CX3225GB Series Spec Datasheet by Kyocera International Inc. Electronic Components

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Sgecification Deswgn Depanmem
KYOCERA Crystal Device Corporation
KBS-5079E
Specification
Drawing No. K1101-13749-431 1/11
Issued Date. Jul.29, 2013
TO: Digi-Key
NoteIn case of specification change, KYOCERA Part Number also will be changed.
Product Name Quartz Crystal
Product Model CX3225GB
Frequency Refer to K1101-13749-431 3/11 Nominal Frequency
Customer Part Number -
Customer Specification Number -
KYOCERA Part Number Refer to K1101-13749-431 3/11 KYOCERA Part Number
Remarks RoHS CompliantMSL 1
Customer Acceptance
Accept Signature Approved Date
Department
Person in charge
Seller Manufacturer
KYOCERA Corporation KYOCERA Crystal Device Corporation
6 Takeda Tobadono-cho, Fushimi-ku, Kyoto 5850, Higashine-Koh, Higashine-Shi, Yamagata
612-8501 Japan 999-3701 Japan
TEL. No. 075-604-3500 TEL. No. 0237-43-5611
FAX. No. 075-604-3501 FAX. No. 0237-43-5615
Design Department Quality Assurance Approved by Checked by Issued by
KYOCERA Crystal Device Corporation
Crystal Design Section
Crystal Units Division
A.Kikuchi
Y.Takahashi
T.Nitoube
M.Konno
Drawing No. K1101-13749-431 2/11
KYOCERA Crystal Device Corporation
KBS-5079E
Revision History
Rev.No. Description of revise Date Approved by Checked by Issued by
1 First Edition Jul.29,2013 Y.Takahashi T.Nitoube M.Konno
Drawing No. K1101-13749-431 3/11
KYOCERA Crystal Device Corporation
KBS-5079E
[PART NUMBER LIST]
Nominal
Frequency
(MHz)
KYOCERA Part Number ESR
()
Nominal
Frequency
Code
10 CX3225GB10000D0HEQCC 300 10000
12 CX3225GB12000D0HEQCC 250 12000
13.56 CX3225GB13560D0HEQCC 250 13560
14.31818 CX3225GB14318D0HEQCC 100 14318
14.7456 CX3225GB14745D0HEQCC 100 14745
16 CX3225GB16000D0HEQCC 80 16000
18.432 CX3225GB18432D0HEQCC 80 18432
19.2 CX3225GB19200D0HEQCC 80 19200
20 CX3225GB20000D0HEQCC 60 20000
22.5792 CX3225GB22579D0HEQCC 60 22579
24 CX3225GB24000D0HEQCC 60 24000
24.576 CX3225GB24576D0HEQCC 60 24576
25 CX3225GB25000D0HEQCC 60 25000
27 CX3225GB27000D0HEQCC 50 27000
30 CX3225GB30000D0HEQCC 50 30000
32 CX3225GB32000D0HEQCC 50 32000
33.333 CX3225GB33333D0HEQCC 50 33333
38.4 CX3225GB38400D0HEQCC 50 38400
40 CX3225GB40000D0HEQCC 50 40000
48 CX3225GB48000D0HEQCC 50 48000
54 CX3225GB54000D0HEQCC 50 54000
Referm K1101-13749-431 3/11 KYOCERA Pan Number
Drawing No. K1101-13749-431 4/11
KYOCERA Crystal Device Corporation
KBS-5079E
1. APPLICATION
This specification sheet is applied to quartz crystal “CX3225GB”
2. KYOCERA PART NUMBER
Refer to K1101-13749-431 3/11 KYOCERA Part Number
3. RATINGS
Items SYMB. Rating Unit Remarks
Operating Temperature Topr -10~+70 °C
Storage Temperature Range Tstg -40~+85 °C
4. CHARACTERISTICS
4-1 ELECTRICAL CHARACTERISTICS
1 Refer to K1101-13749-431 3/11 Nominal Frequency
2 Refer to K1101-13749-431 3/11 ESR
Items Electrical Specification Test Condition Remarks
SYMB. Min. Typ. Max. Unit
Mode of Vibration Fundamental
Nominal
Frequency
F0 1 MHz
Nominal
Temperature
TNOM +25 °C
Load Capacitance CL 8.0 pF
Frequency
Tolerance
df/F -20.0 +20.0
PPM
+253°C
Frequency
Temperature
Characteristics
df/F -30.0 +30.0 -10~+70°C
Frequency Aging
Rate
-5.0 +5.0 1 year +253°C
Equivalent Series
Resistance
ESR 2
Drive Level
Pd 0.01 100 μW
Insulation
Resistance
IR 500 M 100V(DC)
OUTLINE DIMENSION (not to scale) 1 ‘ 3.20:0.1 4*R0.20 EC \‘ n Pin4 ‘ , i”, \ Pln3 o F. . O . 3 o % D N' K 3 O 1 F . _________ ‘ V ‘ 1;», N v i l ‘\ ‘ ‘x ’K .5 3 Pin1 / l ‘1“ Pin2 \Inm i l 2 / 3 4 r_ HOT 9 "a. A; o . ‘U 9V PIN P o 7 No. V 7 7 Pin1 H I A Pin2 N T Pin3 H , 7 , 470.2:01 pin4 N 4*1.00:0.L >I
Drawing No. K1101-13749-431 5/11
KYOCERA Crystal Device Corporation
KBS-5079E
5. APPEARANCES, PHYSICAL DIMENSION
OUTLINE DIMENSION (not to scale)
