CPC1006N Datasheet by Littelfuse Inc.

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DS-CPC1006N-R05 1
CPC1006N
60V Normally-Open Single-Pole
4-Pin SOP OptoMOS® Relay
Part # Description
CPC1006N 4-Pin SOP (100/tube)
CPC1006NTR 4-Pin SOP (2000/reel)
Parameter Rating Units
Blocking Voltage 60 VP
Load Current 75 mArms / mADC
On-Resistance (max) 10
LED Current to operate 0.5 mA
Applications
Features
Description
Ordering Information
Pin Configuration
Security
Passive Infrared Detectors (PIR)
Data Signalling
Sensor Circuitry
Instrumentation
Multiplexers
Data Acquisition
Electronic Switching
I/O Subsystems
Meters (Watt-Hour, Water, Gas)
Medical Equipment—Patient/Equipment Isolation
Aerospace
Industrial Controls
Designed for EN50130-4 Compliant
Security Systems
1500Vrms Input/Output Isolation
Only 0.5mA of LED Current Required to Operate
Small 4-Pin SOP Package
High Reliability
Arc-Free With No Snubbing Circuits
No EMI/RFI Generation
Immune to Radiated EM Fields
Tape & Reel Version Available
Flammability Rating UL 94 V-0
The CPC1006N is a miniature single-pole,
normally-open (1-Form-A) solid state relay in a
4-pin SOP package that employs optically coupled
MOSFET technology to provide 1500Vrms of input to
output isolation.
The relay outputs are constructed with efficient
MOSFET switches and photovoltaic die that
use IXYS Integrated Circuits Division's patented
OptoMOS architecture while the input, a highly
efficient infrared LED, provides the optically coupled
control.
Using IXYS Integrated Circuits Division’s state of the
art double-molded vertical construction packaging
to produce one of the world’s smallest relays, the
CPC1006N offers board space savings of at least
20% over the competitor’s larger 4-pin SOP relay.
Switching Characteristics
of Normally-Open Devices
Form-A
IF
ILOAD
10%
90%
ton toff
Approvals
1
23
4
+ Control
– Control
Load
Load
UL Recognized Component: File E76270
CSA Certified Component: Certificate 1172007
EN/IEC 60950-1 Certified Component:
TUV Certificate B 13 12 82667 003
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Absolute Maximum Ratings @ 25ºC
Parameter Ratings Units
Blocking Voltage 60 VP
Reverse Input Voltage 5 V
Input Control Current
Peak (10ms)
50 mA
1A
Input Power Dissipation 170 mW
Total Power Dissipation 2400 mW
Isolation Voltage Input to Output 1500 Vrms
ESD Rating, Human Body Model 4 kV
Operational Temperature -40 to +85 ºC
Storage Temperature -40 to +125 ºC
1 Derate linearly 1.33 mW / ºC
2 Derate linearly 3.33 mW / ºC
Parameter Conditions Symbol Min Typ Max Units
Output Characteristics
Load Current
Continuous IF=0.5mA IL- - 75 mArms / mADC
Peak t=10ms ILPK - - ±350 mAP
On-Resistance 1IF=0.5mA, IL=75mA RON -710
Off-State Leakage Current IF=0mA, VL=60VPILEAK --1A
Switching Speeds
Turn-On IF=2mA, VL=10V ton - - 10 ms
Turn-Off toff - - 10 ms
Output Capacitance IF=0mA, VL=50V, f=1MHz COUT -5 - pF
Input Characteristics
Input Control Current to Activate 2IL=75mA IF- 0.1 0.5 mA
Input Control Current to Deactivate - IF0.05 - - mA
Input Voltage Drop IF=5mA VF0.9 1.2 1.5 V
Reverse Input Current VR=5V IR--10A
Common Characteristics
Capacitance, Input to Output VIO=0V, f=1MHz CIO -1 - pF
1 Measurement taken within 1 second of on-time.
2 For applications requiring high temperature operation (greater than 60ºC) a minimum LED drive current of 2mA is recommended.
Electrical Characteristics @ 25ºC
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to the
device. Functional operation of the device at conditions beyond
those indicated in the operational sections of this data sheet is
not implied.
Typical values are characteristic of the device at +25°C, and
are the result of engineering evaluations. They are provided for
information purposes only, and are not part of the manufacturing
testing requirements.
