FT-CAP, Ultra Stable, X8R Dielectric Datasheet by KEMET

Electronic Components KEII/IEI' CHARGED? addition to Commeicial Grade, Automotive Glade d available which meet the demanding Automotive ronics Council's AEC»0200 qualiﬁcation requiiement Realed Failule Packaging/ (VDC) Design (C-Spec)

One world. One KEMET

Overview

KEMET’s Flexible Termination (FT-CAP) Multilayer Ceramic

Capacitor in Ultra-Stable X8R dielectric incorporates a

unique, flexible termination system that is integrated with

KEMET’s standard termination materials. A conductive

silver epoxy is utilized between the base metal and nickel

barrier layers of KEMET’s standard termination system

in order to establish pliability, while maintaining terminal

strength, solderability and electrical performance.

This technology was developed in order to address the

primary failure mode of MLCCs– flex cracks, which are

typically the result of excessive tensile and shear stresses

produced during board flexure and thermal cycling. Flexible

termination technology inhibits the transfer of board stress

to the rigid ceramic body, therefore mitigating flex cracks

which can result in low IR or short circuit failures.

Although this technology does not eliminate the potential

for mechanical damage that may propagate during extreme

environmental and handling conditions, it does provide

superior flex performance over standard termination

systems. FT-CAP complements KEMET’s Open Mode,

Floating Electrode (FE-CAP), Floating Electrode with

Flexible Termination (FF-CAP), and KEMET Power Solutions

(KPS) product lines by providing a complete portfolio of flex

mitigation solutions.

Combined with the stability of KEMET’s Ultra-Stable high

temperature dielectric technology, these flex-robust devices

are RoHS Compliant, offer up to 5 mm of flex-bend capability

and feature a 150°C maximum operating temperature.

Ultra-Stable X8R dielectric offers the same temperature

capability as conventional X8R, but without the capacitance

loss due to applied DC voltage. These devices exhibit no

change in capacitance with respect to voltage and boast a

minimal change in capacitance with reference to ambient

temperature. They are also suitable replacements for higher

capacitance and larger footprint devices that fail to offer

capacitance stability. Capacitance change with respect to

temperature is limited to ±15% from −55°C to +150°C.

In addition to Commercial Grade, Automotive Grade devices

are available which meet the demanding Automotive

Electronics Council's AEC-Q200 qualification requirements.

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), Ultra-Stable X8R

Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)

Ordering Information

C1206 X104 J 3 H A C AUTO

Ceramic

Case Size

(L" x W")

Specification/

Series

Capacitance

Code (pF)

Capacitance

Tolerance

Reated

Voltage

(VDC)

Dielectric

Failure

Rate/

Design

Termination Finish1

Packaging/

Grade

(C-Spec)

0603

0805

1206

1210

1812

X = Flexible

Termination

Two

significant

digits +

number of

zeros.

B = ±0.10 pF

C = ±0.25 pF

D = ±0.5 pF

F = ±1%

G = ±2%

J = ±5%

K = ±10%

M = ±20%

8 = 10

4 = 16

3 = 25

5 = 50

1 = 100

H = Ultra-

Stable X8R

A =

N/A

C = 100% Matte Sn

L = SnPb (5% Pb minimum)

See

"Packaging

C-Spec

Ordering

Options Table"

below

1 Additional termination finish options may be available. Contact KEMET for details.

1 SnPb termination finish option is not available on Automotive Grade product.

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E‘ecrmmc Compancnls KEIl/IEI' EHARGED! 7411 (HA 0603 and smaller case sizes) 7210 (EIA 0305 and larger case sizes) AUT07411 EIA 0603 and smaller case sizes) AUT07210 EIA 0805 and larger case sizes)

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)

Packaging C-Spec Ordering Options Table

Packaging Type Packaging/Grade

Ordering Code (C-Spec)

Commercial Grade1

Bulk Bag

Not Required (Blank)

7" Reel/Unmarked

13" Reel/Unmarked

7411 (EIA 0603 and smaller case sizes)

7210 (EIA 0805 and larger case sizes)

7" Reel/Unmarked/2 mm pitch

7081

13" Reel/Unmarked/2 mm pitch

7082

Automotive Grade3

7" Reel

AUTO

13" Reel/Unmarked

AUTO7411 (EIA 0603 and smaller case sizes)

AUTO7210 (EIA 0805 and larger case sizes)

7" Reel/Unmarked/2 mm pitch

3190

13" Reel/Unmarked/2 mm pitch

3191

1 Default packaging is “Bulk Bag”. An ordering code C-Spec is not required for “Bulk Bag” packaging.

1 The terms “Marked” and “Unmarked” pertain to laser marking option of capacitors. All packaging options labeled as “Unmarked” will contain

capacitors that have not been laser marked.

2 The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case

size devices. For more information regarding 2 mm pitch option see “Tape & Reel Packaging Information”.

3 Reeling tape options (Paper or Plastic) are dependent on capacitor case size (L” x W”) and thickness dimension. See “Chip Thickness/Tape & Reel

Packaging Quantities” and “Tape & Reel Packaging Information”.

3 For additional Information regarding “AUTO” C-Spec options, see “Automotive C-Spec Information”.

3 All Automotive packaging C-Specs listed exclude the option to laser mark components. Please contact KEMET if you require a laser marked option. For

more information see “Capacitor Marking”.

