Same Sky (Formerly CUI Devices) Heat Sinks

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Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Type	Package Cooled	Attachment Method	Shape	Length	Width	Diameter	Fin Height	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Thermal Resistance @ Natural	Material	Material Finish
HSS15-B20-P40 HEAT SINK, STAMPING, TO-220, 23. Same Sky (Formerly CUI Devices)	1,308 In Stock	1 : £0.77000 Box	HSS	Box	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular	1.500" (38.10mm)	0.921" (23.40mm)	-	0.500" (12.70mm)	5.0W @ 75°C	8.50°C/W @ 200 LFM	15.16°C/W	Aluminum Alloy	Black Anodized
HSS-B20-0953H-02 HEATSINK TO-220 2.9W ALUMINUM Same Sky (Formerly CUI Devices)	1,542 In Stock	1 : £0.36000 Bag	HSS	Bag	Active	Board Level, Vertical	TO-220	PC Pin	Rectangular, Fins	0.500" (12.70mm)	0.504" (12.80mm)	-	0.748" (19.00mm)	2.9W @ 75°C	7.24°C/W @ 200 LFM	25.92°C/W	Aluminum	Black Anodized
HSS-B20-0635H-01 HEATSINK TO-220 2.7W ALUMINUM Same Sky (Formerly CUI Devices)	10,040 In Stock	1 : £0.38000 Bag	HSS	Bag	Active	Board Level, Vertical	TO-220	PC Pin	Rectangular, Fins	0.520" (13.20mm)	0.375" (9.53mm)	-	0.748" (19.00mm)	2.7W @ 75°C	9.51°C/W @ 200 LFM	27.78°C/W	Aluminum	Black Anodized
HSE-B2111-038 HEAT SINK, EXTRUSION, TO-220, 25 Same Sky (Formerly CUI Devices)	7,936 In Stock	1 : £0.44000 Box	HSE	Box	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	0.984" (25.00mm)	0.625" (16.00mm)	-	0.354" (9.00mm)	3.8W @ 75°C	6.12°C/W @ 200 LFM	19.74°C/W	Aluminum Alloy	Black Anodized
HSS-B20-NP-04 HEATSINK TO-220 6.5W ALUMINUM Same Sky (Formerly CUI Devices)	5,356 In Stock	1 : £0.49000 Box	HSS	Box	Active	Board Level	TO-220	Bolt On	Rectangular, Fins	1.450" (36.83mm)	1.750" (44.45mm)	-	0.370" (9.40mm)	6.5W @ 75°C	3.76°C/W @ 200 LFM	11.54°C/W	Aluminum	Black Anodized
HSS-B20-NPR-02 HEATSINK TO-220 5.1W ALUMINUM Same Sky (Formerly CUI Devices)	2,000 In Stock	1 : £0.51000 Bag	HSS	Bag	Active	Board Level, Vertical	TO-220	Bolt On and Board Mounts	Rectangular, Fins	0.500" (12.70mm)	1.000" (25.40mm)	-	1.180" (29.97mm)	5.1W @ 75°C	4.20°C/W @ 200 LFM	14.71°C/W	Aluminum	Black Anodized
HSB02-101007 HEAT SINK, BGA, 10 X 10 X 7 MM Same Sky (Formerly CUI Devices)	4,189 In Stock	1 : £0.52000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.394" (10.00mm)	0.394" (10.00mm)	-	0.275" (7.00mm)	2.0W @ 75°C	16.50°C/W @ 200 LFM	37.90°C/W	Aluminum Alloy	Black Anodized
HSB01-080808 HEAT SINK, BGA, 8.5 X 8.5 X 8 MM Same Sky (Formerly CUI Devices)	1,554 In Stock	1 : £0.56000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.335" (8.50mm)	0.335" (8.50mm)	-	0.315" (8.00mm)	1.9W @ 75°C	16.00°C/W @ 200 LFM	39.10°C/W	Aluminum Alloy	Black Anodized
HSB03-141406 HEAT SINK, BGA, 14 X 14 X 6 MM Same Sky (Formerly CUI Devices)	2,030 In Stock	1 : £0.57000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.551" (14.00mm)	0.551" (14.00mm)	-	0.236" (6.00mm)	2.1W @ 75°C	15.80°C/W @ 200 LFM	35.98°C/W	Aluminum Alloy	Black Anodized
HSS-B20-CP-01 HEATSINK TO-220 2.6W ALUMINUM Same Sky (Formerly CUI Devices)	1,963 In Stock	1 : £0.58000 Box	HSS	Box	Active	Board Level	TO-220	Clip	Rectangular, Fins	0.375" (9.53mm)	0.900" (22.86mm)	-	0.740" (18.79mm)	2.6W @ 75°C	6.32°C/W @ 200 LFM	28.85°C/W	Aluminum	Black Anodized
HSS-B20-061H HEATSINK TO-220 4W ALUMINUM Same Sky (Formerly CUI Devices)	1,452 In Stock	1 : £0.64000 Box	HSS	Box	Active	Board Level	TO-220	PC Pin	Rectangular, Fins	1.500" (38.10mm)	0.504" (12.80mm)	-	0.500" (12.70mm)	4.0W @ 75°C	5.01°C/W @ 200 LFM	18.63°C/W	Aluminum	Black Anodized
HSB07-202009 HEAT SINK, BGA, 20 X 20 X 9 MM Same Sky (Formerly CUI Devices)	1,062 In Stock	1 : £0.64000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.787" (20.00mm)	0.787" (20.00mm)	-	0.354" (9.00mm)	3.1W @ 75°C	8.60°C/W @ 200 LFM	24.08°C/W	Aluminum Alloy	Black Anodized