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On-Resistance (:)
6.7 6.8 6.9 7.0 7.1 7.2 7.3
Device Count (N)
0
5
10
15
20
25
Typical On-Resistance Distribution
(N=50, IF=0.5mA, IL=75mA)
LED Forward Current (mA)
0.07 0.08 0.09 0.10 0.11 0.12
Device Count (N)
0
5
10
15
20
25
Typical IF for Switch Operation
(N=50, IL=75mA)
Blocking Voltage (VP)
83 84 85 86 87 88 89 90 91
Device Count (N)
0
5
10
15
20
25
Typical Blocking Voltage Distribution
(N=50, IF=0mA)
Turn-On Time (ms)
0.099 0.108 0.117 0.126 0.135 0.144 0.153
Device Count (N)
0
5
10
15
20
25
Typical Turn-On Time
(N=50, IF=2mA, IL=75mA)
Turn-Off Time (ms)
0.400 0.415 0.430 0.445 0.460 0.475 0.490
Device Count (N)
0
5
10
15
20
25
Typical Turn-Off Time
(N=50, IF=2mA, IL=75mA)
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
LED Forward Voltage (V)
1.235 1.240 1.245 1.250 1.255 1.260 1.265
Device Count (N)
0
5
10
15
20
25
30
Temperature (ºC)
-40 -20 0 20 40 60 80 100
IF (mA)
0.06
0.08
0.10
0.12
0.14
0.16
0.18
Typical IF for Switch Operation
vs. Temperature
(IL=50mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Turn-On Time (Ps)
0
100
200
300
400
500
600
Typical Turn-On Time
vs. Temperature
(IL=50mA)
IF=1mA
IF=2mA
IF=5mA
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Turn-Off Time (Ps)
200
300
400
500
600
700
Typical Turn-Off Time
vs. Temperature
(IL=50mA)
IF=5mA
IF=2mA
IF=1mA
Temperature (ºC)
-40 -20 0 20 40 60 80 100
LED Forward Voltage (V)
1.0
1.1
1.2
1.3
1.4
1.5
1.6
Typical LED Forward Voltage Drop
vs. Temperature
IF=5mA
IF=2mA
IF=1mA
IF=50mA
IF=20mA
IF=10mA
LED Forward Current (mA)
0 1020304050
Turn-On Time (Ps)
0
50
100
150
200
250
300
Typical Turn-On Time
vs. LED Forward Current
(IL=50mA)
LED Forward Current (mA)
0 1020304050
Turn-Off Time (Ps)
443
444
445
446
447
448
449
Typical Turn-Off Time
vs. LED Forward Current
(IL=50mA)
PERFORMANCE DATA*
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifications, please contact our application department.
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Temperature (ºC)
-40 -20 0 20 40 60 80 100
On-Resistance (:)
5
6
7
8
9
10
11
12
Typical On-Resistance
vs. Temperature
(IF=1mA, IL=50mA)
Load Voltage (V)
-0.6 -0.4 -0.2 0.0 0.2 0.4 0.6
Load Current (mA)
-100
-50
0
50
100
Typical Load Current
vs. Load Voltage
(IF=0.5mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Load Current (mA)
45
50
55
60
65
70
75
80
Maximum Load Current
vs. Temperature
(IF=1mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Blocking Voltage (VP)
84
86
88
90
92
94
Typical Blocking Voltage
vs. Temperature
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Leakage Current (nA)
0
2
4
6
8
10
Typical Leakage vs. Temperature
Measured Across Pins 3&4
(VL=60V)
Load Voltage (V)
0 102030405060
Output Capacitance (pF)
4
6
8
10
12
14
Output Capacitance vs. Load Voltage
(IF=0mA, f=1MHz)
Time
10Ps 100Ps 1ms 10ms 100ms 1s 10s 100s
Load Current (mA)
0
100
200
300
400
500
600
700
800
Energy Rating Curve
(IF=0.5mA)
PERFORMANCE DATA*
*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC.
For guaranteed parameters not indicated in the written specifications, please contact our application department.
IIIIXYS @ufims.
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Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest
version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We
test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our
devices when handled according to the limitations and information in that standard as well as to any limitations set
forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled
according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Classifi cation
CPC1006N MSL 3
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Soldering Profile
Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the
body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum
Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other
processes, the guidelines of J-STD-020 must be observed.
Device Classifi cation Temperature (Tc) Dwell Time (tp) Max Refl ow Cycles
CPC1006N 260ºC 30 seconds 3
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce
or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken
to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash
and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the
washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake
temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the
user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not
be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.
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IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-CPC1006N-R05
©Copyright 2018, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
1/30/2018
For additional information please visit our website at: www.ixysic.com
6
CPC1006N
MECHANICAL DIMENSIONS
Dimensions
mm
(inches)
NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted
Embossment
Embossed
Carrier
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
U
ser Direction of Fee
d
User Direction of Feed
K0=2.70
(0.106)
K1=2.30
(0.091)
B0=4.70
(0.185)
W=12.00
(0.472)
P1=8.00
(0.315)
A0=6.50
(0.256)
CPC1006N
CPC1006NTR Tape & Reel
Recommended PCB Land Pattern
2.54
(0.10)
5.50
(0.217)
1.45
(0.057)
0.55
(0.022)
Dimensions
mm
(inches)
Pin 1
4.089 ± 0.025
(0.161 ± 0.001)
2.54 Typ
(0.100 Typ)
6.096 ± 0.102
(0.240 ± 0.004)
3.810 ± 0.025
(0.150 ± 0.001) 0.559 ± 0.127
(0.022 ± 0.005)
0.910 ± 0.025
(0.036 ± 0.001)
2.030± 0.025
(0.080± 0.001)
0.381 TYP.
(0.015 TYP.)
Package standoff:
0.064 ± 0.040
(0.0025 ± 0.0015)
0-0.1
(0-0.004)
0.481
(0.019)
0.203 Typ
(0.008 Typ)