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© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1091_C0G_ESD • 3/7/2018 1
One world. One KEMET
Benefits
• AEC-Q200automotivequalified
• ESDqualifiedperHBM-AECQ200-002
• Available in package size EIA 0402, 0603, 0805, 1206
• DCVoltageratingsof25V,50V,63V,100V,200Vand250V
• Capacitance range from 1 nF to 100 nF
• −55°Cto+125°Coperatingtemperaturerange
• Lead(Pb)-free,RoHSandREACHcompliant
• Availablecapacitancetolerancesof±1%,±2%,±5%,±10%,and±20%
• No piezoelectric noise
• ExtremelylowESRandESL
• Highthermalstability
• Highripplecurrentcapability
• Preferredcapacitancesolutionatlinefrequenciesand
intotheMHzrange
• NocapacitancechangeswithrespecttoappliedDCvoltage
• Negligiblecapacitancechangewithrespecttotemperaturefrom−55°Cto+125°C
• Nocapacitancedecaywithtime
• Non-polardevices,minimizinginstallationconcerns
• 100%puremattetin-platedterminationfinishallowingforexcellentsolderability
• Flexible Termination option available
Overview
TheKEMETelectrostaticdischarge(ESD)ratedcommercial
andautomotivegradesurfacemountcapacitorsinC0G
dielectricaresuitedforavarietyofapplicationswhere
electrostaticdischarge(ESD)eventsduringassembly
oroperationcoulddamagethecapacitororthecircuit.
TheseESDratedcapacitorsprovidetheabilitytodesign
withinagivenESDcriteriaperthehumanbodymodel
(HBM)AECQ200–002criteria.TheKEMETautomotive
gradecapacitorsalsomeettheotherdemanding
AutomotiveElectronicsCouncil'sAEC–Q200qualification
requirements.
TheC0Gdielectricfeaturesa125°Cmaximumoperating
temperatureandisconsidered“stable.”TheElectronics
IndustriesAlliance(EIA)characterizesC0Gdielectricas
aClassImaterial.Componentsofthisclassificationare
temperaturecompensatingandaresuitedforresonant
circuitapplications,aswellasthosewhereQandstabilityof
capacitancecharacteristicsarerequired.TheC0Gdielectric
exhibitsnochangeincapacitancewithrespecttotimeand
voltage,andboastsanegligiblechangeincapacitance
comparedtoitsvalueat25°C.Capacitancechangeislimited
to±30ppm/°Cfrom−55°Cto+125°C.
SurfaceMountMultilayerCeramicChipCapacitors(SMDMLCCs)
ESD, C0G Dielectric, 25 – 250 VDC
(Commercial & Automotive Grade)
Applications
Typicalapplicationsinclude:electrostaticdischarge(ESD),integratedcircuit(IC)protection,radiofrequency(RF)filtering
function,inputandoutputautomotiveapplicationssuchascontrollers,navigationsystems,airbagsandkeylesssystems.
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ammmc compmm
KEIVIEI'
crummy:
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1091_C0G_ESD • 3/7/2018 2
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC (Commercial & Automotive Grade)
Ordering Information
C0603 C103 J 3 G E C AUTO
Ceramic Case Size
(L"xW") Specification/
Series Capacitance
Code(pF) Capacitance
Tolerance2RatedVoltage
(VDC) Dielectric FailureRate/
Design Termination
Finish2
Packaging/
Grade
(C-Spec)
0402
0603
0805
1206
C=Standard
X = Flexible
Termination
Two
significant
digitsand
number of
zeros
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
3 = 25
5 = 50
M = 63
1 = 100
2 = 200
A = 250
G = C0G E = ESD C = 100%
Matte Sn
See
"Packaging
C-Spec
Ordering
Options
Table"
