contact of NTC thermistors with any liquids and solvents shall be prevented. It must be
ensured that no water enters the NTC thermistors (e.g. through plug terminals).
Avoid dewing and condensation unless thermistor is specified for these conditions.
Temperature measurement B57703M
Probe assemblies M703
Page 3 of 12Please read Cautions and warnings and
Important notes at the end of this document.
@TDK
R/T characteristics
R/T No. 8016 8018
T (°C) B25/100 = 3988 K B25/100 = 3964 K
RT/R25 α(%/K) RT/R25 α(%/K)
55.0 96.3 7.4 82.408 7.0
50.0 67.01 7.2 58.344 6.8
45.0 47.17 6.9 41.775 6.6
40.0 33.65 6.7 30.235 6.4
35.0 24.26 6.4 22.109 6.2
30.0 17.7 6.2 16.327 6.0
25.0 13.04 6.0 12.171 5.8
20.0 9.707 5.8 9.1548 5.6
15.0 7.293 5.6 6.9458 5.4
10.0 5.533 5.5 5.3135 5.3
5.0 4.232 5.3 4.0972 5.1
0.0 3.265 5.1 3.1834 5.0
5.0 2.539 5.0 2.4915 4.8
10.0 1.99 4.8 1.9637 4.7
15.0 1.571 4.7 1.5582 4.6
20.0 1.249 4.5 1.2444 4.4
25.0 1.0000 4.4 1.0000 4.3
30.0 0.8057 4.3 0.80843 4.2
35.0 0.6531 4.1 0.65732 4.1
40.0 0.5327 4.0 0.53743 4.0
45.0 0.4369 3.9 0.44175 3.9
50.0 0.3603 3.8 0.36497 3.8
55.0 0.2986 3.7 0.30303 3.7
60.0 0.2488 3.6 0.2528 3.6
65.0 0.2083 3.5 0.21187 3.5
70.0 0.1752 3.4 0.17836 3.4
75.0 0.1481 3.3 0.15079 3.3
80.0 0.1258 3.2 0.128 3.2
85.0 0.1072 3.2 0.1091 3.2
90.0 0.09177 3.1 0.093342 3.1
95.0 0.07885 3.0 0.080158 3.0
100.0 0.068 2.9 0.069084 2.9
105.0 0.05886 2.9 0.059747 2.9
110.0 0.05112 2.8 0.051845 2.8
115.0 0.04454 2.7 0.045134 2.7
120.0 0.03893 2.6 0.039416 2.7
125.0 0.03417 2.6 0.034527 2.6
130.0 0.03009 2.5 0.030333 2.6
135.0 0.02654 2.5 0.026724 2.5
140.0 0.02348 2.4 0.02361 2.5
145.0 0.02083 2.4 0.020914 2.4
150.0 0.01853 2.3 0.018575 2.3
155.0 0.01653 2.3 0.016538 2.3
Temperature measurement B57703M
Probe assemblies M703
Page 4 of 12Please read Cautions and warnings and
Important notes at the end of this document.
@TDK
Temperature measurement B57703M
Probe assemblies M703
Page 5 of 12Please read Cautions and warnings and
Important notes at the end of this document.
@TDK
Cautions and warnings
General
See "Important notes" on page 2.
Storage
Store thermistors only in original packaging. Do not open the package prior to processing.
Storage conditions in original packaging: storage temperature 25 °C ... +45 °C, relative
humidity 75% annual mean, <95% maximum 30 days per annum, dew precipitation is
inadmissible.
Do not store thermistors where they are exposed to heat or direct sunlight. Otherwise, the
packing material may be deformed or components may stick together, causing problems during
mounting.
Avoid contamination of thermistor surface during storage, handling and processing.
Avoid storage of thermistors in harmful environments like corrosive gases (SOx, Cl etc).
Use the components as soon as possible after opening the original packaging.
Solder thermistors within the time specified after shipment from EPCOS.
For leaded components this is 24 months, for SMD components with nickel barrier termination
12 months, for leadless components this is 12 months, for SMD components with AgPd
termination 6 months.
Handling
NTC thermistors must not be dropped. Chip-offs or any other damage must not be caused
during handling of NTCs.
Do not touch components with bare hands. Gloves are recommended.
Avoid contamination of thermistor surface during handling.
Washing processes may damage the product due to the possible static or cyclic mechanical
loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts,
which might lead to reduced reliability or lifetime.
Bending / twisting leads
A lead (wire) may be bent at a minimum distance of twice the wire’s diameter plus 4 mm from
the component head or housing. When bending ensure the wire is mechanically relieved at the
component head or housing. The bending radius should be at least 0.75 mm.