HSB31-212105 HEAT SINK, BGA, 21 X 21 X 5 MM Same Sky (Formerly CUI Devices)	1,758 In Stock	1 : £0.65000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.827" (21.00mm)	0.827" (21.00mm)	-	0.197" (5.00mm)	3.0W @ 75°C	9.90°C/W @ 200 LFM	25.33°C/W	Aluminum Alloy	Black Anodized
HSB03-121218 HEAT SINK, BGA, 12 X 12 X 18 MM Same Sky (Formerly CUI Devices)	1,055 In Stock	1 : £0.69000 Tray	HSB	Tray	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.472" (12.00mm)	0.472" (12.00mm)	-	0.709" (18.00mm)	3.1W @ 75°C	9.60°C/W @ 200 LFM	24.01°C/W	Aluminum Alloy	Black Anodized
HSS-B20-0503H HEATSINK TO-220 4.6W ALUMINUM Same Sky (Formerly CUI Devices)	2,179 In Stock	1 : £0.69000 Box	HSS	Box	Active	Board Level, Vertical	TO-220	PC Pin	Rectangular, Fins	0.500" (12.70mm)	1.000" (25.40mm)	-	1.180" (29.97mm)	4.6W @ 75°C	5.44°C/W @ 200 LFM	16.30°C/W	Aluminum	Black Anodized
HSB24-252510 HEAT SINK, BGA,25 X 25 X 10 MM Same Sky (Formerly CUI Devices)	1,093 In Stock	1 : £0.69000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.984" (25.00mm)	0.984" (25.00mm)	-	0.394" (10.00mm)	4.14W @ 75°C	6.50°C/W @ 200 LFM	18.10°C/W	Aluminum Alloy	Black Anodized
HSS24-B20-NP HEAT SINK, STAMPING, TO-218/TO-2 Same Sky (Formerly CUI Devices)	2,709 In Stock	1 : £0.74000 Box	HSS	Box	Active	Top Mount	TO-218, TO-220	Bolt On	Rectangular, Fins	1.654" (42.00mm)	1.496" (38.00mm)	-	0.984" (25.00mm)	7.85W @ 75°C	4.30°C/W @ 200 LFM	9.56°C/W	Aluminum Alloy	Black Anodized
HSE04-251265-1 HEAT SINK, EXTRUSION, TO-218/TO- Same Sky (Formerly CUI Devices)	1,468 In Stock	1 : £0.74000 Bag	HSE	Bag	Active	Top Mount	TO-218, TO-220	Bolt On	Rectangular, Fins	0.984" (25.00mm)	0.472" (12.00mm)	-	0.256" (6.50mm)	2.4W @ 75°C	16.30°C/W @ 200 LFM	31.22°C/W	Aluminum Alloy	Black Anodized
HSE-B20380-040H HEAT SINK, EXTRUSION, TO-220, 38 Same Sky (Formerly CUI Devices)	1,119 In Stock	1 : £0.77000 Tray	HSE	Tray	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Angled Fins	1.496" (38.00mm)	1.378" (35.00mm)	-	0.492" (12.50mm)	7.4W @ 75°C	3.94°C/W @ 200 LFM	10.14°C/W	Aluminum Alloy	Black Anodized
HSB18-232310 HEAT SINK, BGA, 23 X 23 X 10 MM Same Sky (Formerly CUI Devices)	3,872 In Stock	1 : £0.78000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.906" (23.00mm)	0.906" (23.00mm)	-	0.394" (10.00mm)	3.7W @ 75°C	6.80°C/W @ 200 LFM	20.41°C/W	Aluminum Alloy	Black Anodized
HSE-B254-04H HEAT SINK, EXTRUSION, TO-220/TO- Same Sky (Formerly CUI Devices)	884 In Stock	1 : £0.80000 Box	HSE	Box	Active	Board Level, Vertical	TO-218, TO-220	Bolt On and PC Pin	Rectangular, Fins	1.000" (25.40mm)	0.650" (16.50mm)	-	0.630" (16.00mm)	4.7W @ 75°C	4.93°C/W @ 200 LFM	15.96°C/W	Aluminum Alloy	Black Anodized
HSE-B20381-035H HEAT SINK, EXTRUSION, TO-220, 38 Same Sky (Formerly CUI Devices)	202 In Stock	1 : £0.87000 Box	HSE	Box	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Angled Fins	1.500" (38.10mm)	1.375" (34.93mm)	-	0.500" (12.70mm)	6.5W @ 75°C	3.66°C/W @ 200 LFM	11.54°C/W	Aluminum Alloy	Black Anodized
HSE-B20254-040H HEAT SINK, EXTRUSION, TO-220, 25 Same Sky (Formerly CUI Devices)	1,959 In Stock	1 : £0.88000 Bag	HSE	Bag	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	1.000" (25.40mm)	1.260" (32.00mm)	-	0.551" (14.00mm)	5.7W @ 75°C	7.74°C/W @ 200 LFM	13.16°C/W	Aluminum Alloy	Black Anodized
HSE-B250-04H HEAT SINK, EXTRUSION, TO-220, 25 Same Sky (Formerly CUI Devices)	278 In Stock	1 : £0.92000 Box	HSE	Box	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	0.984" (25.00mm)	1.378" (35.00mm)	-	1.000" (25.40mm)	8.0W @ 75°C	3.26°C/W @ 200 LFM	13.60°C/W	Aluminum Alloy	Black Anodized
HSE-B20250-045H HEAT SINK, EXTRUSION, TO-220, 50 Same Sky (Formerly CUI Devices)	769 In Stock	1 : £0.93000 Box	HSE	Box	Active	Board Level, Vertical	TO-220	Bolt On and PC Pin	Rectangular, Fins	1.969" (50.00mm)	1.181" (30.00mm)	-	0.472" (12.00mm)	7.7W @ 75°C	4.05°C/W @ 200 LFM	9.74°C/W	Aluminum Alloy	Black Anodized