below
1 Additional capacitance tolerance offerings may be available. Contact KEMET for details.
2 Additional capacitance tolerance offerings and termination finish options may be available. Contact KEMET for details.Benefits (cont'd)
Table 1A – Capacitance Range/Selection Waterfall
Capacitance Cap Code
Case Size/
Series C0402C C0603C C0805C C1206C
Rated Voltage
(VDC) 25 50 63 100 25 50 63 100 200 25 50 63 100 200 250 25 50 63 100 200 250
Voltage Code 35M 1 3 5M 1 235M 1 2A 3 5M 1 2A
Cap Tolerance ESD Level per AEC–Q200
1.0 nF 102
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
4 kV 4 kV 4 kV 4 kV 6 kV 6 kV 6 kV 6 kV 6 kV 8 kV 8 kV 8 kV 8 kV 8 kV 8 kV 12 kV 12 kV 12 kV 12 kV 12 kV 12 kV
1.5 nF 152 6 kV 6 kV 8 kV 8 kV 8 kV 8 kV 8 kV 8 kV 8 kV 8 kV 8 kV 8 kV 8 kV 16 kV 16 kV 16 kV 16 kV 16 kV 16 kV
2.2 nF 222 6 kV 12 kV 12 kV 12 kV 12 kV 12 kV 12 kV 12 kV 12 kV 12 kV 12 kV 12 kV 16 kV 16 kV 16 kV 16 kV 16 kV 16 kV
3.3 nF 332 16 kV 16 kV 16 kV 16 kV 16 kV 16 kV 16 kV 16 kV 16 kV 16 kV 16 kV 16 kV 16 kV 16 kV 16 kV 16 kV
4.7 nF 472 16 kV 16 kV 16 kV 16 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV
6.8 nF 682 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV
10 nF 103 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV
15 nF 153 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV
22 nF 223 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV 25 kV
33 nF 333 25 kV 25 kV 25 kV 25 kV 25 kV
47 nF 473 25 kV 25 kV 25 kV 25 kV 25 kV
68 nF 683 25 kV 25 kV
100 nF 104 25 kV
ammm Compancnls
KEIl/IEI'
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7411 (HA 0603 and smal‘er case sizes)
7210 (EIA 0505 and larger case swzes)
AUT074‘I1 EIA 0603 and smaller case SIZES)
AUT07210 EIA 0805 and \arger case SIZES)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1091_C0G_ESD • 3/7/2018 3
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC (Commercial & Automotive Grade)
Packaging C-Spec Ordering Options Table
Packaging Type Packaging/Grade
Ordering Code (C-Spec)
CommercialGrade1
Bulk Bag
Notrequired(blank)
7"Reel/Unmarked
TU
13"Reel/Unmarked
7411(EIA0603andsmallercasesizes)
7210(EIA0805andlargercasesizes)
7"Reel/Unmarked/2mmpitch
2
7081
13"Reel/Unmarked/2mmpitch
2
7082
AutomotiveGrade3
7"Reel
AUTO
13"Reel/Unmarked
AUTO7411(EIA0603andsmallercasesizes)
AUTO7210(EIA0805andlargercasesizes)
7"Reel/Unmarked/2mmpitch
2
3190
13"Reel/Unmarked/2mmpitch
2
3191
1 Default packaging is "Bulk Bag." An ordering code C-Spec is not required for "Bulk Bag" packaging.
1 The terms "Marked" and "Unmarked" pertain to laser marking option of capacitors. All packaging options labeled as "Unmarked" will contain capacitors
that have not been laser marked. The option to laser mark is not available on these devices. For more information see "Capacitor Marking."
2 The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case
size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information".
3 Reeling tape options (Paper or Plastic) are dependent on capacitor case size (L" x W") and thickness dimension. See "Chip Thickness/Tape & Reel
Packaging Quantities" and "Tape & Reel Packaging Information."
3 For additional information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information."
3 All automotive packaging C-Specs listed exclude the option to laser mark components. The option to laser mark is not available on these devices. For
more information see "Capacitor Marking."
ammmc compmm
KEIVIEI'
crummy:
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1091_C0G_ESD • 3/7/2018 4
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC (Commercial & Automotive Grade)
Automotive C-Spec Information
KEMETautomotivegradeproductsmeetorexceedtherequirementsoutlinedbytheAutomotiveElectronicsCouncil.
DetailsregardingtestmethodsandconditionsarereferencedindocumentAEC–Q200,StressTestQualificationforPassive
Components.TheseproductsaresupportedbyaProductChangeNotification(PCN)andProductionPartApprovalProcess
warrant(PPAP).
AutomotiveproductsofferedthroughourdistributionchannelhavebeenassignedaninclusiveorderingcodeC-Spec,“AUTO.”
ThisC-Specwasdevelopedinordertobetterservesmallandmedium-sizedcompaniesthatpreferanautomotivegrade
componentwithouttherequirementtosubmitacustomerSourceControlledDrawing(SCD)orspecificationforreviewbya
KEMETengineeringspecialist.ThisC-SpecisthereforenotintendedforusebyKEMETOEMautomotivecustomersandare
notgrantedthesame“privileges”asotherautomotiveC-Specs.CustomerPCNapprovalandPPAPrequestlevelsarelimited
(seedetailsbelow.)
Product Change Notifi cation (PCN)
TheKEMETproductchangenotificationsystemisusedtocommunicateprimarilythefollowingtypesofchanges:
•Product/processchangesthataffectproductform,fit,function,and/orreliability
•Changesinmanufacturingsite
•Productobsolescence
KEMET Automotive
C-Spec
Customer Notifi cation Due To: Days Prior To
Implementation
Process/Productchange Obsolescence*
KEMETassigned1Yes(withapprovalandsignoff) Yes 180daysminimum
AUTO Yes(withoutapproval) Yes 90daysminimum
1 KEMET assigned C-Specs require the submittal of a customer SCD or customer specifi cation for review. For additional information contact KEMET.
Production Part Approval Process (PPAP)
ThepurposeoftheProductionPartApprovalProcessis:
•Toensurethatsuppliercanmeetthemanufacturabilityandqualityrequirementsforthepurchasedparts.
•Toprovidetheevidencethatallcustomerengineeringdesignrecordsandspecificationrequirementsareproperly
understoodandfulfilledbythemanufacturingorganization.
•Todemonstratethattheestablishedmanufacturingprocesshasthepotentialtoproducethepart.
KEMET Automotive
C-Spec
PPAP (Product Part Approval Process) Level
12345
KEMETassigned1●●●●●
AUTO ○ ○
1 KEMET assigned C-Specs require the submittal of a customer SCD or customer specifi cation for review. For additional information contact KEMET.
