Arrays, Edge Type, Mezzanine (Board to Board)

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Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Connector Type	Number of Positions	Pitch	Number of Rows	Mounting Type	Features	Contact Finish	Contact Finish Thickness	Mated Stacking Heights	Height Above Board
FX10-168IP-8H(03) CONN INTERPOSER 168P STACK GOLD Hirose Electric Co Ltd	2,101 In Stock 1,500 Alternate Stock	1 : £6.93000 Tray 1 : £6.46000 Tray	FunctionMax™ FX10	Tray Tray	Active	Interposer	168	0.020" (0.50mm)	2	Stacking	-	Gold	30.0µin (0.76µm)	8mm ~ 10mm	-
FX10-168IP-8PH(03) CONN INTERPOSER 168P STACK GOLD Hirose Electric Co Ltd	15 In Stock	1 : £7.57000 Tray	FunctionMax™ FX10	Tray	Active	Interposer	168	0.020" (0.50mm)	2	Stacking	-	Gold	30.0µin (0.76µm)	11mm ~ 13mm	-
FX10-168IP-52Q-8PH(03) CONN INTERPOSER 168P STACK GOLD Hirose Electric Co Ltd	0 In Stock 39 Alternate Stock	50 : £5.56860 Tray 1 : £6.50000 Tray	FunctionMax™ FX10	Tray Tray	Last Time Buy	Interposer	168	0.020" (0.50mm)	2	Stacking	-	Gold	30.0µin (0.76µm)	11mm ~ 13mm	-
FX10-168IP-52Q-8H(03) CONN INTERPOSER 168P STACK GOLD Hirose Electric Co Ltd	0 In Stock	50 : £5.56860 Tray	FunctionMax™ FX10	Tray	Last Time Buy	Interposer	168	0.020" (0.50mm)	2	Stacking	-	Gold	30.0µin (0.76µm)	8mm ~ 10mm	-
FX10-168IP-40D-8H(03) CONN INTERPOSER 168P STACK GOLD Hirose Electric Co Ltd	0 In Stock	50 : £5.61280 Tray	FunctionMax™ FX10	Tray	Last Time Buy	Interposer	168	0.020" (0.50mm)	2	Stacking	-	Gold	30.0µin (0.76µm)	8mm ~ 10mm	-
FX10-168IP-40D-8PH(03) CONN INTERPOSER 168P STACK GOLD Hirose Electric Co Ltd	0 In Stock	50 : £5.61280 Tray	FunctionMax™ FX10	Tray	Last Time Buy	Interposer	168	0.020" (0.50mm)	2	Stacking	-	Gold	30.0µin (0.76µm)	11mm ~ 13mm	-

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Connectors of this type have contacts arranged in linear rows and an outline which is generally rectangular, rather than circular. They are used for creating pluggable connections directly between printed circuit boards without use of wire or cable, and can provide a large number of electrical connections in a relatively small space. For this reason they are commonly used to connect components of space-constrained systems.