HLMP-EL,EH,EDxx Datasheet by Broadcom Limited

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Description
Precision Optical Performance AlInGaP II (aluminum indi-
um gallium phosphide) LEDs offer superior light output
for excellent readability in sunlight and dependable per-
formance. The AlInGaP II technology provides extremely
stable light output over long periods of time.
These LED lamps are untinted, nondiffused, T-13/4 pack-
ages incorporating second generation optics which pro-
duce well defined radiation patterns at specific viewing
cone angles.
These lamps are made with an advanced optical grade
epoxy offering superior high temperature and high
moisture resistance performance in outdoor signal and
sign applications. The maximum LED junction tempera-
ture limit of +130°C enables high temperature operation
in bright sunlight conditions. The epoxy contains both
uv-a and uv-b inhibitors to reduce the effects of long
term exposure to direct sunlight.
Benefits
Viewing angles match traffic management require-
ments
Colors meet automotive and traffic signal specifica-
tions
Superior light output performance in outdoor environ-
ments
Suitable for autoinsertion into PC boards
Features
Well defined spatial radiation patterns
Viewing angles: 15°, 23°, 30°
High luminous output
Colors:
592 nm Amber
617 nm Reddish-Orange
630 nm Red
High operating temperature:
TJLED = +130°C
Superior resistance to moisture
Applications
Traffic management:
Traffic signals
Work zone warning lights
Variable message signs
Commercial outdoor advertising:
Signs
Marquees
Automotive:
Exterior and interior lights
HLMP-ELxx, HLMP-EHxx, HLMP-EDxx
Precision Optical Performance AlInGaP II LED Lamps
Data Sheet
2
T-13/4 (5 mm) Precision Optical Performance AlInGaP II LED Lamps
Selection Guide
Typical Viewing
Angle
2q1/2
(Deg.)[2]
Color and
Dominant
Wavelength
(nm), Typ.[1]
Lamps Without Standoffs
(Outline Drawing A)
Lamps With Standoffs
(Outline Drawing B)
Luminous
Intensity Iv (mcd) [3,4,5]
@ I(f) = 20 mA
Min. Max.
15°Amber 592 HLMP-EL16-S0000 HLMP-EL18-S0000 1900
HLMP-EL16-TW000 2500 7200
HLMP-EL16-UX000 HLMP-EL18-UX000 3200 9300
HLMP-EL16-UXR00 3200 9300
HLMP-EL16-VW000 4200 7200
HLMP-EL16-VX400 7200 21000
HLMP-EL16-VY000 HLMP-EL18-VY000 4200 12000
HLMP-EL16-VYR00 HLMP-EL18-VYR00 4200 12000
HLMP-EL16-VYK00 4200 12000
HLMP-EL16-VYS00 HLMP-EL18-VYS00 4200 12000
Red-Orange 617 HLMP-EH16-TW000 2500 7200
HLMP-EH16-UX000 HLMP-EH18-UX000 3200 9300
HLMP-EH16-VX0DD 4200 9300
Red 630 HLMP-ED16-S0000 HLMP-ED18-S0000 1900
HLMP-ED16-TW000 HLMP-ED18-TW000 2500 7200
HLMP-ED18-TWT00 2500 7200
HLMP-ED16-UX000 HLMP-ED18-UX000 3200 9300
HLMP-ED16-UXT00 HLMP-ED18-UXT00 3200 9300
HLMP-ED16-VX000 HLMP-ED18-VX000 4200 9300
Notes:
1. Dominant Wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
2. q1/2 is the off-axis angle where the luminous intensity is one half the on-axis intensity.
3. The luminous intensity is measured on the mechanical axis of the lamp package.
4. The optical axis is closely aligned with the package mechanical axis.
5. Tolerance for each intensity bin limit is ± 15%.
3
T-13/4 (5 mm) Precision Optical Performance AlInGaP II Led Lamps (Continued)
Selection Guide
Typical Viewing
Angle
2q1/2
(Deg.)[2]
Color and
Dominant
Wavelength
(nm), Typ.[1]
Lamps Without Standoffs
(Outline Drawing A)
Lamps With Standoffs
(Outline Drawing B)
Luminous
Intensity Iv (mcd) [3,4,5]
@ I(f) = 20 mA
Min. Max.
23°Amber 592 HLMP-EL25-Q0000 HLMP-EL27-Q0000 1150
HLMP-EL27-QTR00 1150 3200
HLMP-EL25-RU000 HLMP-EL27-RU000 1500 4200
HLMP-EL25-SU000 1900 4200
HLMP-EL25-SVK00 1900 5500
HLMP-EL25-SV000 HLMP-EL27-SV000 1900 5500
HLMP-EL25-SVR00 HLMP-EL27-SVR00 1900 5500
HLMP-EL25-TW000 HLMP-EL27-TW000 2500 7200
HLMP-EL25-TWR00 HLMP-EL27-TWR00 2500 7200
HLMP-EL25-TWK00 2500 7200
HLMP-EL25-TWS00 2500 7200
HLMP-EL25-UX000 3200 9300
Red-Orange 617 HLMP-EH25-QT000 HLMP-EH27-QT000 1150 3200
HLMP-EH25-SV000 1900 5500
HLMP-EH25-TW000 HLMP-EH27-TW000 2500 7200
Red 630 HLMP-ED25-RU000 3200 9300
HLMP-ED25-RUT00 3200 9300
HLMP-ED25-SV000 HLMP-ED27-SV000 1900 5500
HLMP-ED25-TW000 HLMP-ED27-TW000 2500 7200
HLMP-ED25-TWT00 HLMP-ED27-TWT00 2500 7200
Notes:
1. Dominant Wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
2. q1/2 is the off-axis angle where the luminous intensity is one half the on-axis intensity.