●PartnumberspecificPPAPavailable
○ProductfamilyPPAPonly
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1091_C0G_ESD • 3/7/2018 5
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC (Commercial & Automotive Grade)
Dimensions – Millimeters (Inches)
L
B
W
S
T
EIA Size
Code
Metric Size
Code
L
Length
W
Width
T
Thickness
B
Bandwidth
S
Separation
Minimum
Mounting
Technique
Without Flexible Termination
0402 1005 1.00(0.040)
±0.05(0.002)
0.50(0.020)
±0.05(0.002)
See Table 2 for
Thickness
0.30(0.012)
±0.10(0.004) 0.30(0.012) Solderreflow
only
0603 1608 1.60(0.063)
±0.15(0.006)
0.80(0.032)
±0.15(0.006)
0.35(0.014)
±0.15(0.006) 0.70(0.028)
Solderwave
or
Solderreflow
0805 2012 2.00(0.079)
±0.20(0.008)
1.25(0.049)
±0.20(0.008)
0.50(0.02)
±0.25(0.010) 0.75(0.030)
1206 3216 3.20(0.126)
±0.20(0.008)
1.60(0.063)
±0.20(0.008)
0.50(0.02)
±0.25(0.010) N/A
With Flexible Termination
0603 1608 1.60(0.063)
±0.17(0.007)
0.80(0.032)
±0.15(0.006)
See Table 2 for
Thickness
0.45(0.018)
±0.15(0.006) 0.58(0.023)
Solderwaveor
Solderreflow
0805 2012 2.00(0.079)
±0.30(0.012)
1.25(0.049)
±0.30(0.012)
0.50(0.02)
±0.25(0.010) 0.75(0.030)
1206 3216 3.30(0.130)
±0.40(0.016)
1.60(0.063)
±0.35(0.013)
0.60(0.024)
±0.25(0.010) N/A
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© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1091_C0G_ESD • 3/7/2018 6
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC (Commercial & Automotive Grade)
Qualification/Certification
Commercialgradeproductsaresubjecttointernalqualification.Detailsregardingtestmethodsandconditionsare
referencedinTable4,Performance&Reliability.
AutomotivegradeproductsmeetorexceedtherequirementsoutlinedbytheAutomotiveElectronicsCouncil.Details
regardingtestmethodsandconditionsarereferencedindocumentAEC–Q200,StressTestQualificationforPassive
Components.ForadditionalinformationregardingtheAutomotiveElectronicsCouncilandAEC–Q200,pleasevisittheir
website at www.aecouncil.com.
Environmental Compliance
Lead(Pb)-free,RoHS,andREACHcompliantwithoutexemptions.
Electrical Parameters/Characteristics
Item Parameters/Characteristics
OperatingTemperatureRange −55°Cto+125°C
CapacitanceChangewithReferenceto
+25°Cand0VDCApplied(TCC) ±30ppm/°C
AgingRate(Maximum%CapacitanceLoss/DecadeHour) 0%
1DielectricWithstandingVoltage(DWV)
250%ofratedvoltage
(5±1secondsandcharge/dischargenotexceeding50mA)
2DissipationFactor(DF)MaximumLimitat25°C 0.1%
3InsulationResistance(IR)MinimumLimitat25°C
1,000MΩµFor100GΩ
(Ratedvoltageappliedfor120±5secondsat25°C)
1 DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the
capacitor.
2 Capacitance and dissipation factor (DF) measured under the following conditions:
1 MHz ±100 kHz and 1.0 ±0.2 Vrms if capacitance ≤ 1,000 pF
1 kHz ±50 Hz and 1.0 ±0.2 Vrms if capacitance > 1,000 pF
3 To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Note: When measuring capacitance, it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known
as automatic level control (ALC). The ALC feature should be switched to "ON."
Post Environmental Limits
Post Environmental Limits
Dielectric RatedDC
Voltage Capacitance Dissipation Factor
(Maximum%)
Capacitance
Shift
Insulation
Resistance
C0G All All 0.5 0.3% or
±0.25 pf
10% of
Initial limit
ammmc compmm
KEIVIEI'
ESD, CUG Dielectric, 25 7 25B VDC (Commercual & Aulomome Grade) crummy:
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1091_C0G_ESD • 3/7/2018 7
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC (Commercial & Automotive Grade)
Table 1B – Product Availability and Chip Thickness Waterfall – Standard Termination
Capacitance Cap Code
Case Size/
Series C0402C C0603C C0805C C1206C
Rated Voltage
(VDC) 25 50 63 100 25 50 63 100 200 25 50 63 100 200 250 25 50 63 100 200 250
Voltage Code 35M 1 3 5M 1 235M 1 2A 3 5M 1 2A
Cap Tolerance Product Availability and Chip Thickness Codes – See Packaging Specs for Chip Thickness Dimensions
1.0 nF 102
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
BB BB BB BB CJ CJ CJ CJ CJ DD DD DD DD DD DD EQ EQ EQ EQ EQ EQ
1.5 nF 152 BB BB CJ CJ CJ CJ CJ DR DR DR DR DR DR ER ER ER ER ER ER
2.2 nF 222 BB CJ CJ CJ CJ CJ DR DR DR DR DR DR ET ET ET ET ET ET
3.3 nF 332 CJ CJ CJ CJ DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ
4.7 nF 472 CJ CJ CJ CJ DD DD DD DD DD DD EQ EQ EQ EQ EQ EQ
6.8 nF 682 CJ CJ DG DG DG DG DG DG EQ EQ EQ EQ EQ EQ
10 nF 103 CJ DD DD DD DD ER ER ER ER ER ER
15 nF 153 CJ DG DG DG DG EF EF EF EF EF EF
22 nF 223 DF DF EH EH EH EH EH EH
33 nF 333 DG EF EF EF EF
47 nF 473 DG EH EH EH EH
68 nF 683 EH EH
100 nF 104 EH
Table 1C – Product Availability and Chip Thickness Waterfall – Flexible Termination
Capacitance Cap Code
Case Size/
Series C0603C C0805C C1206C
Rated Voltage
(VDC) 25 50 63 100 200 25 50 63 100 200 250 25 50 63 100 200 250