Benefits

• −55°C to +150°C operating temperature range

• Superior flex performance (up to 5 mm)

• Lead (Pb)-free, RoHS and REACH compliant

• EIA 0603, 0805, 1206, 1210, and 1812 case sizes

• DC voltage ratings of 10 V, 16 V, 25 V, 50 V and 100 V

• Capacitance offerings ranging from 0.5 pF to 0.22 μF

• Available capacitance tolerances of ±0.10 pf, ±0.25 pf,

±0.5 pf, ±1%, ±2%, ±5%,

±10%, and ±20%

• Extremely low ESR and ESL

• High thermal stability

• High ripple current capability

• No capacitance change with respect to applied rated DC

voltage

• Non-polar device, minimizing installation concerns

• Commercial and Automotive (AEC–Q200) grades available

• 100% pure matte tin-plated termination finish allowing for

excellent solderability

• SnPb plated termination finish option available upon

request (5% Pb minimum)

Applications

Typical applications include decoupling, bypass, filtering and transient voltage suppression in critical and safety relevant

circuits without (integrated) current limitation, including those subject to high levels of board flexure or temperature cycling.

ammmc compmm KEIVIEI' crummy:

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)

Automotive C-Spec Information

KEMET Automotive Grade products meet or exceed the requirements outlined by the Automotive Electronics Council.

Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualifi cation for Passive

Components. These products are supported by a Product Change Notifi cation (PCN) and Production Part Approval Process

warrant (PPAP).

Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec,

“AUTO”. This C-Spec was developed in order to better serve small and medium-sized companies that prefer an automotive

grade component without the requirement to submit a customer Source Controlled Drawing (SCD) or specifi cation for review

by a KEMET engineering specialist. This C-Spec is therefore not intended for use by KEMET’s OEM Automotive customers

and are not granted the same “privileges” as other automotive C-Specs. Customer PCN approval and PPAP request levels are

limited (see details below).

Product Change Notifi cation (PCN)

The KEMET Product Change Notifi cation system is used to communicate primarily the following types of changes:

• Product/process changes that affect product form, fi t, function, and/or reliability

• Changes in manufacturing site

• Product obsolescence

KEMET Automotive

C-Spec

Customer Notifi cation due to: Days prior to

implementation

Process/Product change Obsolescence*

KEMET assigned1Yes (with approval and sign off) Yes 180 days minimum

AUTO Yes (without approval) Yes 90 days minimum

1 KEMET assigned C-Specs require the submittal of a customer SCD or customer specifi cation for review. For additional information contact KEMET.

Production Part Approval Process (PPAP)

The purpose of the Production Part Approval Process is:

• To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts.

• To provide the evidence that all customer engineering design record and specifi cation requirements are properly

understood and fulfi lled by the manufacturing organization.

• To demonstrate that the established manufacturing process has the potential to produce the part.

KEMET Automotive

C-Spec

PPAP (Product Part Approval Process) Level

12345

KEMET assigned1●●●●●

AUTO ○ ○

1 KEMET assigned C-Specs require the submittal of a customer SCD or customer specifi cation for review. For additional information contact KEMET.

● Part number specifi c PPAP available

○ Product family PPAP only

ammm Compancnls KEIVIEI' 1211413020: 1.00 (0.003) 0.30 (0.032) 0.45 (0.013) 10.17 (0,007) 10.15 (0.006) 10.15 (0.000) 2.00 (0.079) 1.25 (0.049) 0.50 (0.02) 10.30 (0.012) 10.30 (0.012) 10.25 (0,010) 3.30 (0,130) 1.00 (0.063) 0.00 (0,024) 10.40 (0,010) 10.35 (0.013) 10.25 (0,010) 3.30 (0,130) 2.60 (0.102) 0.00 (0,024) 10.40 (0,010) 10.30 (0.012) 10.25 (0,010) 4.50 (0,170) 3.20 (0.120) 0.70 (0.023) 10.40 (0,010) 10.30 (0.012) 10.35 (0,014)

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)

Dimensions – Millimeters (Inches)

EIA Size

Code

Metric Size

Code

Length

Width T Thickness B

Bandwidth

Separation

Minimum

Mounting

Technique

0603 1608

1.60 (0.063)

±0.17 (0.007)

0.80 (0.032)

±0.15 (0.006)

See Table 2 for

Thickness

0.45 (0.018)

±0.15 (0.006)

0.58 (0.023)

Solder Wave

Solder Reflow

0805 2012

2.00 (0.079)

±0.30 (0.012)

1.25 (0.049)

±0.30 (0.012)

0.50 (0.02)

±0.25 (0.010)

0.75 (0.030)

1206 3216

3.30 (0.130)

±0.40 (0.016)

1.60 (0.063)

±0.35 (0.013)

0.60 (0.024)

±0.25 (0.010)

N/A

1210 3225

3.30 (0.130)

±0.40 (0.016)

2.60 (0.102)

±0.30 (0.012)

0.60 (0.024)

±0.25 (0.010)

Solder Reflow

Only

1812 4532

4.50 (0.178)

±0.40 (0.016)

3.20 (0.126)

±0.30 (0.012)

0.70 (0.028)

±0.35 (0.014)

Qualification/Certification

Commercial Grade products are subject to internal qualification. Details regarding test methods and conditions are

referenced in Table 4, Performance & Reliability.

Automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council. Details

regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualification for Passive

Components. For additional information regarding the Automotive Electronics Council and AEC–Q200, please visit their

website at www.aecouncil.com.