Soldering
Use resin-type flux or non-activated flux.
Insufficient preheating may cause ceramic cracks.
Rapid cooling by dipping in solvent is not recommended.
Complete removal of flux is recommended.
Temperature measurement B57703M
Probe assemblies M703
Page 6 of 12Please read Cautions and warnings and
Important notes at the end of this document.
@TDK
Mounting
Ensure that no thermo-mechanical stress occurs due to production processes (curing or
overmolding processes) when thermistors are sealed, potted or overmolded or during their
subsequent operation. The maximum temperature of the thermistor must not be exceeded.
Ensure that the materials used (sealing/potting compound and plastic material) are chemically
neutral.
Electrodes/contacts must not be scratched or damaged before/during/after the mounting
process.
Contacts and housing used for assembly with the thermistor must be clean before mounting.
Ensure that adjacent materials are designed for operation at temperatures comparable to the
surface temperature of the thermistor. Be sure that surrounding parts and materials can
withstand the temperature.
Avoid contamination of the thermistor surface during processing.
The connections of sensors (e.g. cable end, wire end, plug terminal) may only be exposed to
an environment with normal atmospheric conditions.
Tensile forces on cables or leads must be avoided during mounting and operation.
Bending or twisting of cables or leads directly on the thermistor body is not permissible.
Avoid using chemical substances as mounting aids. It must be ensured that no water or other
liquids enter the NTC thermistors (e.g. through plug terminals). In particular, water based
substances (e.g. soap suds) must not be used as mounting aids for sensors.
The use of no-clean solder products is recommended. In any case mild, non-activated fluxes
should be used. Flux residues after soldering should be minimized.
Operation
Use thermistors only within the specified operating temperature range.
Use thermistors only within the specified power range.
Environmental conditions must not harm the thermistors. Only use the thermistors under
normal atmospheric conditions or within the specified conditions.
Contact of NTC thermistors with any liquids and solvents shall be prevented. It must be
ensured that no water enters the NTC thermistors (e.g. through plug terminals). For
measurement purposes (checking the specified resistance vs. temperature), the component
must not be immersed in water but in suitable liquids (e.g. perfluoropolyethers such as Galden).
Avoid dewing and condensation unless thermistor is specified for these conditions.
Bending or twisting of cables and/or wires is not permissible during operation of the sensor in
the application.
Be sure to provide an appropriate fail-safe function to prevent secondary product damage
caused by malfunction.
This listing does not claim to be complete, but merely reflects the experience of EPCOS AG.
Display of ordering codes for EPCOS products
The ordering code for one and the same EPCOS product can be represented differently in data
Temperature measurement B57703M
Probe assemblies M703
Page 7 of 12Please read Cautions and warnings and
Important notes at the end of this document.
@TDK
sheets, data books, other publications, on the EPCOS website, or in order-related documents
such as shipping notes, order confirmations and product labels. The varying representations of
the ordering codes are due to different processes employed and do not affect the
specifications of the respective products. Detailed information can be found on the Internet
under www.epcos.com/orderingcodes
Temperature measurement B57703M
Probe assemblies M703
Page 8 of 12Please read Cautions and warnings and
Important notes at the end of this document.
@TDK
Symbols and terms
Symbol English German
A Area Fläche
AWG American Wire Gauge Amerikanische Norm für Drahtquerschnitte
B B value B-Wert
B25/100 B value determined by resistance
measurement at 25 °C and 100 °C
B-Wert, ermittelt durch Widerstands-
messungen bei 25 °C und 100 °C
Cth Heat capacitance Wärmekapazität
I Current Strom
N Number (integer) Anzahl (ganzzahliger Wert)
P25 Maximum power at 25 °C Maximale Leistung bei 25 °C
Pdiss Power dissipation Verlustleistung
Pel Electrical power Elektrische Leistung
Pmax Maximum power within stated
temperature range
Maximale Leistung im
angegebenenTemperaturbereich
RB/RBResistance tolerance caused by
spread of B value
Widerstandstoleranz, die durch die
Streuung des B-Wertes verursacht wird
Rins Insulation resistance Isolationswiderstand
RPParallel resistance Parallelwiderstand
RRRated resistance Nennwiderstand
RR/RRResistance tolerance Widerstandstoleranz
RSSeries resistance Serienwiderstand
RTResistance at temperature T
(e.g. R25 = resistance at 25 °C)
Widerstand bei Temperatur T
(z.B. R25 = Widerstand bei 25 °C)
T Temperature Temperatur
TTemperature tolerance Temperaturtoleranz
tTime Zeit
TAAmbient temperature Umgebungstemperatur
Tmax Upper category temperature Obere Grenztemperatur
(Kategorietemperatur)
Tmin Lower category temperature Untere Grenztemperatur
(Kategorietemperatur)
Top Operating temperature Betriebstemperatur
TRRated temperature Nenntemperatur
Tsurf Surface temperature Oberflächentemperatur
V Voltage Spannung
Vins Insulation test voltage Isolationsprüfspannung
Vop Operating voltage Betriebsspannung
Vtest Test voltage Prüfspannung
Temperature measurement B57703M
Probe assemblies M703
Page 9 of 12Please read Cautions and warnings and
Important notes at the end of this document.