Voltage Code 35M 1 235M 1 2A 3 5M 1 2A
Cap Tolerance Product Availability and Chip Thickness Codes – See Packaging Specs for Chip Thickness Dimensions
1.0 nF 102
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
CJ CJ CJ CJ CJ DD DD DD DD DD DD EQ EQ EQ EQ EQ EQ
1.5 nF 152 CJ CJ CJ CJ CJ DR DR DR DR DR DR ER ER ER ER ER ER
2.2 nF 222 CJ CJ CJ CJ CJ DR DR DR DR DR DR ET ET ET ET ET ET
3.3 nF 332 CJ CJ CJ CJ DR DR DR DR DR DR EQ EQ EQ EQ EQ EQ
4.7 nF 472 CJ CJ CJ CJ DD DD DD DD DD DD EQ EQ EQ EQ EQ EQ
6.8 nF 682 CJ CJ DG DG DG DG DG DG EQ EQ EQ EQ EQ EQ
10 nF 103 CJ DD DD DD DD ER ER ER ER ER ER
15 nF 153 CJ DG DG DG DG EF EF EF EF EF EF
22 nF 223 DF DF EH EH EH EH EH EH
33 nF 333 DG EF EF EF EF
47 nF 473 DG EH EH EH EH
68 nF 683 EH EH
100 nF 104 EH
ammmc compmm
KEIVIEI'
crummy:
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1091_C0G_ESD • 3/7/2018 8
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC (Commercial & Automotive Grade)
Table 2 – Chip Thickness/Tape & Reel Packaging Quantities
Thickness
Code
Case
Size1
Thickness ±
Range (mm)
Paper Quantity1Plastic Quantity
7" Reel 13" Reel 7" Reel 13" Reel
BB
0402
0.50 ±0.05
10,000
50,000
0
0
CF
0603
0.80 ±0.07*
4,000
15,000
0
0
DF 0805 1.10 ±0.10 0 0 2,500 10,000
DG
0805
1.25 ±0.15
0
0
2,500
10,000
EB 1206 0.78 ±0.10 4,000 10,000 4,000 10,000
EC
1206
0.90 ±0.10
0
0
4,000
10,000
EE 1206 1.10 ±0.10 0 0 2,500 10,000
EF
1206
1.20 ±0.15
0
0
2,500
10,000
EH
1206
1.60 ±0.20
0
0
2,000
8,000
Table 3 – Bulk Packaging Quantities
Packaging Type Loose Packaging
BulkBag(default)
Packaging C-Spec1N/A2
Case Size Packaging Quantities (pieces/unit packaging)
EIA(in) Metric(mm) Minimum Maximum
0402
1005
1
50,000
0603
1608
0805
2012
1206
3216
1210
3225
1808
4520
20,000
1812
4532
1825
4564
2220
5650
2225
5664
1 The "Packaging C-Spec" is a 4 to 8 digit code which identifies the packaging type and/or product grade. When ordering, the proper code must be
included in the 15th through 22nd character positions of the ordering code. See "Ordering Information" section of this document for further details.
Commercial grade product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging. Contact KEMET if you require a bulk
bag packaging option for automotive grade products.
2 A packaging C-Spec (see note 1 above) is not required for "Bulk Bag" packaging (excluding Anti-Static Bulk Bag and automotive grade products.) The
15th through 22nd character positions of the ordering code should be left blank. All products ordered without a packaging C-Spec will default to our
standard "Bulk Bag" packaging.
E‘ucuomc Compcnonu
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© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1091_C0G_ESD • 3/7/2018 9
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC (Commercial & Automotive Grade)
Table 4 – Land Pattern Design Recommendations per IPC–7351
EIA
Size
Code
Metric
Size
Code
Density Level A:
Maximum (Most)
Land Protrusion (mm)
Density Level B:
Median (Nominal)
Land Protrusion (mm)
Density Level C:
Minimum (Least)
Land Protrusion (mm)
C Y X V1 V2 C Y X V1 V2 C Y X V1 V2
Without Flexible Termination
0402 1005 0.50 0.72 0.72 2.20 1.20 0.45 0.62 0.62 1.90 1.00 0.40 0.52 0.52 1.60 0.80
0603 1608 0.90 1.15 1.10 4.00 2.10 0.80 0.95 1.00 3.10 1.50 0.60 0.75 0.90 2.40 1.20
0805 2012 1.00 1.35 1.55 4.40 2.60 0.90 1.15 1.45 3.50 2.00 0.75 0.95 1.35 2.80 1.70
1206 3216 1.60 1.35 1.90 5.60 2.90 1.50 1.15 1.80 4.70 2.30 1.40 0.95 1.70 4.00 2.00
With Flexible Termination
0603 1608 0.85 1.25 1.10 4.00 2.10 0.75 1.05 1.00 3.10 1.50 0.65 0.85 0.90 2.40 1.20
0805 2012 0.99 1.44 1.66 4.47 2.71 0.89 1.24 1.56 3.57 2.11 0.79 1.04 1.46 2.42 1.81
1206 3216 1.59 1.62 2.06 5.85 3.06 1.49 1.42 1.96 4.95 2.46 1.39 1.22 1.86 4.25 2.16
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow
solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform
qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
Y
C C
X X
V1
V2
Grid Placement Courtyard
Y
cccccccccccccccccccc
Emma):
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1091_C0G_ESD • 3/7/2018 10
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC (Commercial & Automotive Grade)
Soldering Process
Recommended Soldering Technique
•SolderwaveorsolderreflowforEIAcasesizes0603,0805and1206
•AllotherEIAcasesizesarelimitedtosolderreflowonly
Recommended Reflow Soldering Profile
TheKEMETfamiliesofsurfacemountmultilayerceramiccapacitors(SMDMLCCs)arecompatiblewithwave(singleordual),
convection,IRorvaporphasereflowtechniques.Preheatingofthesecomponentsisrecommendedtoavoidextremethermal
stress.KEMET’srecommendedprofileconditionsforconvectionandIRreflowreflecttheprofileconditionsofthe
IPC/J-STD-020standardformoisturesensitivitytesting.Thesedevicescansafelywithstandamaximumofthreereflow
passesattheseconditions.