MARKING
1 Nominal Frequency Move the number of maximum indication beams of the
frequency to five digitsand omit less than kHz
2 Identification
3 Date Code YearLAST 1 DIGIT of YEAR AND WEEK
(Ex) Jan. 1, 2013 301
4 Manufacturing Location FKYOCERA Crystal Device Philippines, Inc
3 Refer to K1101-13749-431 3/11 Nominal Frequency Code.
The font of marking is reference.
PIN
No.
PIN Layout
Pin1 HOT
Pin2 NC
Pin3 HOT
Pin4 NC
Pin1
Pin4
Pin2
Pin3
NC
HOT
HOT
NC
Pin4 Pin3
Pin1 Pin2
3
K 3 0 1 F
UNIT mm
0.8±0.1
3
2.50±0.1
3.20±0.1
1
4R0.20
40.2±0.1
41.00±0.1
80.10±0.1
40.7
5
±0.1
C 0.30
0.2±0.05
2 4
There is not consistency of a
direction of indication for NC.
CONNECTION
TOP VIEW
Pin1
Pin4 Pin3
Pin2
KYOCERA Crystal Device Corp UNIT : mm
Drawing No. K1101-13749-431 6/11
KYOCERA Crystal Device Corporation
KBS-5079E
6. RECOMMENDED LAND PATTERN (not to scale)
UNIT mm
1.05 1.05
0.8
1.3 1.3
1.0
400~560mm 7-4.Specilication Mateuar ofme Lamenape emu be PS (ESD). Maoenal Dime sear rape snarl be pubesmESD) The sear rape snarl "alum/Brine swam holesAnd m1 pmudefrom Ihe mmercape. renalesbengm ufmetape. |0N or mare. The Roftheoomerwmdesgnamn Is a ZRMAX, Disakg‘manlbetwean centers Dime mvlty and model hole snarl be a 05mm mess. Cunuratme pnen tolerance of "PD“ shal be :uznm at 10 prtches The number of back Is 01% 01 1 leer ml pan nunber (me number of lhe tame term) orme panrbrrrmng wmse1 emen (am, the Irmg whm lack aflhe munuanue Is ml rn.) 9 The mum on parts rs named ns unecrm ns erecbm maladansncls equal. 1U.Pealrng force oflhe seanape. 0,1 to 1,0N Cavertzpe p we KYOCERA Crystal Device Corporation mdmmbmm)
Drawing No. K1101-13749-431 7/11
KYOCERA Crystal Device Corporation
KBS-5079E
7.TAPING & REEL 梱包補助材
7-1.Dimensions
7-2.Leader and trailer tape
7-3.DirectionThe direction shall be seen from the top cover tape side
7-4.Specification
1. Material of the carrier tape shall be PS (ESD).
2. Material of the seal tape shall be polyester(ESD).
3. The seal tape shall not cover the sprocket holes. And not protrude from the carrier tape.
4. Tensile strength of the tape : 10N or more.
5. The R of the corner without designation is 0.2RMAX.
6. Disalignment between centers of the cavity and sprocket hole shall be 0.05mm or less.
7. Cumulative pitch tolerance of “P0 shall be ±0.2mm at 10 pitches.
8. The number of lack is 0.1% of 1 reel total part number (the number of the table letters) or the part following whose 1 either is big.
(But, the thing which lack of the continuance is not in.)
9. The marking on parts is not fixed its direction, its electrical characteristic is equal.
10. Peeling force of the seal tape: 0.1 to 1.0N.
3.5±0.05
4.0±0.1
2.0±0.05
4.0±0.1
φ1.05±0.15 φ1.55±0.05
(3.7)
3.5±0.1
1.75±0.1
8.0±0.2
(3.0)
2.8±0.1
1.0±0.1
0.25±0.05
Unreeling direction
Cover tape
Career tape
Unreeling direction
400560mm
END
START
Leader
Empty compartment
Components
Empty compartment
100mm
160mm or more
or more
165°180°
Drawing No. K1101-13749-431 8/11
KYOCERA Crystal Device Corporation
KBS-5079E
7-5.Reel specifications
(Nonconductor type Reel)
In the case of Φ180 Reel (3000 pcs max, every 1000 pcs)
A B C D
Dimension φ180 +0/-1.5 φ60 +1/-0 φ13±0.2 φ21±0.8
Symbol E W t
Dimension 2.0±0.5 9±1 2.0±0.5
(Unit : mm)
C
D
E
B
Wt
Drawing No. K1101-13749-431 9/11
KYOCERA Crystal Device Corporation
KBS-5079E
8.Enviromental requirements
After following test, frequency shall not change more than ±20×10-6
And CI,±20% or 5Ωof large value.
