Headers, Male Pins | Connectors, Interconnects | DigiKey

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	Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Connector Type	Contact Type	Pitch - Mating	Number of Positions	Number of Rows	Row Spacing - Mating	Number of Positions Loaded	Style	Shrouding	Mounting Type	Termination	Fastening Type	Contact Length - Mating	Contact Length - Post	Overall Contact Length	Insulation Height	Contact Shape	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Finish - Post	Contact Material	Insulation Material	Features	Operating Temperature	Ingress Protection	Material Flammability Rating	Insulation Color	Current Rating (Amps)	Voltage Rating
	FTS-147-01-L-DV CONN HEADER SMD 94POS 1.27MM Samtec Inc.	120 Factory Value Added Item	1 : £9.63000 Bulk	FTS	Bulk	Active	Header, Cuttable	Male Pin	0.050" (1.27mm)	94	2	0.050" (1.27mm)	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.120" (3.05mm)	-	-	0.034" (0.86mm)	Square	Gold	10.0µin (0.25µm)	Tin	Phosphor Bronze	Liquid Crystal Polymer (LCP)	-	-55°C ~ 125°C	-	UL94 V-0	Black	3.4A per Contact	-
	FTSH-147-01-L-DV CONN HEADER SMD 94POS 1.27MM Samtec Inc.	Value Added Item	1 : £7.48000 Bulk	FTSH	Bulk	Active	Header, Cuttable	Male Pin	0.050" (1.27mm)	94	2	0.050" (1.27mm)	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.120" (3.05mm)	-	-	0.099" (2.51mm)	Square	Gold	10.0µin (0.25µm)	Tin	Phosphor Bronze	Liquid Crystal Polymer (LCP)	-	-55°C ~ 125°C	-	UL94 V-0	Black	3.4A per Contact	-
	FTS-147-03-L-D CONN HEADER VERT 94POS 1.27MM Samtec Inc.	120 Factory Value Added Item	1 : £8.66000 Bulk	FTS	Bulk	Active	Header, Cuttable	Male Pin	0.050" (1.27mm)	94	2	0.050" (1.27mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.065" (1.65mm)	0.090" (2.29mm)	0.189" (4.80mm)	0.034" (0.86mm)	Square	Gold	10.0µin (0.25µm)	Tin	Phosphor Bronze	Liquid Crystal Polymer (LCP)	-	-55°C ~ 125°C	-	UL94 V-0	Black	3.4A per Contact	-
	FTS-147-01-L-D CONN HEADER VERT 94POS 1.27MM Samtec Inc.	Value Added Item	1 : £8.84000 Bulk	FTS	Bulk	Active	Header, Cuttable	Male Pin	0.050" (1.27mm)	94	2	0.050" (1.27mm)	All	Board to Board or Cable	Unshrouded	Through Hole	Solder	Push-Pull	0.120" (3.05mm)	0.090" (2.29mm)	0.244" (6.20mm)	0.034" (0.86mm)	Square	Gold	10.0µin (0.25µm)	Tin	Phosphor Bronze	Liquid Crystal Polymer (LCP)	-	-55°C ~ 125°C	-	UL94 V-0	Black	3.4A per Contact	-
	FTS-147-03-L-DV CONN HEADER SMD 94POS 1.27MM Samtec Inc.	Value Added Item	1 : £9.63000 Bulk	FTS	Bulk	Active	Header, Cuttable	Male Pin	0.050" (1.27mm)	94	2	0.050" (1.27mm)	All	Board to Board or Cable	Unshrouded	Surface Mount	Solder	Push-Pull	0.065" (1.65mm)	-	-	0.034" (0.86mm)	Square	Gold	10.0µin (0.25µm)	Tin	Phosphor Bronze	Liquid Crystal Polymer (LCP)	-	-55°C ~ 125°C	-	UL94 V-0	Black	3.4A per Contact	-
	FTSH-147-01-L-DH CONN HEADER SMD R/A 94POS 1.27MM Samtec Inc.	Value Added Item	1 : £11.21000 Bulk	FTSH	Bulk	Active	Header, Cuttable	Male Pin	0.050" (1.27mm)	94	2	0.050" (1.27mm)	All	Board to Board or Cable	Unshrouded	Surface Mount, Right Angle	Solder	Push-Pull	0.120" (3.05mm)	-	-	0.135" (3.43mm)	Square	Gold	10.0µin (0.25µm)	Tin	Phosphor Bronze	Liquid Crystal Polymer (LCP)	-	-55°C ~ 125°C	-	UL94 V-0	Black	3.4A per Contact	-
	FTSH-147-01-L-MT CONN HEADER SMD R/A 94POS 1.27MM Samtec Inc.	Value Added Item	1 : £11.43000 Bulk	FTSH	Bulk	Active	Header, Cuttable	Male Pin	0.050" (1.27mm)	94	2	0.050" (1.27mm)	All	Board to Board or Cable	Unshrouded	Surface Mount, Right Angle; Through Hole	Solder	Push-Pull	0.120" (3.05mm)	0.090" (2.29mm)	-	0.135" (3.43mm)	Square	Gold	10.0µin (0.25µm)	Tin	Phosphor Bronze	Liquid Crystal Polymer (LCP)	-	-55°C ~ 125°C	-	UL94 V-0	Black	3.4A per Contact	-

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Headers, Male Pins

This type of header contains male pins within a plastic base and is meant to be mated with a rectangular cable connector or a female socket header for board-to-board connection. These come in a variety of position and pitch options, with some having a breakaway option to manually change position count with ease. Some are shrouded with 1 to 4 walls or unshrouded. Mounting types include panel mount, board edge, stacking, surface mount, and through-hole.

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