Profile Feature Termination Finish
100% Matte Sn
Preheat/Soak
Temperatureminimum(TSmin)
150°C
Temperaturemaximum(T
Smax
)200°C
Time(tS)fromTSmin to TSmax
60–120seconds
Ramp-uprate(TL to TP)3°C/secondmaximum
Liquidoustemperature(TL)217°C
Timeaboveliquidous(tL) 60–150seconds
Peaktemperature(TP)260°C
Timewithin5°Cofmaximumpeak
temperature(t
P
)30secondsmaximum
Ramp-downrate(TP to TL)6°C/secondmaximum
Time25°Ctopeaktemperature 8 minutes maximum
Note : All temperatures refer to the center of the package, measured on the
capacitor body surface that is facing up during assembly reflow.
Time
Temperature
Tsmin
25
Tsmax
TL
TPMaximum Ramp Up Rate = 3°C/second
Maximum Ramp Down Rate = 6°C/second
tP
tL
ts
25°C to Peak
Electronic Compancnl:
KEIl/IEI'
EHARGED!
Load humidity: 1,000 hours EEC/85% RH and rated voltage. Add 100 K ohm resistor.
Measurement at 24 hours 14 hours after test conclusion.
Low volt humidity: 1,000 hours ETC/85% RH and 1.5 V, Add 100 K ohm resistor,
Measurement at 24 hours 14 hours after test conclusion.
MlL’STD’202 t: 24 hours/cycle, Steps 7a and 7h not required.
Method 106
*55’0/+125“C.Note: Number ol cycles required , 300. Maximum transfer time , 20
seconds,
Dwell time , 15 minutes, Air , Air,
MlL’STD’ZDZ
Method 108
MlL’STD’ZDZ
Method 213
MlL’STD’ZDZ
Method 215
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1091_C0G_ESD • 3/7/2018 11
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC (Commercial & Automotive Grade)
Table 5 – Performance & Reliability: Test Methods and Conditions
Stress Reference Test or Inspection Method
TerminalStrength JIS–C–6429 Appendix1,Note:Forceof1.8kgfor60seconds.
BoardFlex JIS–C–6429
Appendix2,Note:Standardterminationsystem–2.0mm(minimum)forallexcept3mmfor
C0G.Flexibleterminationsystem–3.0mm(minimum).
Solderability J–STD–002
Magnification50X.Conditions:
a)MethodB,4hoursat155°C,dryheatat235°C
b)MethodBat215°C,category3
c)MethodDat260°C,category3
Temperature Cycling JESD22MethodJA–104 1,000Cycles(−55°Cto+125°C).Measurementat24hours±4hoursaftertestconclusion.
BiasedHumidity MIL–STD–202
Method103
Loadhumidity:1,000hours85°C/85%RHandratedvoltage.Add100Kohmresistor.
Measurementat24hours±4hoursaftertestconclusion.
Lowvolthumidity:1,000hours85°C/85%RHand1.5V.Add100Kohmresistor.
Measurementat24hours±4hoursaftertestconclusion.
MoistureResistance
MIL–STD–202
Method106
t=24hours/cycle.Steps7aand7bnotrequired.
Measurementat24hours±4hoursaftertestconclusion.
ThermalShock MIL–STD–202
Method107
−55°C/+125°C.Note:Numberofcyclesrequired–300.Maximumtransfertime–20
seconds.
Dwelltime–15minutes.Air–Air.
HighTemperatureLife MIL–STD–202
Method108/EIA–198 1,000hoursat125°C(85°CforX5R,Z5UandY5V)with2Xratedvoltageapplied.
Storage Life
MIL–STD–202
Method108
150°C,0VDCfor1,000hours.
Vibration MIL–STD–202
Method204
5g'sfor20minutes,12cycleseachof3orientations.Note:use8"X5"PCB0.031"thick
7securepointsononelongsideand2securepointsatcornersofoppositesides.Parts
mountedwithin2"fromanysecurepoint.Testfrom10–2,000Hz
MechanicalShock
MIL–STD–202
Method213
Figure1ofMethod213,ConditionF.
ResistancetoSolvents
MIL–STD–202
Method215
Addaqueouswashchemical,OKEMCleanorequivalent.