Environmental Compliance

Lead (Pb)-free, RoHS, and REACH compliant without exemptions (excluding SnPb termination finish option).

ammmc compmm KEIVIEI' crummy: 1,000 MU uFor 100 GO 10% of Inmal Limit

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)

Electrical Parameters/Characteristics

Item Parameters/Characteristics

Operating Temperature Range −55°C to +150°C

Capacitance Change with Reference to

+25°C and 0 VDC Applied (TCC) ±15%

Aging Rate (Maximum % Capacitance Loss/Decade Hour) 0%

1Dielectric Withstanding Voltage (DWV)

250% of rated voltage

(5 ±1 seconds and charge/discharge not exceeding 50mA)

2Dissipation Factor (DF) Maximum Limit at 25ºC 2.5%

3Insulation Resistance (IR) Minimum Limit at 25°C

1,000 MΩ µF or 100 GΩ

(Rated voltage applied for 120 ±5 seconds at 25°C)

1 DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the

capacitor.

2 Capacitance and dissipation factor (DF) measured under the following conditions:

1 MHz ±100 kHz and 1.0 ±0.2 Vrms if capacitance ≤ 1,000 pF.

1 kHz ±50 Hz and 1.0 ±0.2 Vrms if capacitance > 1,000 pF.

3 To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.

Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 & Agilent E4980 have a feature known as

Automatic Level Control (ALC). The ALC feature should be switched to "ON".

Post Environmental Limits

High Temperature Life, Biased Humidity, Moisture Resistance

Dielectric Rated DC

Voltage

Capacitance

Value

Dissipation Factor

(Maximum %)

Capacitance

Shift

Insulation

Resistance

Ultra-Stable X8R All All 3.0 0.3% or ±0.25 pF

10% of Initial

Limit

ammmc compmm KEIVIEI' crummy: PmductAv lah See Packaging Spa .qu and c Thickness cs m Chip Thickness m Codes mansions

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)

Table 1A – Capacitance Range/Selection Waterfall (0603 – 1812 Case Sizes)

Capacitance Cap

Code

Case Size/Series C0603C C0805C C1206C C1210C C1812C

Voltage Code 8 4 3 5 1 8 4 3 5 1 8 4 3 5 1 8 4 3 5 1 5 1

RatedVoltage (VDC)

100

Capacitance Tolerance

Product Availability and Chip Thickness Codes

See Packaging Specs for Chip Thickness Dimensions

0.50 & 0.75 pF 508 & 758 B C D CJ CJ CJ CJ CJ DR DR DR DR DR

0.75 pF 758 B C D CJ CJ CJ CJ CJ DR DR DR DR DR

1.0 - 9.1 pF* 109 - 919* B C D CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

1.1 pF 119 B C D CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

1.2 pF 129 B C D CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

1.3 pF 139 B C D CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

1.5 pF 159 B C D CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

1.6 pF 169 B C D CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

1.8 pF 189 B C D CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

2.0 pF 209 B C D CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

2.2 pF 229 B C D CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

2.4 pF 249 B C D CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

2.7 pF 279 B C D CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

3.0 pF 309 B C D CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

3.3 pF 339 B C D CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

3.6 pF 369 B C D CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

3.9 pF 399 B C D CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

4.3 pF 439 B C D CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

4.7 pF 479 B C D CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

5.1 pF 519 B C D CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

5.6 pF 569 B C D CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

6.2 pF 629 B C D CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

6.8 pF 689 B C D CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

7.5 pF 759 B C D CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

8.2 pF 829 B C D CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

9.1 pF 919 B C D CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

10 pF 100 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

11 pF 110 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

12 pF 120 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

13 pF 130 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

15 pF 150 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

16 pF 160 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

18 pF 180 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

20 pF200 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

22 pF 220 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

24 pF 240 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

27 pF 270 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

30 pF 300 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

33 pF 330 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

36 pF 360 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

39 pF 390 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

43 pF 430 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

47 pF 470 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

51 pF 510 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

56 pF 560 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

62 pF 620 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

68 pF 680 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

75 pF 750 FG J K M CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

82 pF820 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

91 pF 910 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

100 pF 101 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

110 pF 111 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

120 pF 121 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

130 pF 131 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

150 pF 151 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

160 pF 161 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

180 pF 181 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

200 pF 201 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

Capacitance Cap

Code

Rated Voltage (VDC)

100

Voltage Code 8 4 3 5 1 8 4 3 5 1 8 4 3 5 1 8 4 3 5 1 5 1

Case Size/Series C0603C C0805C C1206C C1210C C1812C

ammmc compmm KEIVIEI' crummy: PmductAv lah See Packaging Spa .qu and c Thickness cs m Chip Thickness m Codes mansions

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)

Table 1A – Capacitance Range/Selection Waterfall (0603 – 1812 Case Sizes) cont'd

Capacitance Cap

Code

Case Size/Series C0603C C0805C C1206C C1210C C1812C

Voltage Code 8 4 3 5 1 8 4 3 5 1 8 4 3 5 1 8 4 3 5 1 5 1

RatedVoltage (VDC)

100

Capacitance Tolerance

Product Availability and Chip Thickness Codes

See Packaging Specs for Chip Thickness Dimensions

220 pF 221 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

240 pF 241 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

270 pF 271 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

300 pF 301 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

330 pF 331 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

360 pF 361 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

390 pF 391 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

430 pF 431 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN

470 pF 471 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN GB GB

510 pF 511 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN GB GB

560 pF 561 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN GB GB

620 pF 621 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN GB GB

680 pF 681 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN GB GB

750 pF 751 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN GB GB

820 pF 821 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN GB GB

910 pF 911 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DD EQ EQ EQ EQ EQ FN FN FN FN FN GB GB

1,000 pF 102 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DD EQ EQ EQ EQ EQ FN FN FN FN FN GB GB