@TDK
Symbol English German
αTemperature coefficient Temperaturkoeffizient
Tolerance, change Toleranz, Änderung
δth Dissipation factor Wärmeleitwert
τcThermal cooling time constant Thermische Abkühlzeitkonstante
τaThermal time constant Thermische Zeitkonstante
Abbreviations / Notes
Symbol English German
Surface-mounted devices Oberflächenmontierbares Bauelement
*To be replaced by a number in ordering
codes, type designations etc.
Platzhalter für Zahl im Bestellnummern-
code oder für die Typenbezeichnung.
+To be replaced by a letter. Platzhalter für einen Buchstaben.
All dimensions are given in mm. Alle Maße sind in mm angegeben.
The commas used in numerical values
denote decimal points.
Verwendete Kommas in Zahlenwerten
bezeichnen Dezimalpunkte.
Temperature measurement B57703M
Probe assemblies M703
Page 10 of 12Please read Cautions and warnings and
Important notes at the end of this document.
{é‘yTDK
Page 11 of 12
Important notes
The following applies to all products named in this publication:
1. Some parts of this publication contain statements about the suitability of our products for
certain areas of application. These statements are based on our knowledge of typical
requirements that are often placed on our products in the areas of application concerned. We
nevertheless expressly point out that such statements cannot be regarded as binding
statements about the suitability of our products for a particular customer application. As a
rule we are either unfamiliar with individual customer applications or less familiar with them than
the customers themselves. For these reasons, it is always ultimately incumbent on the customer
to check and decide whether a product with the properties described in the product specification is
suitable for use in a particular customer application.
2. We also point out that in individual cases, a malfunction of electronic components or failure
before the end of their usual service life cannot be completely ruled out in the current state
of the art, even if they are operated as specified. In customer applications requiring a very high
level of operational safety and especially in customer applications in which the malfunction or
failure of an electronic component could endanger human life or health (e.g. in accident
prevention or life-saving systems), it must therefore be ensured by means of suitable design of the
customer application or other action taken by the customer (e.g. installation of protective circuitry
or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or
failure of an electronic component.
3. The warnings, cautions and product-specific notes must be observed.
4. In order to satisfy certain technical requirements, some of the products described in this
publication may contain substances subject to restrictions in certain jurisdictions (e.g.
because they are classed as hazardous). Useful information on this will be found in our Material
Data Sheets on the Internet (www.tdk-electronics.tdk.com/material). Should you have any more
detailed questions, please contact our sales offices.
5. We constantly strive to improve our products. Consequently, the products described in this
publication may change from time to time. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications
contained in this publication are still applicable before or when you place an order.
We also reserve the right to discontinue production and delivery of products. Consequently,
we cannot guarantee that all products named in this publication will always be available.
The aforementioned does not apply in the case of individual agreements deviating from the
foregoing for customer-specific products.
6. Unless otherwise agreed in individual contracts, all orders are subject to our General Terms
and Conditions of Supply.
7. Our manufacturing sites serving the automotive business apply the IATF 16949 standard.
The IATF certifications confirm our compliance with requirements regarding the quality
management system in the automotive industry. Referring to customer requirements and
customer specific requirements (“CSR”) TDK always has and will continue to have the policy of
respecting individual agreements. Even if IATF 16949 may appear to support the acceptance of
unilateral requirements, we hereby like to emphasize that only requirements mutually agreed
upon can and will be implemented in our Quality Management System. For clarification
purposes we like to point out that obligations from IATF 16949 shall only become legally binding if
individually agreed upon.
{é‘yTDK
Page 12 of 12
Important notes
8. The trade names EPCOS, CeraCharge, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CTVS,
DeltaCap, DigiSiMic, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD, MKK,
MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PowerHap, PQSine, PQvar,
SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, ThermoFuse,
WindCap are trademarks registered or pending in Europe and in other countries. Further
information will be found on the Internet at www.tdk-electronics.tdk.com/trademarks.
Release 2018-10

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