Storage and Handling
Ceramicchipcapacitorsshouldbestoredinnormalworkingenvironments.Whilethechipsthemselvesarequiterobustin
otherenvironments,solderabilitywillbedegradedbyexposuretohightemperatures,highhumidity,corrosiveatmospheres,
andlongtermstorage.Inaddition,packagingmaterialswillbedegradedbyhightemperature–reelsmaysoftenorwarp
andtapepeelforcemayincrease.KEMETrecommendsthatmaximumstoragetemperaturenotexceed40°Candmaximum
storagehumiditynotexceed70%relativehumidity.Temperaturefluctuationsshouldbeminimizedtoavoidcondensationon
thepartsandatmospheresshouldbefreeofchlorineandsulfurbearingcompounds.Foroptimizedsolderabilitychipstock
shouldbeusedpromptly,preferablywithin1.5yearsofreceipt.
....................
CHARGED!
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1091_C0G_ESD • 3/7/2018 12
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC (Commercial & Automotive Grade)
Construction – Standard Termination
Detailed Cross Section
Barrier Layer
(Ni)
Dielectric Material
(CaZrO3)
End Termination/
External Electrode
(Cu)
Dielectric
Material (CaZrO3)
Barrier Layer
(Ni)
End Termination/
External Electrode
(Cu)
Termination Finish
(100% Matte Sn)
Inner Electrodes
(Ni)
Inner Electrodes
(Ni)
Termination Finish
(100% Matte Sn)
Construction – Flexible Termination
Dielectric
Material (CaZrO3)
Detailed Cross Section
Inner Electrodes
(Ni)
Barrier Layer
(Ni)
Termination Finish
(100% Matte Sn)
Inner Electrodes
(Ni)
Dielectric Material
(CaZrO3)
Epoxy Layer
(Ag)
End Termination/
External Electrode
(Cu)
Barrier Layer
(Ni)
Termination
Finish
(100% Matte Sn)
Epoxy Layer
(Ag)
End Termination/
External Electrode
(Cu)
ammm Compancnls
KEIVIEI'
cumin:
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1091_C0G_ESD • 3/7/2018 13
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC (Commercial & Automotive Grade)
Capacitor Marking (Optional):
Lasermarkingoptionisnotavailableon:
• C0G,ultrastableX8RandY5Vdielectricdevices
• EIA0402casesizedevices
• EIA0603casesizedeviceswithflexibleterminationoption.
• KPScommercialandautomotivegradestackeddevices.
Thesecapacitorsaresuppliedunmarkedonly.
ammm Compancnls
KEIVIEI'
Emma):
Bmm.12mm
173 mm (7 w») mmmm camenape
KPS1812
and 2220
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1091_C0G_ESD • 3/7/2018 14
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC (Commercial & Automotive Grade)
Tape & Reel Packaging Information
KEMEToffersmultilayerceramicchipcapacitorspackagedin8,12and16mmtapeon7"and13"reelsinaccordancewith
EIAStandard481.Thispackagingsystemiscompatiblewithalltape-fedautomaticpickandplacesystems.SeeTable2for
detailsonreelingquantitiesforcommercialchips.
8 mm, 12 mm
or 16 mm carrier tape
178 mm (7.00")
or
330 mm (13.00")
Anti-static reel
Embossed plastic* or
punched paper carrier.
Embossment or punched cavity
Anti-static cover tape
(0.10 mm (0.004") maximum thickness)
Chip and KPS orientation in pocket
(except 1825 commercial, and 1825 and 2225 Military)
*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.
KEMET
®
Bar code label
Sprocket holes
Table 6 – Carrier Tape Confi guration, Embossed Plastic & Punched Paper (mm)
EIA Case Size
Tape
Size
(W)*
Embossed Plastic Punched Paper
7"Reel 13"Reel 7"Reel 13"Reel
Pitch(P
1
)* Pitch(P
1
)*
01005–0402 8 2 2
0603 82/4 2/4
0805 84444
1206–1210 84444
1805–1808 12 4 4
≥1812 12 8 8
KPS 1210 12 8 8
KPS 1812
and2220
16 12 12
Array 0612 844
*Refer to Figures 1 and 2 for W and P1 carrier tape reference locations.
*Refer to Tables 6 and 7 for tolerance specifi cations.
New 2 mm Pitch Reel Options*
Packaging
Ordering Code
(C-Spec)
Packaging Type/Options
C-3190
Automotivegrade7"reelunmarked
C-3191
Automotivegrade13"reelunmarked
C-7081
Commercialgrade7"reelunmarked
C-7082
Commercialgrade13"reelunmarked
* 2 mm pitch reel only available for 0603 EIA case size.
2 mm pitch reel for 0805 EIA case size under development.
Benefi ts of Changing from 4 mm to 2 mm Pitching Spacing
• Lower placement costs.
• Doublethepartsoneachreelresultsinfewerreel
changesandincreasedefficiency.
• Fewerreelsresultinlowerpackaging,shippingand
storagecosts,reducingwaste.
Eiecxmmc Compancnls
KEIVIEI'
EHARGED:
‘ ' F
mum:
DY Minimum R Reierence SY Minimum T T‘
Note 1 Note 2 Note 3 Maximum Maximum
i3Y Maximum E2 T2 W
Nole4 Minimum Maximum Maximum
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1091_C0G_ESD • 3/7/2018 15
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC (Commercial & Automotive Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
P
0
T
F
W
Center Lines of Cavity
A
0
B
0
User Direction of Unreeling
Cover Tape
K
0
B
1
is for tape feeder reference only,
including draft concentric about B
0
.