1,100 pF 112 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN GB GB

1,200 pF 122 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FN GB GB

1,300 pF 132 F G J K M CJ CJ CJ CJ CJ DD DD DD DD DD EQ EQ EQ EQ ER FN FN FN FN FN GB GB

1,500 pF 152 F G J K M CJ CJ CJ CJ CJ DD DD DD DD DD EQ EQ EQ EQ ES FN FN FN FN FN GB GB

1,600 pF 162 F G J K M CJ CJ CJ CJ CJ DD DD DD DD DD EQ EQ EQ EQ ES FN FN FN FN FN GB GB

1,800 pF 182 F G J K M CJ CJ CJ CJ CJ DD DD DD DD DD EQ EQ EQ EQ ES FN FN FN FN FN GB GB

2,000 pF 202 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ ES FN FN FN FN FQ GB GB

2,200 pF 222 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ ET FN FN FN FN FQ GB GB

2,400 pF 242 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ ER FN FN FN FN FQ

2,700 pF 272 F G J K M CJ CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ ER FN FN FN FN FQ GB GB

3,000 pF 302 F G J K M CJ CJ CJ CJ CJ DD DD DR DR DR ER ER ER ER ER FN FN FN FN FQ

3,300 pF 332 F G J K M CJ CJ CJ CJ CJ DD DD DR DR DR ER ER ER ER ET FN FN FN FN FA GB GB

3,600 pF 362 F G J K M CJ CJ CJ CJ CJ DD DD DR DR DR ER ER ER ER ET FN FN FN FN FA

3,900 pF 392 F G J K M CJ CJ CJ CJ CJ DS DS DR DR DR ER ER ER ER EF FN FN FN FN FA GB GB

4,300 pF 432 F G J K M CJ CJ CJ CJ CJ DS DS DR DR DR ER ER ER ER ER FN FN FN FN FA

4,700 pF 472 F G J K M CJ CJ CJ CJ CJ DS DS DR DR DR ER ER ER ER ER FA FA FA FA FZ GB GB

5,100 pF 512 F G J K M CJ CJ CJ CJ DS DS DR DR DR ES ES ES ES ES FN FN FN FN FZ

5,600 pF 562 F G J K M CJ CJ CJ CJ DR DR DR DR DR ES ES ES ES ES FN FN FN FN FZ GB GB

6,200 pF 622 F G J K M CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FZ

6,800 pF 682 F G J K M CJ CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FN FN FN FN FZ GB GB

7,500 pF 752 F G J K M CJ CJ CJ DR DR DR DR DR EQ EQ EQ EQ EQ FQ FQ FQ FQ FQ

8,200 pF 822 F G J K M CJ CJ CJ DR DR DR DR DR ER ER EQ EQ EQ FQ FQ FQ FQ FQ GB GH

9,100 pF 912 F G J K M CJ CJ CJ DR DR DR DR DR ER ER EQ EQ EQ FE FE FE FE FE

10,000 pF 103 F G J K M CJ CJ CJ DR DR DR DR DD EQ EQ EQ EQ EQ FA FA FA FA FA GB GH

12,000 pF 123 F G J K M DR DR DR DR DS EQ EQ EQ EQ EQ FN FN FN FN FN GB GG

15,000 pF 153 F G J K M DR DR DR DD DG EQ EQ EQ EQ EQ FN FN FN FN FN GB GB

18,000 pF 183 F G J K M DR DR DR DD EQ EQ EQ EQ EQ FN FN FN FN FN GB GB

22,000 pF 223 F G J K M DD DD DD DF EQ EQ EQ EQ ER FN FN FN FN FN GB GB

27,000 pF 273 F G J K M DF DF DF EQ EQ EQ EQ ET FN FN FN FN FN GB GB

33,000 pF 333 F G J K M DG DG DG EQ EQ EQ EQ ET FN FN FN FN FN GB GB

47,000 pF 473 F G J K M ER ER ER ET EH FN FN FN FN FE GB GB

56,000 pF 563 F G J K M ES ES ES EF EH FN FN FN FN FA GB GB

68,000 pF 683 F G J K M EF EF EF EH FN FN FN FQ FZ GB GB

82,000 pF 823 F G J K M EH EH EH EH FQ FQ FQ FA FU GB GB

100,000 pF 104 F G J K M EH EH EH FE FE FE FZ FM GB GD

120,000 pF 124 F G J K M FZ FZ FZ FU GB GH

150,000 pF 154 F G J K M FU FU FU FM GD GN

180,000 pF 184 F G J K M FJ FJ FJ GH

220,000 pF 224 F G J K M GK

Capacitance Cap

Code

Rated Voltage (VDC)

100

Voltage Code 8 4 3 5 1 8 4 3 5 1 8 4 3 5 1 8 4 3 5 1 5 1

Case Size/Series C0603C C0805C C1206C C1210C C1812C

ammm Compancnls KEIVIEI' Emma): CJ DR DD 08 DF 06 E0 ER ES ET EF EH FN FQ FE FA FZ EU FM FJ GB GD GH GE GK SN 0608 0805 0805 0805 0805 0805 1206 1206 1206 1206 1206 1206 1210 1210 1210 1210 1210 1210 1210 1210 1812 1812 1812 1812 1812 1812 0.80 10.15" 0.73 x0.20 0.90 10.10 1.00 x0.20 1.10 10.10 1.25 30.15 0 78 30.20 0 90 30.20 1.00 30.20 1.10 30.20 1.20 10.15 1.60 10.20 0.73 x0.20 0.90 x0.20 1.00 10.10 1.10 30.15 1.25 30.20 1.55 10.20 1.70 10 20 1.85 10.20 1.00 10.10 1.25 10.15 1.40 10.15 1.55 10.10 1.60 10.20 1.70 10 20 4,000 o o ooooooooooooooooooocooooo 15,000 5: ooooooooooooooooooooooooo 4,000 4,000 2,500 2,500 2,500 4,000 4,000 2,500 2,500 2,500 2,000 4,000 4,000 2,500 2,500 2,500 2,000 2,000 2,000 1,000 1,000 1,000 1,000 1,000 1,000 10,000 10,000 10,000 10,000 10,000 10,000 10,000 10,000 10,000 10,000 8,000 10,000 10,000 10,000 10,000 10,000 8,000 8,000 8,000 4,000 4,000 4,000 4,000 4,000 4,000