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Heat Sinks

Heat sinks are thermal management components designed to dissipate heat from high-power electronic devices and prevent overheating. Their core function is based on the principles of conduction, and convection, transferring heat from a heat source—such as a CPU, power transistor, or BGA package—to the surrounding air or a coolant. By increasing the surface area in contact with cooling media, heat sinks help maintain safe temperature levels and protect component reliability and performance.

Most heat sinks are made of aluminum or copper, materials known for their high thermal conductivity. Aluminum heat sinks are lightweight and cost-effective, ideal for general-purpose cooling solutions, while copper heat sinks offer better conductivity for high-performance or space-constrained applications. Finned and extrusion-style heat sinks use strategically shaped surfaces to maximize exposure to air, enhancing natural or forced convection. Cross-cut designs further improve airflow and thermal dispersion. In advanced applications, heat pipes, liquid cooling, or graphite spreaders may be used to rapidly move heat away from the source. For compact or passive systems, passive heat exchangers rely entirely on natural airflow without the use of fans.

Proper thermal contact between the heat sink and device is critical—thermal interface materials (TIMs) such as thermal paste, pads, or solder are used to fill microscopic gaps and reduce thermal resistance. When selecting a heat sink, consider the thermal output of the component, available space, airflow conditions, and the thermal resistance of the system.

Heat Sinks

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