LSHM-DV Series Datasheet by Samtec Inc.

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(0.50 mm) .0197" LSHM-DV SERIES
Mated height
variety/flexibility
Optional
shielding
LSHM–130–02.5–L–DV–A–S–K–TR
LSHM–150–02.5–L–DV–A–N–K–TR
LSHM–120–04.0–L–DV–A–N–K–TR
Self-mating
system
can reduce
inventory costs
Audible click when
properly mated
High-speed/High-density
Slim row-to-row
design
Low cost
Blade & Beam
contact
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
Board Mates:
LSHM
Cable Mates:
HLCD
NO. PINS
PER ROW
PLATING
OPTION
TAIL
OPTION
05, 10, 20,
30, 40, 50
1
LSHM LEAD
STYLE
SHIELD
OPTION
–S
= With
Shield
–N
= Without
Shield
A K TR
Note:
Some lengths, styles and
options are non-standard,
non-returnable.
DV–N
DV–S
Specify
LEAD
STYLE
from
chart
– DV
= Vertical
–K
= (3.50 mm)
.138" DIA
Polyimide
film Pick &
Place Pad
TR
= Tape &
Reel
HIGH-SPEED HERMAPHRODITIC STRIP
–F
= Gold flash
on contact,
Matte Tin
on tail
–L
=10 µ"
(0.25 µm)
Gold on
contact,
Matte Tin
on tail
LEAD
STYLE
(STANDARD)
LEAD
STYLE
(LUBRICATED)
A B
02.5 –L2.5 (3.95) .156 (1.00) .039
–03.0 –L3.0 (4.45) .175 (1.50) .059
–04.0 –L4.0 (5.45) .215 (2.50) .098
–06.0 –L6.0 (7.45) .293 (4.50) .177
(0.50) .0197
(0.50) .0197
B
No. of positions x
(0.50) .0197
+ (4.70) .185
No. of positions
x (0.50) .0197
+ (2.00) .078
(4.98)
.196
(0.85)
.033 A
(1.32)
.052
DIA
(0.80)
.031
No. of positions
x (0.50) .0197
+ (4.95) .195
• High retention
contacts
• Audible click
when mated
• Shrouded
For complete specifications and
recommended PCB layouts see
www.samtec.com?LSHM
Insulator Material:
Black Liquid Crystal Polymer
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Current Rating:
2.0 A per pin
(2 adjacent pins powered)
Operating Temp Range:
-55 °C to +125 °C
RoHS Compliant:
Ye s
For complete scope of
recognitions see
www.samtec.com/quality
RECOGNITIONS
PROCESSING
SPECIFICATIONS
Lead-Free Solderable:
Ye s
SMT Lead Coplanarity:
(0.10 mm) .004" max
Board Stacking:
For applications requiring two
or more connectors per board,
contact ipg@samtec.com
FILE NO. E111594
APPLICATION
LEAD STYLE MATED
HEIGHT*
02.5 & –02.5 (5.00) .196
02.5 & –03.0 (5.50) .217
03.0 & –03.0 (6.00) .236
02.5 & –04.0 (6.50) .256
03.0 & –04.0 (7.00) .276
04.0 & –04.0 (8.00) .315
02.5 & –06.0 (8.50) .335
–03.0 & –06.0 (9.00) .354
–04.0 & –06.0 (10.00) .394
–06.0 & –06.0 (12.00) .472
*Processing conditions will
affect mated height.
MATED
HEIGHT
LSHM
Gbps
14
HIGH-SPEED CHANNEL PERFORMANCE
LSHM-DV/LSHM-DV @ 5 mm Mated Stack Height
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact SIG@samtec.com
F-219

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