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)

Table 2A – Chip Thickness/Tape & Reel Packaging Quantities

Thickness

Code

Case

Size1

Thickness ±

Range (mm)

Paper Quantity1Plastic Quantity

7" Reel 13" Reel 7" Reel 13" Reel

0603

0.80 ±0.15*

4,000

15,000

0805

0.78 ±0.20

4,000

10,000

0805

0.90 ±0.10

4,000

10,000

0805

1.00 ±0.20

2,500

10,000

0805

1.10 ±0.10

2,500

10,000

0805

1.25 ±0.15

2,500

10,000

1206

0.78 ±0.20

4,000

10,000

4,000

10,000

1206

0.90 ±0.20

4,000

10,000

1206

1.00 ±0.20

2,500

10,000

1206

1.10 ±0.20

2,500

10,000

1206

1.20 ±0.15

2,500

10,000

1206

1.60 ±0.20

2,000

8,000

1210

0.78 ±0.20

4,000

10,000

1210

0.90 ±0.20

4,000

10,000

1210

1.00 ±0.10

2,500

10,000

1210

1.10 ±0.15

2,500

10,000

1210

1.25 ±0.20

2,500

10,000

1210

1.55 ±0.20

2,000

8,000

1210

1.70 ±0.20

2,000

8,000

1210

1.85 ±0.20

2,000

8,000

1812

1.00 ±0.10

1,000

4,000

1812

1.25 ±0.15

1,000

4,000

1812

1.40 ±0.15

1,000

4,000

1812

1.55 ±0.10

1,000

4,000

1812

1.60 ±0.20

1,000

4,000

1812

1.70 ±0.20

1,000

4,000

Thickness

Code

Case

Size1

Thickness ±

Range (mm)

7" Reel 13" Reel 7" Reel 13" Reel

Paper Quantity1Plastic Quantity

Package quantity based on finished chip thickness specifications.

1 If ordering using the 2 mm Tape and Reel pitch option, the packaging quantity outlined in the table above will be doubled. This option is limited to EIA

0603 (1608 metric) case size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information".

ammmc compmm KEIVIEI' crummy:

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)

Table 2B – Bulk Packaging Quantities

Packaging Type Loose Packaging

Bulk Bag (default)

Packaging C-Spec1N/A2

Case Size Packaging Quantities (pieces/unit packaging)

EIA (in) Metric (mm) Minimum Maximum

0402

1005

50,000

0603

1608

0805

2012

1206

3216

1210

3225

1808

4520

20,000

1812

4532

1825

4564

2220

5650

2225

5664

1 The "Packaging C-Spec" is a 4 to 8 digit code which identifies the packaging type and/or product grade. When ordering, the proper code must be

included in the 15th through 22nd character positions of the ordering code. See "Ordering Information" section of this document for further details.

Commercial grade product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging. Contact KEMET if you require a bulk

bag packaging option for Automotive grade products.

2 A packaging C-Spec (see note 1 above) is not required for "Bulk Bag" packaging (excluding Anti-Static Bulk Bag and automotive grade products). The

15th through 22nd character positions of the ordering code should be left blank. All products ordered without a packaging C-Spec will default to our

standard "Bulk Bag" packaging.

E‘ucuomc Compcnonu K CHARGED!

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)

Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351 (mm)

EIA

Size

Code

Metric

Size

Code

Density Level A:

Maximum (Most)

Land Protrusion (mm)

Density Level B:

Median (Nominal)

Land Protrusion (mm)

Density Level C:

Minimum (Least)

Land Protrusion (mm)

C Y X V1 V2 C Y X V1 V2 C Y X V1 V2

0603 1608 0.85 1.25 1.10 4.00 2.10 0.75 1.05 1.00 3.10 1.50 0.65 0.85 0.90 2.40 1.20

0805 2012 0.99 1.44 1.66 4.47 2.71 0.89 1.24 1.56 3.57 2.11 0.79 1.04 1.46 2.42 1.81

1206 3216 1.59 1.62 2.06 5.85 3.06 1.49 1.42 1.96 4.95 2.46 1.39 1.22 1.86 4.25 2.16

1210 3225 1.59 1.62 3.01 5.90 4.01 1.49 1.42 2.91 4.95 3.41 1.39 1.22 2.81 4.25 3.11

1812 4532 2.10 1.80 3.60 7.00 4.60 2.00 1.60 3.50 6.10 4.00 1.90 1.40 3.40 5.40 3.70

Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow

solder processes. KEMET only recommends wave soldering of EIA 0603, 0805, and 1206 case sizes.

Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.

Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform

qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).

Image below based on Density Level B for an EIA 1210 case size.

C C

X X

Grid Placement Courtyard

cccccccccccccccccccc Emma):

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)

Soldering Process

Recommended Soldering Technique:

• Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206

• All other EIA case sizes are limited to solder reflow only

Recommended Reflow Soldering Profile:

KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual),

convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal

stress. KEMET’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/J-

STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes at

these conditions.

