Solder Stencils, Templates

Results: 4
Series
-Proto-Advantage BGA
Type
-BGA
Number of Positions
169324676
Pitch
0.029" (0.75mm)0.031" (0.80mm)0.039" (1.00mm)-
Outer Dimension
1.300" L x 0.900" W (33.02mm x 22.86mm)1.950" L x 1.350" W (49.53mm x 34.29mm)2.600" L x 1.800" W (66.04mm x 45.72mm)5.000" L x 4.000" W (127.00mm x 101.60mm)
Inner Dimension
0.512" L x 0.512" W (13.00mm x 13.00mm)1.024" L x 1.024" W (26.00mm x 26.00mm)-
Stocking Options
Environmental Options
Media
Marketplace Product
4Results

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of 4
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Number of Positions
Pitch
Outer Dimension
Inner Dimension
Thermal Center Pad
Material
BGA0002-S
BGA0002-S
STENCIL BGA-324 .8MM
Chip Quik Inc.
11
In Stock
1 : £16.09000
Bulk
Bulk
Active
BGA
324
0.031" (0.80mm)
1.950" L x 1.350" W (49.53mm x 34.29mm)
-
-
Stainless Steel
ST0002-S
ST0002-S
PRACTICE KIT STENCIL FOR ST0002
Chip Quik Inc.
8
In Stock
1 : £38.29000
Bulk
-
Bulk
Active
-
-
-
5.000" L x 4.000" W (127.00mm x 101.60mm)
-
-
Stainless Steel
BGA0034-S
BGA0034-S
BGA-676 (1.0 MM PITCH, 26 X 26 G
Chip Quik Inc.
0
In Stock
Check Lead Time
1 : £16.09000
Bulk
Bulk
Active
BGA
676
0.039" (1.00mm)
2.600" L x 1.800" W (66.04mm x 45.72mm)
1.024" L x 1.024" W (26.00mm x 26.00mm)
-
Stainless Steel
BGA0036-S
BGA0036-S
BGA-169 (0.75MM PITCH, 13X13 GRI
Chip Quik Inc.
2
In Stock
1 : £16.09000
Bulk
Bulk
Active
BGA
169
0.029" (0.75mm)
1.300" L x 0.900" W (33.02mm x 22.86mm)
0.512" L x 0.512" W (13.00mm x 13.00mm)
-
Stainless Steel
Showing
of 4

Solder Stencils, Templates


Solder Stencils and Templates are a mask that is used to apply solder paste in a specific area on a PCB board. The stencil types are BGA, CSP, DFN, DFN/SON, FPC/FFC, HSOP, HTQFP, HTSSOP, LED, LED/DFN, LED/PLCC, LGA, LLP, LQFP, LSOP, mini SOIC, MLP/DFN, MLP/MLF, MQFP, MSOP, PLCC, PLCC/JLCC, POS, PowerQSOP, PowerSOIC, PowerSSO, PowerSSOP, PQFP, PSOP, QFN, QFN/LFCSP, QSOP, RN, RQFP, SOIC, SON, SOP, SOT/SC, SSOP, TO/DDPAK, TO/DPAK, TQFP, TSOC, TSOP, TSSOP, TVSOP, uMAX, VSOP, and VSSOP.