Adapter, Breakout Boards

Showing

of 1,099

Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Proto Board Type	Package Accepted	Number of Positions	Pitch	Board Thickness	Material	Size / Dimension
PA0003 SOIC-14 TO DIP-14 SMT ADAPTER Chip Quik Inc.	439 In Stock	1 : £2.69000 Bulk	Proto-Advantage	Bulk	Active	SMD to DIP	SOIC	14	0.050" (1.27mm)	0.062" (1.57mm) 1/16"	FR4 Epoxy Glass	0.700" x 0.700" (17.78mm x 17.78mm)
PA0006 SOIC-16 TO DIP-16 SMT ADAPTER Chip Quik Inc.	481 In Stock	1 : £3.15000 Bulk	Proto-Advantage	Bulk	Active	SMD to DIP	SOIC	16	0.050" (1.27mm)	0.062" (1.57mm) 1/16"	FR4 Epoxy Glass	0.700" x 0.800" (17.78mm x 20.32mm)
PA0009 SOIC-24 TO DIP-24 SMT ADAPTER Chip Quik Inc.	373 In Stock	1 : £4.08000 Bulk	Proto-Advantage	Bulk	Active	SMD to DIP	SOIC	24	0.050" (1.27mm)	0.062" (1.57mm) 1/16"	FR4 Epoxy Glass	0.700" x 1.200" (17.78mm x 30.48mm)
PA0001C SOIC-8 TO DIP-8 SMT ADAPTER (1.2 Chip Quik Inc.	1,299 In Stock	1 : £5.00000 Bulk	Proto-Advantage	Bulk	Active	SMD to DIP	SOIC	8	0.050" (1.27mm)	0.063" (1.60mm)	FR4 Epoxy Glass	0.400" L x 0.400" W (10.16mm x 10.16mm)
PA0003C SOIC-14 TO DIP-14 SMT ADAPTER (1 Chip Quik Inc.	304 In Stock	1 : £5.00000 Bulk	Proto-Advantage	Bulk	Active	SMD to DIP	SOIC	14	0.050" (1.27mm)	0.063" (1.60mm)	FR4 Epoxy Glass	0.700" L x 0.400" W (17.78mm x 10.16mm)
DR127D254P20M DUAL ROW 1.27MM PITCH 20-PIN MAL Chip Quik Inc.	119 In Stock	1 : £7.70000 Bulk	Proto-Advantage	Bulk	Active	Connector to DIP	1.27mm Header	20	0.050" (1.27mm)	0.062" (1.57mm) 1/16"	FR4 Epoxy Glass	0.700" x 1.000" (17.78mm x 25.40mm)
F127T254P05 PITCH CHANGER 1.27 MM TO 2.54 MM Chip Quik Inc.	103 In Stock	1 : £0.99000 Bulk	Proto-Advantage	Bulk	Active	Plated Through Hole to Plated Through Hole	-	5	0.050" (1.27mm)	0.063" (1.60mm)	FR4 Epoxy Glass	-
F127T254P06 PITCH CHANGER 1.27 MM TO 2.54 MM Chip Quik Inc.	134 In Stock	1 : £1.15000 Bulk	Proto-Advantage	Bulk	Active	Plated Through Hole to Plated Through Hole	-	6	0.050" (1.27mm)	0.063" (1.60mm)	FR4 Epoxy Glass	-
PCB3005A1 SOIC-8 TO DIP-8 SMT ADAPTER (1.2 Chip Quik Inc.	436 In Stock	1 : £1.61000 Bulk	Proto-Advantage	Bulk	Active	SMD to DIP	SOIC	8	0.050" (1.27mm)	0.062" (1.57mm) 1/16"	FR4 Epoxy Glass	0.400" x 0.400" (10.16mm x 10.16mm)
PCB3007-1 SOT23 TO DIP SMT ADAPTER Chip Quik Inc.	325 In Stock	1 : £1.61000 Bulk	Proto-Advantage	Bulk	Active	SMD to DIP	SOT-23	6	0.037" (0.95mm)	0.062" (1.57mm) 1/16"	FR4 Epoxy Glass	0.400" x 0.300" (10.16mm x 7.62mm)
PA0087 SC70-6/SOT-363 TO DIP-6 SMT ADAP Chip Quik Inc.	561 In Stock	1 : £2.07000 Bulk	Proto-Advantage	Bulk	Active	SMD to DIP	SC-70, SC-88, SOT-363	6	0.026" (0.65mm)	0.062" (1.57mm) 1/16"	FR4 Epoxy Glass	0.700" x 0.300" (17.78mm x 7.62mm)
PA0086 SOT23-5/SC59-5/SC-74A TO DIP-6 Chip Quik Inc.	277 In Stock	1 : £2.07000 Bulk	Proto-Advantage	Bulk	Active	SMD to DIP	SOT-23, SC-59, SC-74A	5	0.037" (0.95mm)	0.062" (1.57mm) 1/16"	FR4 Epoxy Glass	0.700" x 0.300" (17.78mm x 7.62mm)
PA0085 SOT23-6/SC59-6 TO DIP-6 SMT ADAP Chip Quik Inc.	254 In Stock	1 : £2.07000 Bulk	Proto-Advantage	Bulk	Active	SMD to DIP	SOT-23, SC-59	6	0.037" (0.95mm)	0.062" (1.57mm) 1/16"	FR4 Epoxy Glass	0.700" x 0.300" (17.78mm x 7.62mm)