Profile Feature Termination Finish

SnPb 100% Matte Sn

Preheat/Soak

Temperature Minimum (TSmin)

100°C

150°C

Temperature Maximum (T

Smax

)150°C 200°C

Time (tS) from TSmin to TSmax

60 – 120 seconds

Ramp-Up Rate (TL to TP)3°C/second

maximum

3°C/second

maximum

Liquidous Temperature (TL)183°C 217°C

Time Above Liquidous (tL) 60 – 150 seconds 60 – 150 seconds

Peak Temperature (TP)235°C 260°C

Time Within 5°C of Maximum

Peak Temperature (t

)

20 seconds

maximum

30 seconds

maximum

Ramp-Down Rate (TP to TL)6°C/second

maximum

6°C/second

maximum

Time 25°C to Peak

Temperature

6 minutes

maximum

8 minutes

maximum

Note: All temperatures refer to the center of the package, measured on the

capacitor body surface that is facing up during assembly reflow.

Time

Temperature

Tsmin

Tsmax

TPMaximum Ramp Up Rate = 3°C/second

Maximum Ramp Down Rate = 6°C/second

25°C to Peak

Electronic Componcnls KEIl/IEI' mmmzo: Appendix 2, Note: Standard termination system 7 2.0 mm (minimum) for all except 3 mm for CBS. Flexible termination system 7 3.0 mm (minimum). Load humidity: 1,000 hours BS”C/05%RH and rated voltage. Add 100K ohm resistor. Measurement at 24 hours 24 hours aitertest conclusion. Low volt humidity: 1,000 hours EST/55% RH and 1.5 V. Add 100 K ohm resistor. Measurement at 24 hours 24 hours aitertest conclusion. M|L7STD7ZDZ Method 106 t = 24 hours/cycle. Steps 7a and 7b not required. Measurement at 24 hours. 14 hours alter M|L7STD7ZDZ Method 107 755"C/+150. Note: Number of cycles required 7 300, Maximum transfer time 7 20 seconds. M|L7STD7ZDZ Method 108/EIA7198 M|L7STD7ZDZ Method 103 5 g‘s lor 20 minutes, 12 cycles each ol 3 orientations. Note: Use 5" X 5" PCB 0.031" thick 7 secure points on one long side and 2 secure points at corners of mounted Within 2" from any secure point, Test from 10 7 2,000 Hz. M|L7STD7ZDZ Method 213 M|L7STD7ZDZ Method 215

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)

Table 4 – Performance & Reliability: Test Methods & Conditions

Stress Reference Test or Inspection Method

Terminal Strength JIS–C–6429 Appendix 1, Note: Force of 1.8 kg for 60 seconds.

Board Flex JIS–C–6429

Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm

for C0G. Flexible termination system – 3.0 mm (minimum).

Solderability J–STD–002

Magnification 50 X. Conditions:

a) Method B, 4 hours at 155°C, dry heat at 235°C

b) Method B at 215°C category 3

c) Method D, category 3 at 260°C

Temperature Cycling JESD22 Method JA–104 1,000 cycles (−55°C to +150°C). Measurement at 24 hours ±4 hours after test conclusion.

Biased Humidity MIL–STD–202 Method

103

Load humidity: 1,000 hours 85°C/85%RH and rated voltage. Add 100K ohm resistor.

Measurement at 24 hours ±4 hours after test conclusion.

Low volt humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor.

Measurement at 24 hours ±4 hours after test conclusion.

Moisture Resistance

MIL–STD–202 Method

106

t = 24 hours/cycle. Steps 7a and 7b not required. Measurement at 24 hours. ±4 hours after

test conclusion.

Thermal Shock

MIL–STD–202 Method

107

−55°C/+150. Note: Number of cycles required – 300. Maximum transfer time – 20 seconds.

Dwell time – 15 minutes. Air – Air.

High Temperature Life

MIL–STD–202 Method

108/EIA–198

1,000 hours at 150°C with 2 X rated voltage applied.

Storage Life

MIL–STD–202 Method

108

150°C, 0 VDC for 1,000 hours.

Vibration MIL–STD–202 Method

204

5 g's for 20 minutes, 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick

7 secure points on one long side and 2 secure points at corners of opposite sides. Parts

mounted within 2" from any secure point. Test from 10 – 2,000 Hz.

Mechanical Shock

MIL–STD–202 Method

213

Figure 1 of Method 213, Condition F.

Resistance to Solvents

MIL–STD–202 Method

215

Add aqueous wash chemical, OKEM Clean or equivalent.

Storage & Handling

Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in

other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,

and long term storage. In addition, packaging materials will be degraded by high temperature – reels may soften or warp

and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum

storage humidity not exceed 70% relative humidity. Temperature fluctuations should be minimized to avoid condensation on

the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock

should be used promptly, preferably within 1.5 years of receipt.

.................... CHARGED!

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)

Construction

Detailed Cross Section

Inner Electrodes

(Ni)

Barrier Layer

(Ni)

Epoxy Layer

(Ag)

End Termination/

External Electrode

(Cu)

Barrier Layer

(Ni)

Epoxy Layer

(Ag)

End Termination/

External Electrode

(Cu)

Inner Electrodes

(Ni)

Termination Finish

(100% Matte

Sn/SnPb

–5% Pb min)

Termination Finish

(100% Matte

Sn/SnPb–5% Pb min)

Dielectric Material

(CaZrO3)

Dielectric Material

(CaZrO3)

Capacitor Marking (Optional):

Laser marking option is not available on:

• C0G, Ultra Stable X8R and Y5V dielectric devices.