T
2
ØD
1
ØD
0
B
1
S
1
T
1
E
1
E
2
P
1
P
2
Embossment
For cavity size,
see Note 1 Table 4
(10 pitches cumulative
tolerance on tape ±0.2 mm)
Table 7 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size D0
D
1
Minimum
Note 1
E1P0 P2
RReference
Note 2
S
1
Minimum
Note 3
T
Maximum
T
1
Maximum
8 mm
1.5+0.10/−0.0
(0.059+0.004/−0.0)
1.0
(0.039)
1.75 ±0.10
(0.069±0.004) 4.0 ±0.10
(0.157±0.004) 2.0 ±0.05
(0.079±0.002)
25.0
(0.984)
0.600
(0.024) 0.600
(0.024) 0.100
(0.004)
12 mm 1.5
(0.059) 30
(1.181)
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size Pitch
B
1
Maximum
Note 4
E
2
Minimum
F P1
T
2
Maximum
W
Maximum
A0,B0&K0
8 mm Single(4mm)
4.35
(0.171)
6.25
(0.246)
3.5 ±0.05
(0.138±0.002)
4.0 ±0.10
(0.157±0.004)
2.5
(0.098)
8.3
(0.327)
Note 512 mm Single(4mm)
andDouble(8mm)
8.2
(0.323)
10.25
(0.404)
5.5 ±0.05
(0.217±0.002)
8.0 ±0.10
(0.315±0.004)
4.6
(0.181)
12.3
(0.484)
16 mm Triple(12mm)
12.1
(0.476)
14.25
(0.561)
7.5 ±0.05
(0.138±0.002)
12.0 ±0.10
(0.157±0.004)
4.6
(0.181)
16.3
(0.642)
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment
location and hole location shall be applied independent of each other.
2. The tape with or without components shall pass around R without damage (see Figure 6.)
3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481, paragraph 4.3, section b.)
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity defi ned by A0, B0 and K0 shall surround the component with suffi cient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes, and 10° maximum for 16 mm tapes (see Figure 3.)
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape, and to 1.0 mm maximum for 16 mm tape (see
Figure 4.)
(e) for KPS product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.
ammm Compancnls
KEIVI
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T - V 1 f
¢¢§9
W \
+7: Tiifi‘eri
/ #4 j/ l ‘X J x
—
RRefevence
NmeZ
0.10
(0.904)
maXImum
(afiiflig (0237)
4.0 10.10 3.3
(0.157 :a 004) (0.327)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1091_C0G_ESD • 3/7/2018 16
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC (Commercial & Automotive Grade)
Figure 2 – Punched (Paper) Carrier Tape Dimensions
User Direction of Unreeling
Top Cover Tape
T
Center Lines of Cavity
P1
ØDo Po E1
F
E2
W
G
A0
B0
Cavity Size,
See
Note 1, Table 7
Bottom Cover Tape
T1
T1
Bottom Cover Tape
(10 pitches cumulative
tolerance on tape ±0.2 mm)
Table 8 – Punched (Paper) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size D
0
E
1
P
0
P
2
T
1
Maximum G Minimum
RReference
Note 2
8 mm 1.5+0.10-0.0
(0.059+0.004-0.0) 1.75 ±0.10
(0.069±0.004) 4.0 ±0.10
(0.157±0.004) 2.0 ±0.05
(0.079±0.002)
0.10
(0.004)
maximum
0.75
(0.030) 25
(0.984)
Variable Dimensions — Millimeters (Inches)
Tape Size Pitch E2 Minimum F P1 T Maximum WMaximum A0 B0
8 mm Half(2mm) 6.25
(0.246) 3.5 ±0.05
(0.138±0.002)
2.0 ±0.05
(0.079±0.002)
1.1
(0.098)
8.3
(0.327)
Note 1
8 mm Single(4mm)
4.0 ±0.10
(0.157±0.004)
8.3
(0.327)
1. The cavity defi ned by A0, B0 and T shall surround the component with suffi cient clearance that:
a) the component does not protrude beyond either surface of the carrier tape.
b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
c) rotation of the component is limited to 20° maximum (see Figure 3.)
d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4.)
e) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.
2. The tape with or without components shall pass around R without damage (see Figure 6.)
cccccccccccccccccccc
Emma):
e 7/////////////////////l‘
e
O
@379
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1091_C0G_ESD • 3/7/2018 17
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC (Commercial & Automotive Grade)
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 kg minimum.
2. Cover Tape Peel Strength: Thetotalpeelstrengthofthecovertapefromthecarriertapeshallbe:
Tape Width Peel Strength
8 mm 0.1to1.0newton(10to100gf)
12and16mm 0.1to1.3newton(10to130gf)
Thedirectionofthepullshallbeoppositethedirectionofthecarriertapetravel.Thepullangleofthecarriertapeshallbe
165°to180°fromtheplaneofthecarriertape.Duringpeeling,thecarrierand/orcovertapeshallbepulledatavelocityof
300 ±10 mm/minute.
3. Labeling:Barcodelabeling(standardorcustom)shallbeonthesideofthereeloppositethesprocketholes.Refer to EIA
Standards 556 and 624.