PA0088 SC70-5/SOT-353 TO DIP-6 SMT ADAP Chip Quik Inc.	134 In Stock	1 : £2.07000 Bulk	Proto-Advantage	Bulk	Active	SMD to DIP	SC-70, SOT-353	5	0.026" (0.65mm)	0.062" (1.57mm) 1/16"	FR4 Epoxy Glass	0.700" x 0.300" (17.78mm x 7.62mm)
PA0032 TSSOP-8 TO DIP-8 SMT ADAPTER Chip Quik Inc.	1,181 In Stock	1 : £2.46000 Bulk	Proto-Advantage	Bulk	Active	SMD to DIP	TSSOP	8	0.026" (0.65mm)	0.062" (1.57mm) 1/16"	FR4 Epoxy Glass	0.700" x 0.400" (17.78mm x 10.16mm)
PCB3001-1 SOIC28W/N AND SOP28 TO DIP SMT A Chip Quik Inc.	248 In Stock	1 : £2.46000 Bulk	Proto-Advantage	Bulk	Active	SMD to DIP	SOIC, SOP	28	0.050" (1.27mm)	0.062" (1.57mm) 1/16"	FR4 Epoxy Glass	0.800" x 1.400" (20.32mm x 35.56mm)
PA0042 VSSOP-8 TO DIP-8 SMT ADAPTER Chip Quik Inc.	197 In Stock	1 : £2.46000 Bulk	Proto-Advantage	Bulk	Active	SMD to DIP	VSSOP	8	0.020" (0.50mm)	0.062" (1.57mm) 1/16"	FR4 Epoxy Glass	0.700" x 0.400" (17.78mm x 10.16mm)
PCB3008-1 TSSOP-14 TO DIP-14 SMT ADAPTER Chip Quik Inc.	144 In Stock	1 : £2.46000 Bulk	Proto-Advantage	Bulk	Active	SMD to DIP	TSSOP	14	0.026" (0.65mm)	0.062" (1.57mm) 1/16"	FR4 Epoxy Glass	0.400" x 0.700" (10.16mm x 17.78mm)
PA0001 SOIC-8 TO DIP-8 SMT ADAPTER Chip Quik Inc.	470 In Stock	1 : £2.69000 Bulk	Proto-Advantage	Bulk	Active	SMD to DIP	SOIC	8	0.050" (1.27mm)	0.062" (1.57mm) 1/16"	FR4 Epoxy Glass	0.700" x 0.400" (17.78mm x 10.16mm)
FPC050P010 FPC/FFC SMT CONN .5MM PITCH 10PI Chip Quik Inc.	221 In Stock	1 : £2.84000 Bulk	Proto-Advantage	Bulk	Active	SMD to DIP	FPC Connector	10	0.020" (0.50mm)	0.062" (1.57mm) 1/16"	FR4 Epoxy Glass	0.900" x 0.550" (22.86mm x 13.97mm)
FPC100P010 FPC/FFC SMT CONNECTOR 1 MM PITCH Chip Quik Inc.	141 In Stock	1 : £2.84000 Bulk	Proto-Advantage	Bulk	Active	SMD to DIP	FPC Connector	10	0.039" (1.00mm)	0.062" (1.57mm) 1/16"	FR4 Epoxy Glass	0.900" x 0.850" (22.86mm x 21.59mm)
PA0033 TSSOP-14 TO DIP-14 SMT ADAPTER Chip Quik Inc.	133 In Stock	1 : £2.84000 Bulk	Proto-Advantage	Bulk	Active	SMD to DIP	TSSOP	14	0.026" (0.65mm)	0.062" (1.57mm) 1/16"	FR4 Epoxy Glass	0.700" x 0.700" (17.78mm x 17.78mm)
PA0017 SSOP-16 TO DIP-16 SMT ADAPTER Chip Quik Inc.	101 In Stock	1 : £3.15000 Bulk	Proto-Advantage	Bulk	Active	SMD to DIP	SSOP	16	0.026" (0.65mm)	0.062" (1.57mm) 1/16"	FR4 Epoxy Glass	0.700" x 0.800" (17.78mm x 20.32mm)
PA0034 TSSOP-16 TO DIP-16 SMT ADAPTER Chip Quik Inc.	111 In Stock	1 : £3.23000 Bulk	Proto-Advantage	Bulk	Active	SMD to DIP	TSSOP	16	0.026" (0.65mm)	0.062" (1.57mm) 1/16"	FR4 Epoxy Glass	0.700" x 0.800" (17.78mm x 20.32mm)
PA0008 SOIC-20 TO DIP-20 SMT ADAPTER Chip Quik Inc.	361 In Stock	1 : £3.62000 Bulk	Proto-Advantage	Bulk	Active	SMD to DIP	SOIC	20	0.050" (1.27mm)	0.062" (1.57mm) 1/16"	FR4 Epoxy Glass	0.700" x 1.000" (17.78mm x 25.40mm)

Showing

of 1,099

Products in this family provide increased convenience of access to the electrical contacts of a connector, integrated circuit, or similar device by providing interconnection between a component placement area (typically for a fine-pitch, surface mounted integrated circuit) and an interconnect area typically having a much larger distance between pin centers. A common application is accommodating the use of solderless breadboards as a prototyping method for components that are not available in breadboard-compatible packaging.