• EIA 0402 case size devices.

• EIA 0603 case size devices with Flexible Termination option.

• KPS Commercial and Automotive grade stacked devices.

These capacitors are supplied unmarked only.

ammm Compancnls KEIVIEI' Emma): 0116 mm Camer Tape 73 mm (7 wt KPS1812 and 2220 Ana 0508 an 0612

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)

Tape & Reel Packaging Information

KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with

EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for

details on reeling quantities for commercial chips.

8 mm, 12 mm

or 16 mm Carrier Tape

178 mm (7.00")

330 mm (13.00")

Anti-Static Reel

Embossed Plastic* or

Punched Paper Carrier.

Embossment or Punched Cavity

Anti-Static Cover Tape

(.10 mm (.004") Maximum Thickness)

Chip and KPS Orientation in Pocket

(except 1825 Commercial, and 1825 and 2225 Military)

*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.

KEMET

Bar Code Label

Sprocket Holes

Table 5 – Carrier Tape Confi guration, Embossed Plastic & Punched Paper (mm)

EIA Case Size

Tape

Size

(W)*

Embossed Plastic Punched Paper

7" Reel 13" Reel 7" Reel 13" Reel

Pitch (P

)* Pitch (P

01005 – 0402 8 2 2

0603 82/4 2/4

0805 84444

1206 – 1210 84444

1805 – 1808 12 4 4

≥ 1812 12 8 8

KPS 1210 12 8 8

KPS 1812

and 2220

16 12 12

Array 0508

and 0612

844

*Refer to Figures 1 and 2 for W and P1 carrier tape reference locations.

*Refer to Tables 6 and 7 for tolerance specifi cations.

New 2 mm Pitch Reel Options*

Packaging

Ordering Code

(C-Spec)

Packaging Type/Options

C-3190

Automotive grade 7" reel unmarked

C-3191

Automotive grade 13" reel unmarked

C-7081

Commercial grade 7" reel unmarked

C-7082

Commercial grade 13" reel unmarked

* 2 mm pitch reel only available for 0603 EIA case size.

2 mm pitch reel for 0805 EIA case size under development.

Benefi ts of Changing from 4 mm to 2 mm Pitching Spacing

• Lower placement costs.

• Double the parts on each reel results in fewer reel

changes and increased eﬃ ciency.

• Fewer reels result in lower packaging, shipping and

storage costs, reducing waste.

Eiecxmmc Compancnls KEIVIEI' EHARGED: c mum: DY Minimum R Reierence SY Minimum T T‘ Note 1 Note 2 Note 3 Maximum Maximum i3Y Maximum E2 T2 W Nole4 Minimum Maximum Maximum

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)

Figure 1 – Embossed (Plastic) Carrier Tape Dimensions

Center Lines of Cavity

User Direction of Unreeling

Cover Tape

is for tape feeder reference only,

including draft concentric about Bo.

ØD

ØDo

Embossment

For cavity size,

see Note 1 Table 4

[10 pitches cumulative

tolerance on tape ±0.2 mm]

Table 6 – Embossed (Plastic) Carrier Tape Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

Tape Size D0

Minimum

Note 1

E1P0 P2

R Reference

Note 2

Minimum

Note 3

Maximum

8 mm

1.5 +0.10/−0.0

(0.059 +0.004/−0.0)

1.0

(0.039)

1.75 ±0.10

(0.069 ±0.004) 4.0 ±0.10

(0.157 ±0.004) 2.0 ±0.05

(0.079 ±0.002)

25.0

(0.984)

0.600

(0.024) 0.600

(0.024) 0.100

(0.004)

12 mm 1.5

(0.059) 30

(1.181)

16 mm

Variable Dimensions — Millimeters (Inches)

Tape Size Pitch

Maximum

Note 4

Minimum

F P1

Maximum

A0,B0 & K0

8 mm Single (4 mm)

4.35

(0.171)

6.25

(0.246)

3.5 ±0.05

(0.138 ±0.002)

4.0 ±0.10

(0.157 ±0.004)

2.5

(0.098)

8.3

(0.327)

Note 512 mm Single (4 mm)

and Double (8 mm)

8.2

(0.323)

10.25

(0.404)

5.5 ±0.05

(0.217 ±0.002)

8.0 ±0.10

(0.315 ±0.004)

4.6

(0.181)

12.3

(0.484)

16 mm Triple (12 mm)

12.1

(0.476)

14.25

(0.561)

7.5 ±0.05

(0.138 ±0.002)

12.0 ±0.10

(0.157 ±0.004)

4.6

(0.181)

16.3

(0.642)

1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment

location and hole location shall be applied independent of each other.

2. The tape with or without components shall pass around R without damage (see Figure 6).

3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b).

4. B1 dimension is a reference dimension for tape feeder clearance only.

5. The cavity defi ned by A0, B0 and K0 shall surround the component with suﬃ cient clearance that:

(a) the component does not protrude above the top surface of the carrier tape.

(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.

(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3).

(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see

Figure 4).

(e) for KPS product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.