8.1 Resistance to Shock Test condition
Natural dropped from height 100cm onto hard wood
board in 3 times
8.2 Resistance to Vibration Test condition
frequency 1055 10 Hz
Amplitude 1.5mm
Cycle time 15 minutes
Direction X,Y,Z (3direction),2 h each.
8.3 Resistance to Heat Test condition
The quartz crystal unit shall be stored at a
temperature of +85±C for 500 h.
Then it shal be subjected to standard atmospheric
conditions for 1 h ,after whichi measurement shall
be made.
8.4 Resistance to Cold Test condition
The quartz crystal unit shall be stored at a
temperature of -40±2°C for 500 h.
Then it shal be subjected to standard atmospheric
conditions for 1 h ,after whichi measurement shall
be made.
8.5 Thermal Shock Test condition
The quartz crystal unit shall be subjected to 500
succesive change of temperature cycles each as
shown in table belowThen it shall be subjected
to standard atmospheric conditions for 1hafter
which measurements shall be made.
Cycle -40±C30min.to 25±2°C5min.
to +85±2°C30min.to 25±2°C5min.
o 4.—.— o 50 m 150 200 250 300 350 fima|nc.] KYOCERA Cwstal Device Corporation
Drawing No. K1101-13749-431 10/11
KYOCERA Crystal Device Corporation
KBS-5079E
8.6 Resistance to Moisture Test condition
The quartz crystal unit shall be stored at a
temperature of 60±C wich relative humidity of
90% to 95% for 240 h. Then it shall be subjected
to standard atmospheric conditions for 1hafter
which measurements shall be made
8.7 Soldering condition 1. Material of solder
Kind lead free solder paste
Melting point +220±5°C
2. Reflow temp.profile
Frequency shift : ±2ppm
3. Hand Soldering +350°C 3 sec MAX
4. Reflow Times 2 times
Reflow temp.profile
8.8 Intensity for bending in circuit board
Solder this product in center of the circuit board of 40
mm
×100
mm
and add the deflection of 3mm as the bottom figure.
Test board : t1.6mm
Temp [°C] Time[sec]
Preheating +150 to +180 150 (typ.)
Peak +260±5 10 (max.)
To t al 300 (max.)
PUSH
board
45 45
1.6
UNIT : mm
R5
R340
10
20
press jig
Product
Drawing No. K1101-13749-431 11/11
KYOCERA Crystal Device Corporation
KBS-5079E
9.Cautions for use
1Automatic mounting machine use
Please use after affirmation that select the mounting machine model with a shock small if possible in
the case of use of an automatic mounting machine, and it does not have breakage. There is a risk of
a quartz crystal unit breakage occurring and not functioning normally by too much shock etc..
2Conformity of a circuit
In case of use of an oscillation circuit, please insert in a quartz crystal unit in series resistance 5 time as
many as the standard value of equivalent in-series resistance, and confirm oscillating. Please
remove resistance which inserted after the notes above-mentioned examination in the quartz crystal
unit in series, and use it.
3After making the Quartz Crystal mount on a printed circuit board ,if it is required to devide the printed
circuit board into another one, use it with attentive confirmation so that a warp cased by this dividing
might not affect any damage. When designing a printed circuit board as well as handling the mounting
As much as possible. The quartz crystal shall be passed through the reflow furnace. Then it shall be
subjected to standard atmospheric conditions, after which cleaning shall be made.
10.Storage conditions
Storage at prolonged high temperature or low temperature and the storage by high humidity cause
degradation of frequency accuracy, and degradation of soldering nature. Storage is performed at the
temperature of 18-30 degrees C, and the humidity of 20-70 Percent in the state of packing, and a term is 6
months.
11. Manufacturing location
KYOCERA Crystal Device Philippines, Inc.
12. Quality Assurance
Kyocera Crystal Device Quality Assurance Division
13. Quality guarantee
When the failure by the responsibility of our company occurs clearly after delivery within 1 year,
a substitute article etc. is appropriated gratuitously and this is guaranteed. However, when passing
1 year after delivery, there is a case where I am allowed to consider as onerous repair after both
consultation.
14.Others
When any questions and opinions are in the written matter of these delivery specifications, I will ask
connection of you from the our company issue day within 45 days. In a connection no case, a written
matter is consented to it and employed within a term.

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