SEAM Series Datasheet by Samtec Inc.

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— HIGH SPEED/HIGH DENSITY OPEN PIN FIELD 4% V —- NO.PINS m ‘l-I-I-II-
(1.27 mm) .050" SEAM SERIES
SEAM–30–02.0–S–08–2A–KTR
SEAM–3003.5–S04–2–A–KTR
SEAM–20–02.0–S–10–2–AKTR
Solder
charges
Up to 500
Pins
Low
insertion/
extraction
forces
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
For complete specifications and
recommended PCB layouts see
www.samtec.com?SEAM
Insulator Material:
Black LCP
Contact Material:
Copper Alloy
Operating Temp Range:
-55 °C to +125 °C
Current Rating
(7 mm stack height):
2.7 A per pin
(10 adjacent pins powered)
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Working Voltage:
240 VAC
RoHS Compliant:
Yes (–2 Solder type only)
Lead-Free Solderable:
Ye s
Mates with:
SEAF, SEAFP
Standoffs:
JSO
SPECIFICATIONS
For complete scope of
recognitions see
www.samtec.com/quality
RECOGNITIONS
EXTENDED LIFE
PRODUCT
10 YEAR MFG
WITH 30 µ" GOLD
HIGH MATING
CYCLES
FILE NO. E111594
OTHER SOLUTIONS
Up to 560 pins
HIGH-SPEED/HIGH-DENSITY OPEN-PIN-FIELD
STANDARDS
NO. OF
ROWS B
–04 (7.06) .278
–05, –06 (9.60) .378
–08 (12.14) .478
–10 (14.68) .578
Compatible with
UMPT/UMPS for flexible
two-piece power/signal solutions
POWER/SIGNAL
APPLICATION
MATED HEIGHTS
SEAM
LEAD
STYLE
SEAF LEAD STYLE
–05.0 –06.0 –06.5 –07.5
–02.0 7 mm 8 mm 8.5 mm 9.5 mm
–03.0 8 mm 9 mm 9.5 mm 10.5 mm
–03.5 8.5 mm 9.5 mm 10 mm 11 mm
–06.5 11.5 mm 12.5 mm 13 mm 14 mm
–07.0 12 mm 13 mm 13.5 mm 14.5 mm
–09.0 14 mm 15 mm 15.5 mm 16.5 mm
–11.0 16 mm 17 mm 17.5 mm 18.5 mm
HIGH-SPEED CHANNEL PERFORMANCE
SEAF/SEAM @ 10 mm Mated Stack Height
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact SIG@samtec.com
VITA 47
VITA 57.1 FMC
VITA 57.4 FMC+
VITA 74 VNX
• PISMO 2
Visit www.samtec.com/standards
for more information.
(1.12 mm)
.044"
NOMINAL
WIPE
SEAM
A K
“X”R
PLATING
OPTION
NO. OF
ROWS
LEAD
STYLE
–04
=Four Rows
(–06.5 not
available)
–05
=Five Rows
(–06.5 not
available)
–06
=Six Rows
(–06.5 not
available)
–08
=Eight Rows
–10
=Ten Rows
Specify
LEAD
STYLE
from
chart
NO. PINS
PER ROW
–L
= 10 µ"
(0.25 µm)
Gold on
contact area,
Matte Tin on
solder tail
–S
= 30 µ"
(0.76 µm)
Gold on
contact area,
Matte Tin on
solder tail
SOLDER
TYPE
–1
= Tin/Lead
Alloy
Solder
Charge
–2
= Lead-Free
Solder
Charge
Notes:
IPC-A-610F & IPC-J-STD-001F
Class 3 solder joint.
Some sizes, styles and
options are non-standard,
non-returnable.
–10, –15, –20,
–30, –40, –50
(–10 only available
in 04 row)
(–15 is only available
in 4 Row with -02.0
lead style and 10 row
with any lead style)
–A
= Alignment Pins
(Required. Arrays
will not self-center
on solder pads)
–K
= Polyimide film
Pick & Place Pad
–TR
=Tape & Reel
–FR
= Full Reel Tape &
Reel Packaging
(Must order max. quantities
per reel. Contact Samtec
for parts per reel)
F-219 (Rev 19AUG20)
(0.86)
.034
DIA
(1.02)
.040
(1.27)
.050
(1.27)
.050
(1.27)
.050
No. of positions x (1.27) .050 + (3.58) .141
No. of positions x (1.27) .050 + (4.98) .196
A
(1.12)
.044
DIA
(1.02)
.040
B
H1
A1
LEAD
STYLE A
–02.0 (5.61) .221
–03.0 (6.60) .260
–03.5 (7.11) .280
–06.5 (10.16) .400
–07.0 (10.59) .417
–09.0 (12.60) .496
–11.0 (14.61) .575

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