(f) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.

ammm Compancnls KEIVI mam): T - V 1 f ¢¢§9 W \ +7: Tiiﬁ‘eri / #4 j/ l ‘X J x — RRefevence NmeZ 0.10 (0.004) Maximum (0.3%i%%%2) (0237) 4.0 10.10 3.3 (0.157 :a 004) (0.327)

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)

Figure 2 – Punched (Paper) Carrier Tape Dimensions

User Direction of Unreeling

Top Cover Tape

Center Lines of Cavity

ØDo Po E1

E2W

Cavity Size,

See

Note 1, Table 7

Bottom Cover Tape

[10 pitches cumulative

tolerance on tape ±0.2 mm]

Table 7 – Punched (Paper) Carrier Tape Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

Tape Size D

Maximum G Minimum

R Reference

Note 2

8 mm 1.5 +0.10 -0.0

(0.059 +0.004 -0.0) 1.75 ±0.10

(0.069 ±0.004) 4.0 ±0.10

(0.157 ±0.004) 2.0 ±0.05

(0.079 ±0.002)

0.10

(0.004)

Maximum

0.75

(0.030) 25

(0.984)

Variable Dimensions — Millimeters (Inches)

Tape Size Pitch E2 Minimum F P1 T Maximum W Maximum A0 B0

8 mm Half (2 mm) 6.25

(0.246) 3.5 ±0.05

(0.138 ±0.002)

2.0 ±0.05

(0.079 ±0.002)

1.1

(0.098)

8.3

(0.327)

Note 1

8 mm Single (4 mm)

4.0 ±0.10

(0.157 ±0.004)

8.3

(0.327)

1. The cavity defi ned by A0, B0 and T shall surround the component with suﬃ cient clearance that:

a) the component does not protrude beyond either surface of the carrier tape.

b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.

c) rotation of the component is limited to 20° maximum (see Figure 3).

d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).

e) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.

2. The tape with or without components shall pass around R without damage (see Figure 6).

cccccccccccccccccccc Emma): e 7/////////////////////l‘ e O @379

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)

Packaging Information Performance Notes

1. Cover Tape Break Force: 1.0 kg minimum.

2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:

Tape Width Peel Strength

8 mm 0.1 to 1.0 Newton (10 to 100 gf)

12 and 16 mm 0.1 to 1.3 Newton (10 to 130 gf)

The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be

165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of

300 ±10 mm/minute.

3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA

Standards 556 and 624.

Figure 3 – Maximum Component Rotation

Maximum Component Rotation

Top View

Maximum Component Rotation

Side View

Tape Maximum

Width (mm) Rotation (°

8,12 20

16 – 200 10 Tape Maximum

Width (mm) Rotation ( °

8,12 20

16 – 56 10

72 – 200 5

Typical Pocket Centerline

Typical Component Centerline

Figure 4 – Maximum Lateral Movement

0.5 mm maximum

8 mm & 12 mm Tape

1.0 mm maximum

16 mm Tape

Figure 5 – Bending Radius

Bending

Radius

Embossed

Carrier

Punched

Carrier

ammm Compancnls KEIVIEI' Emma): 0.4 mes/+0.0 (0331 +0 059400) 12.4 +2 0/00 (0.40:; +0 070/0 0) 15.4 +2.0/+0.0 (0.646 +0 070/0 0) 14.4 (0 567) 10.4 (0.724) 22.4 (0 882)

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)

Figure 6 – Reel Dimensions

AD(See Note)

Full Radius,

See Note

B(see Note)

Access Hole at

Slot Location

(Ø 40 mm minimum)

If present,

tape slot in core

for tape start:

2.5 mm minimum width x

10.0 mm minimum depth

W3 (Includes

flange distortion

at outer edge)

W2 (Measured at hub)

W1 (Measured at hub)

(Arbor hole

diameter)

Note: Drive spokes optional; if used, dimensions B and D shall apply.

Table 8 – Reel Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

Tape Size A B Minimum CD Minimum

8 mm 178 ±0.20

(7.008 ±0.008)

330 ±0.20

(13.000 ±0.008)

1.5

(0.059) 13.0 +0.5/−0.2

(0.521 +0.02/−0.008) 20.2

(0.795)

12 mm

16 mm

Variable Dimensions — Millimeters (Inches)

Tape Size N Minimum W1 W2 Maximum W3

8 mm

(1.969)

8.4 +1.5/−0.0

(0.331 +0.059/−0.0)

14.4

(0.567)

Shall accommodate tape

width without interference

12 mm

12.4 +2.0/−0.0

(0.488 +0.078/−0.0)

18.4

(0.724)

16 mm

16.4 +2.0/−0.0

(0.646 +0.078/−0.0)

22.4

(0.882)

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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)

Figure 7 – Tape Leader & Trailer Dimensions

Trailer

160 mm Minimum

Carrier Tape

END START

Round Sprocket Holes

Elongated Sprocket Holes

(32 mm tape and wider)

Top Cover Tape

Punched Carrier

8 mm & 12 mm only

Embossed Carrier

Components

100 mm

Minimum Leader

400 mm Minimum

Figure 8 – Maximum Camber

Carrier Tape

Round Sprocket Holes

1 mm maximum, either direction

Straight Edge

250 mm

Elongated Sprocket Holes

(32 mm & wider tapes)

ammm Compancnls KEIVIEI' cumin:

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Flexible Termination System (FT-CAP), Ultra-Stable X8R Dielectric, 10 – 100 VDC (Commercial & Automotive Grade)

KEMET Electronics Corporation Sales Oﬃ ces

For a complete list of our global sales oﬃ ces, please visit www.kemet.com/sales.

Disclaimer

All product specifi cations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for

checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed.

All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.

Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such

applications, but are not intended to constitute – and KEMET specifi cally disclaims – any warranty concerning suitability for a specifi c customer application or use.

The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any

technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no

obligation or liability for the advice given or results obtained.

Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component

failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards

(such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or

property damage.

Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other

measures may not be required.

KEMET is a registered trademark of KEMET Electronics Corporation.

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