Figure 3 – Maximum Component Rotation
Ao
Bo
°
T
°
s
Maximum Component Rotation
Top View
Maximum Component Rotation
Side View
Tape Maximum
Width (mm) Rotation (°
T)
8,12 20
16 – 200 10 Tape Maximum
Width (mm) Rotation ( °
S)
8,12 20
16 – 56 10
72 – 200 5
Typical Pocket Centerline
Typical Component Centerline
Figure 4 – Maximum Lateral Movement
0.5 mm maximum
0.5 mm maximum
8 mm & 12 mm Tape
1.0 mm maximum
1.0 mm maximum
16 mm Tape
Figure 5 – Bending Radius
RR
Bending
Radius
Embossed
Carrier
Punched
Carrier
ammm Compancnls
KEIVIEI'
Emma):
0.4 mes/+0.0
(0331 +0 059400)
12.4 +2 0/00
(0.40:; +0 070/0 0)
15.4 +2.0/+0.0
(0.646 +0 070/0 0)
14.4
(0 567)
10.4
(0.724)
22.4
(0 882)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1091_C0G_ESD • 3/7/2018 18
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC (Commercial & Automotive Grade)
Figure 6 – Reel Dimensions
AD(See Note)
Full Radius,
See Note
B(see Note)
Access Hole at
Slot Location
(Ø 40 mm minimum)
If present,
tape slot in core
for tape start:
2.5 mm minimum width x
10.0 mm minimum depth
W
3
(Includes
flange distortion
at outer edge)
W
2
(Measured at hub)
W
1
(Measured at hub)
C
(Arbor hole
diameter)
Note: Drive spokes optional; if used, dimensions B and D shall apply.
N
Table 9 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size A B Minimum CD Minimum
8 mm 178 ±0.20
(7.008±0.008)
or
330 ±0.20
(13.000±0.008)
1.5
(0.059) 13.0+0.5/−0.2
(0.521+0.02/−0.008) 20.2
(0.795)
12 mm
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size N Minimum W1 W2 Maximum W3
8 mm
50
(1.969)
8.4+1.5/−0.0
(0.331+0.059/−0.0)
14.4
(0.567)
Shallaccommodatetape
widthwithoutinterference
12 mm
12.4+2.0/−0.0
(0.488+0.078/−0.0)
18.4
(0.724)
16 mm
16.4+2.0/−0.0
(0.646+0.078/−0.0)
22.4
(0.882)
EHARGED!
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© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1091_C0G_ESD • 3/7/2018 19
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC (Commercial & Automotive Grade)
Figure 7 – Tape Leader & Trailer Dimensions
Trailer
160 mm minimum
Carrier Tape
END START
Round Sprocket Holes
Elongated Sprocket Holes
(32 mm tape and wider)
Top Cover Tape
Top Cover Tape
Punched Carrier
8 mm & 12 mm only
Embossed Carrier
Components
100 mm
minimum leader
400 mm minimum
Figure 8 – Maximum Camber
Carrier Tape
Round Sprocket Holes
1 mm maximum, either direction
Straight Edge
250 mm
Elongated Sprocket Holes
(32 mm & wider tapes)
ammmc compmm
KEIVIEI'
cumin:
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1091_C0G_ESD • 3/7/2018 20
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
ESD, C0G Dielectric, 25 – 250 VDC (Commercial & Automotive Grade)
KEMET Electronics Corporation Sales Offi ces
Foracompletelistofourglobalsalesoffices,pleasevisitwww.kemet.com/sales.
Disclaimer
Allproductspecifications,statements,informationanddata(collectively,the“Information”)inthisdatasheetaresubjecttochange.Thecustomerisresponsiblefor
checkingandverifyingtheextenttowhichtheInformationcontainedinthispublicationisapplicabletoanorderatthetimetheorderisplaced.
AllInformationgivenhereinisbelievedtobeaccurateandreliable,butitispresentedwithoutguarantee,warranty,orresponsibilityofanykind,expressedorimplied.
StatementsofsuitabilityforcertainapplicationsarebasedonKEMETElectronicsCorporation’s(“KEMET”)knowledgeoftypicaloperatingconditionsforsuch
applications,butarenotintendedtoconstitute–andKEMETspecificallydisclaims–anywarrantyconcerningsuitabilityforaspecificcustomerapplicationoruse.
TheInformationisintendedforuseonlybycustomerswhohavetherequisiteexperienceandcapabilitytodeterminethecorrectproductsfortheirapplication.Any
technicaladviceinferredfromthisInformationorotherwiseprovidedbyKEMETwithreferencetotheuseofKEMET’sproductsisgivengratis,andKEMETassumesno
obligationorliabilityfortheadvicegivenorresultsobtained.
AlthoughKEMETdesignsandmanufacturesitsproductstothemoststringentqualityandsafetystandards,giventhecurrentstateoftheart,isolatedcomponent
failuresmaystilloccur.Accordingly,customerapplicationswhichrequireahighdegreeofreliabilityorsafetyshouldemploysuitabledesignsorothersafeguards
(suchasinstallationofprotectivecircuitryorredundancies)inordertoensurethatthefailureofanelectricalcomponentdoesnotresultinariskofpersonalinjuryor
propertydamage.
Althoughallproduct–relatedwarnings,cautionsandnotesmustbeobserved,thecustomershouldnotassumethatallsafetymeasuresareindictedorthatother
measuresmaynotberequired.
KEMET is a registered trademark of KEMET Electronics Corporation.
United Kingdom