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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Proto Board Type
Package Accepted
Number of Positions
Pitch
Board Thickness
Material
Size / Dimension
319010042
319010042
QFP SURFACE MOUNT PROTOBOARD 0.8
Seeed Technology Co., Ltd
0
In Stock
Obsolete
-
Bulk
ObsoleteSMD to Plated Through Hole BoardSOIC, SSOP, 0805, DO-323, SOT23, XTAL, QFP6, 80.020" (0.50mm)--3.937" L x 3.150" W (100.00mm x 80.00mm)
319010352
319010352
XQFP BREAKOUT BOARD 0.5MM
Seeed Technology Co., Ltd
0
In Stock
Obsolete
-
Bulk
ObsoleteSMD to Plated Through Hole BoardQFP800.020" (0.50mm)--1.575" L x 1.575" W (40.00mm x 40.00mm)
319010045
319010045
XQFP BREAKOUT BOARD 0.65MM
Seeed Technology Co., Ltd
0
In Stock
Obsolete
-
Bulk
ObsoleteSMD to Plated Through Hole BoardQFP800.026" (0.65mm)--1.575" L x 1.575" W (40.00mm x 40.00mm)
319010351
319010351
XQFP BREAKOUT BOARD 0.8MM
Seeed Technology Co., Ltd
0
In Stock
Obsolete
-
Bulk
ObsoleteSMD to Plated Through Hole BoardQFP800.031" (0.80mm)--1.575" L x 1.575" W (40.00mm x 40.00mm)
319010047 Side 1
319010047
QFP SURFACE MOUNT PROTOBOARD 0.5
Seeed Technology Co., Ltd
0
In Stock
Obsolete
-
Bulk
ObsoleteSMD to Plated Through Hole BoardSOIC, SSOP, 0805, DO-323, SOT23, XTAL, QFP6, 80.020" (0.50mm)--3.937" L x 3.150" W (100.00mm x 80.00mm)
319010053 Side 1
319010053
QFP SURFACE MOUNT PROTOBOARD 0.6
Seeed Technology Co., Ltd
0
In Stock
Obsolete
-
Bulk
ObsoleteSMD to Plated Through Hole BoardSOIC, SSOP, 0805, DO-323, SOT23, XTAL, QFP6, 80.026" (0.65mm)--3.937" L x 3.150" W (100.00mm x 80.00mm)
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Adapter, Breakout Boards


Products in this family provide increased convenience of access to the electrical contacts of a connector, integrated circuit, or similar device by providing interconnection between a component placement area (typically for a fine-pitch, surface mounted integrated circuit) and an interconnect area typically having a much larger distance between pin centers. A common application is accommodating the use of solderless breadboards as a prototyping method for components that are not available in breadboard-compatible packaging.