MLPF-WB55-01E3 Datasheet by STMicroelectronics

View All Related Products | Download PDF Datasheet
Kylmm Bumpless CSP U D D L] D L1
Top view (pads down)
OUT GND3
GND4 GND2
IN GND1
Features
Integrated impedance matching to STM32WB55Cx/Rx, STM32WB50Cx,
STM32WB35Cx and STM32WB30Cx
LGA footprint compatible
50 Ω nominal impedance on antenna side
Deep rejection harmonics filter
Low insertion loss
Small footprint
Low thickness ≤ 450 μm
High RF performance
RF BOM and area reduction
ECOPACK2 compliant
Applications
Bluetooth 5
• OpenThread
• Zigbee®
IEEE 802.15.4
Optimized for STM32WB55Cx/Rx, STM32WB50Cx, STM32WB35Cx and
STM32WB30Cx
Description
The MLPF-WB55-01E3 integrates an impedance matching network and harmonics
filter. The matching impedance network has been tailored to maximize the RF
performance of STM32WB. This device uses STMicroelectronics IPD technology on
non-conductive glass substrate which optimizes RF performance.
Product status link
MLPF-WB55-01E3
2.4 GHz low pass filter matched to STM32WB55Cx/Rx, STM32WB50Cx,
STM32WB35Cx and STM32WB30Cx
MLPF-WB55-01E3
Datasheet
DS12804 - Rev 2 - September 2020
For further information contact your local STMicroelectronics sales office.
www.st.com
1Characteristics
Table 1. Absolute ratings (Tamb = 25 °C)
Symbol Parameter Value Unit
PIN Input power RFIN 10 dBm
VESD
ESD ratings human body model (JESD22-A114-C), all I/O one at a
time while others connected to GND 2000
V
ESD ratings machine model, all I/O 200
TOP Maximum operating temperature -40 to +105 °C
Table 2. Impedances(Tamb = 25 °C)
Symbol Parameter
Value
Unit
Min. Typ. Max.
ZIN STM32WB55xx single-ended
impedance -
matched to
STM32WB55Cx/Rx,
STM32WB50Cx,
STM32WB35Cx,
and
STM32WB30Cx
-
ZOUT Antenna impedance - 50 -
Table 3. Electrical characteristics and RF performance (Tamb = 25 °C)
Symbol Parameter
Value
Unit
Min. Typ. Max.
f Frequency range 2400 2500 MHz
IL Insertion loss lS21l0.90 1.1 dB
RLIN Input return loss IS11I14 22 dB
RLOUT Output return loss lS22l16 24 dB
Att
Harmonic
rejection levels
IS21I
Attenuation at 2fo 38 40 dB
Attenuation at 3fo 43 45 dB
Attenuation at 4fo 41 46 dB
Attenuation at 5fo 35 42 dB
MLPF-WB55-01E3
Characteristics
DS12804 - Rev 2 page 2/13
a 521613) N 521015) aa— .097\ 4.0, ’ f(GHz) HGHII ‘0 I I I I I I 'H ' ‘ ' ‘ o 2 ‘ s a ‘0 12 a 240 m 2M m 243 250 4D swan) ' 4» 522MB) ,5, .15- .20- .25- I 40, so, f(GHz) HGHI) ~35 I I I I I I I I 2‘0 242 2“ 2.46 2‘8 250 2‘“ 2‘2 2M 2“ 2‘8 739 21 (dfil 521 (dB) «1— 40A ‘27 427 .u— 46 w— .45— , HGHZ) new) '5“ I I I I I I I I I I '5“ I I I I I 48 4.9 an 51 52 5.: 5,: 55 55 57 55 59 120 725 mu 735 m 145 750
1.1 RF measurement
Figure 1. Transmission (dB) Figure 2. Insertion loss (dB)
Figure 3. Input return loss (dB) Figure 4. Output return loss (dB)
Figure 5. Attenuation 2f0 (dB) Figure 6. Attenuation 3f0 (dB)
MLPF-WB55-01E3
RF measurement
DS12804 - Rev 2 page 3/13
£17 $21 (dBI 321 (dB) .m— .52- f (GHZ) I (6H1) I 990 935 mm I I I I I I I 12m «2.05 me 1215 an I225 «230 1235 1on 1245 1250
Figure 7. Attenuation 4f0 (dB) Figure 8. Attenuation 5f0 (dB)
MLPF-WB55-01E3
RF measurement
DS12804 - Rev 2 page 4/13
‘ E LJ E7 E] EF='—='—=j i J m T l [1 IE
2Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.
2.1 Bumpless CSP package information
Figure 9. Bumpless CSP package outline
SIDE VIEW
Coating 25µm
T
BOTTOM VIEW (pads up)
OUTGND3
GND4GND2
INGND1
X
Y
BB
A1A1
B1
B1
a
a
A
Table 4. Bumpless CSP package mechanical data
Parameter Description Min. Typ. Max. Unit
X X dimension of the die 975 1000 1025 µm
Y Y dimension of the die 1575 1600 1625 µm
A X pitch 500 µm
B Y pitch 587 µm
A1 Distance from bump to edge of die on X axis 250 µm
B1 Distance from pad to edge of die on Y axis 213 µm
a Pad dimension 200 µm
T Substrate thickness 375 400 425 µm
MLPF-WB55-01E3
Package information
DS12804 - Rev 2 page 5/13
III E51 IE! § |:| ECOPACK grade rm... ffi xx marking {.1 LJ Z : manufactunng location yww ' dalecode
Figure 10. Marking Figure 11. Top view
Top view (pads down)
OUT GND3
GND4 GND2
IN GND1
More packing information is available in the application note:
AN2348 Flip-Chip: “Package description and recommendations for use
Figure 12. Tape and reel outline
Ø D0 P0
User direction of unreeling
