System On Chip (SoC)

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Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Architecture	Core Processor	Flash Size	RAM Size	Peripherals	Connectivity	Speed	Primary Attributes	Operating Temperature	Package / Case	Supplier Device Package
XCZU2EG-L1SBVA484I IC SOC CORTEX-A53 484FCBGA AMD	6 In Stock	1 : £354.04000 Tray	Zynq® UltraScale+™ MPSoC EG	Tray	Active	MCU, FPGA	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	-	256KB	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	500MHz, 600MHz, 1.2GHz	Zynq®UltraScale+™ FPGA, 103K+ Logic Cells	-40°C ~ 100°C (TJ)	484-BFBGA, FCBGA	484-FCBGA (19x19)
XC7Z020-2CLG484E IC SOC CORTEX-A9 766MHZ 484BGA AMD	0 In Stock Check Lead Time	1 : £144.17000 Tray	Zynq®-7000	Tray	Active	MCU, FPGA	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	-	256KB	DMA	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	766MHz	Artix™-7 FPGA, 85K Logic Cells	0°C ~ 100°C (TJ)	484-LFBGA, CSPBGA	484-CSPBGA (19x19)
XCZU2CG-L1SBVA484I IC SOC CORTEX-A53 484FCBGA AMD	0 In Stock Check Lead Time	1 : £295.20000 Tray	Zynq® UltraScale+™ MPSoC CG	Tray	Active	MCU, FPGA	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	-	256KB	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	500MHz, 1.2GHz	Zynq®UltraScale+™ FPGA, 103K+ Logic Cells	-40°C ~ 100°C (TJ)	484-BFBGA, FCBGA	484-FCBGA (19x19)
XCZU2CG-L1SFVA625I IC SOC CORTEX-A53 625FCBGA AMD	0 In Stock Check Lead Time	1 : £309.91000 Tray	Zynq® UltraScale+™ MPSoC CG	Tray	Active	MCU, FPGA	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	-	256KB	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	500MHz, 1.2GHz	Zynq®UltraScale+™ FPGA, 103K+ Logic Cells	-40°C ~ 100°C (TJ)	625-BFBGA, FCBGA	625-FCBGA (21x21)
XAZU2EG-L1SFVC784I IC SOC CORTEX-A53 784FCBGA AMD	0 In Stock Check Lead Time	1 : £390.33000 Tray	Zynq® UltraScale+™ MPSoC EG	Tray	Active	MPU, FPGA	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2	-	1.2MB	DMA, WDT	CANbus, I2C, SPI, UART/USART, USB	500MHz, 1.2GHz	Zynq®UltraScale+™ FPGA, 154K+ Logic Cells	-40°C ~ 100°C (TJ)	784-BFBGA, FCBGA	784-FCBGA (23x23)
XCZU9CG-2FFVC900I IC SOC CORTEX-A53 900FCBGA AMD	0 In Stock Check Lead Time	1 : £3,519.28000 Tray	Zynq® UltraScale+™ MPSoC CG	Tray	Active	MCU, FPGA	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	-	256KB	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	533MHz, 1.3GHz	Zynq®UltraScale+™ FPGA, 599K+ Logic Cells	-40°C ~ 100°C (TJ)	900-BBGA, FCBGA	900-FCBGA (31x31)
XCZU9CG-2FFVB1156I IC SOC CORTEX-A53 1156FCBGA AMD	0 In Stock Check Lead Time	1 : £3,977.57000 Tray	Zynq® UltraScale+™ MPSoC CG	Tray	Active	MCU, FPGA	Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™	-	256KB	DMA, WDT	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	533MHz, 1.3GHz	Zynq®UltraScale+™ FPGA, 599K+ Logic Cells	-40°C ~ 100°C (TJ)	1156-BBGA, FCBGA	1156-FCBGA (35x35)

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Devices in the System-on-Chip family combine on one device substrate several computing system components which traditionally would be implemented as separate devices, such as a general-purpose microprocessor, an FPGA co-processor, and a graphics controller for generation of display data. While limited amounts of data storage resources may also be incorporated, the provision of an interface to external storage devices is typical.