Note: Pocket dimensions are not on scale
Pocket shape may vary depending on package
Ø D1
F
P2P1
K0
W
Pin 1 located according to EIA-481
A0
B0
0.03 RAISED CROSS-BAR
MLPF-WB55-01E3
Bumpless CSP package information
DS12804 - Rev 2 page 6/13
Table 5. Tape and reel mechanical data
Ref
Dimensions
Millimeters
Min Typ Max
A0 1.04 1.09 1.14
B0 1.64 1.69 1.74
K0 0.47 0.52 0.57
P1 3.9 4.0 4.1
P0 3.9 4.0 4.1
Ø D0 1.4 1.5 1.6
Ø D1 0.35 0.40 0.45
F 3.45 3.50 3.55
P2 1.95 2.00 2.05
W 7.9 8.0 8.3
Table 6. Pad description top view (pads down)
Pad ref Pad name Description
A1 OUT Antenna
A2 GND4 Ground
A3 IN STM32WB55 RF out
B1 GND3 Ground
B2 GND2 Ground
B3 GND1 Ground
MLPF-WB55-01E3
Bumpless CSP package information
DS12804 - Rev 2 page 7/13
3Recommendation on PCB assembly
3.1 Land pattern
Figure 13. PCB land pattern recommendations
IN
OUT GND3
GND2
GND1
GND4
300µm
300µm
150µm
150µm
150µm
150µm
200µm
200µm
500µm
587µm
587µm
450µm
106.4µm106.4µm
200µm
104µm 104µm
1500µm
Top_Layer
Top_Solder _Mask
Figure 14. PCB stack-up recommendations
Copper
48µm
Solder resist
Core, FR4
1507µm
Copper
48µm
MLPF-WB55-01E3
Recommendation on PCB assembly
DS12804 - Rev 2 page 8/13
3.2 Stencil opening design
Figure 15. Stencil opening recommendations
200µm
200µm
500µm
587µm
587µm
(Stencil opening aligned
with footprint dimensions)
Top_Layer
Stencil_Opening
3.3 Solder paste
1. 100 µm solder stencil thickness is recommended
2. Halide-free flux qualification ROL0 according to ANSI/J-STD-004.
3. “No clean” solder paste is recommended.
4. Offers a high tack force to resist component movement during PCB movement.
5. Solder paste with fine particles: powder particle size is 20-45 μm.
3.4 Placement
1. Manual positioning is not recommended.
2. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering
3. Standard tolerance of ±0.05 mm is recommended.
4. 1.0 N placement force is recommended. Too much placement force can lead to squeezed out solder paste
and cause solder joints to short. Too low placement force can lead to insufficient contact between package
and solder paste that could cause open solder joints or badly centered packages.
5. To improve the package placement accuracy, a bottom side optical control should be performed with a high
resolution tool.
6. For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is recommended during solder
paste printing, pick and place and reflow soldering by using optimized tools.
MLPF-WB55-01E3
Stencil opening design
DS12804 - Rev 2 page 9/13
3.5 PCB design preference
1. To control the solder paste amount, the closed via is recommended instead of open vias.
2. The position of tracks and open vias in the solder area should be well balanced. A symmetrical layout is
recommended, to avoid any tilt phenomena caused by asymmetrical solder paste due to solder flow away.
MLPF-WB55-01E3
PCB design preference
DS12804 - Rev 2 page 10/13
Matched low Qass filter lm edance matched to STM32W855 O1 : version
4Ordering information
Figure 16. Ordering information scheme
MLPF- WB55 - 01 E3
Matched low pass filter
Impedance matched to STM32WB55
01: version
E3: coated CSP on glass
Table 7. Ordering information
Order code Marking Package Weight Base qty. Delivery mode
MLPF-WB55-01E3 TS Bumpless CSP 1.546 mg 5000 Tape and reel (7")
MLPF-WB55-01E3
Ordering information
DS12804 - Rev 2 page 11/13
Revision history
Table 8. Document revision history
Date Version Changes
12-Dec-2018 1 Initial release.
10-Sep-2020 2 Inserted STM32WB50Cx, STM32WB35Cx and STM32WB30Cx product.
MLPF-WB55-01E3
DS12804 - Rev 2 page 12/13
IMPORTANT NOTICE – PLEASE READ CAREFULLY
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST
products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST
products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of
Purchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service
names are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2020 STMicroelectronics – All rights reserved
MLPF-WB55-01E3
DS12804 - Rev 2 page 13/13

Products related to this Datasheet

RF FILTER LOW PASS 2.45GHZ 6SMD
Available Quantity: 0
Unit Price: 0.12487
RF FILTER LOW PASS 2.45GHZ 6SMD
Available Quantity: 0
Unit Price: 0.26
RF FILTER LOW PASS 2.45GHZ 6SMD
Available Quantity: 0
Unit Price: 0.26