3. The luminous intensity is measured on the mechanical axis of the lamp package.
4. The optical axis is closely aligned with the package mechanical axis.
5. Tolerance for each intensity bin limit is ± 15%.
4
T-13/4 (5 mm) Precision Optical Performance AlInGaP II Led Lamps (Continued)
Selection Guide
Typical Viewing
Angle
2q1/2
(Deg.)[2]
Color and
Dominant
Wavelength
(nm), Typ.[1]
Lamps Without Standoffs
(Outline Drawing A)
Lamps With Standoffs
(Outline Drawing B)
Luminous
Intensity Iv (mcd) [3,4,5]
@ I(f) = 20 mA
Min. Max.
30°Amber 592 HLMP-EL31-P0000 880
HLMP-EL31-QT000 HLMP-EL33-QT000 1150 3200
HLMP-EL31-QTR00 1150 3200
HLMP-EL31-SV000 HLMP-EL33-SV000 1900 5500
HLMP-EL31-SVK00 1900 5500
HLMP-EL31-SVR00 HLMP-EL33-SVR00 1900 5500
HLMP-EL31-STR00 1900 3200
HLMP-EL31-SUK00 1900 4200
HLMP-EL31-SUS00 1900 4200
HLMP-EL31-SUR00 1900 4200
HLMP-EL31-SVK00 1900 5500
HLMP-EL31-SVS00 1900 5500
Red-Orange 617 HLMP-EH31-QT000 1150 3200
HLMP-EH33-RU000 1500 4200
HLMP-EH31-SV000 HLMP-EH33-SV000 1900 5500
Red 630 HLMP-ED31-Q0000 HLMP-ED33-Q0000 1150
HLMP-ED31-QTT00 1150 3200
HLMP-ED31-ST000 1900 3200
HLMP-ED31-SUT00 1900 4200
HLMP-ED31-RU000 1500 4200
HLMP-ED31-RUT00 HLMP-ED33-RUT00 1500 4200
HLMP-ED31-SV000 HLMP-ED33-SV000 1900 5500
HLMP-ED31-SVT00 HLMP-ED33-SVT00 1900 5500
Notes:
1. Dominant Wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the lamp.
2. q1/2 is the off-axis angle where the luminous intensity is one half the on-axis intensity.
3. The luminous intensity is measured on the mechanical axis of the lamp package.
4. The optical axis is closely aligned with the package mechanical axis.
5. Tolerance for each intensity bin limit is ± 15%.
xxx L
5
HLMP- x x xx - x x x xx
Mechanical Options
00: Bulk Packaging
DD: Ammo Pack
YY: Flexi-Bin, Bulk Packaging
ZZ: Flexi-Bin; Ammo Pack
Color Bin & VF Selections
0: No color bin limitation
4: Amber color bin 4 only
K: Amber color bins 2 and 4 only
L: Color bins 4 and 6
R: Amber color bins 1, 2, 4, and 6 with VF max of 2.6 V
S: Amber color bins 2 and 4 with VF max of 2.6 V
T: Red color with VF max of 2.6 V
U: Amber color bin 4 with VF max of 2.6 V
W: Color bins 2, 4 and 6 with VF max of 2.6 V
Y: Color bins 4 and 6 with VF max of 2.6 V
Maximum Intensity Bin
0: No Iv bin limitation
Minimum Intensity Bin
Viewing Angle and Lead Standoffs
16: 15 degree without lead standoffs
18: 15 degree with lead standoffs
25: 23 degree without lead standoffs
27: 23 degree with lead standoffs
31: 30 degree without lead standoffs
33: 30 degree with lead standoffs
Color
D: 630 nm Red
H: 617 nm Red-Orange
L: 592 nm Amber
Package
E: 5 mm Round
Part Numbering System
Note: Please refer to AB 5337 for complete information on part numbering system.
6
Absolute Maximum Ratings at TA = 25°C
DC Forward Current[1,2,3] ..................................................................................... 50 mA
Peak Pulsed Forward Current[2,3] .......................................................................100 mA
Average Forward Current ...................................................................................... 30 mA
Reverse Voltage (IR = 100 µA) ........................................................................................5 V
LED Junction Temperature ....................................................................................... 130°C
Operating Temperature .........................................................................-40°C to +100°C
Storage Temperature ..............................................................................-40°C to +100°C
Notes:
1. Derate linearly as shown in Figure 4.
2. For long term performance with minimal light output degradation, drive currents between
10 mA and 30 mA are recommended. For more information on recommended drive condi-
tions, please refer to Application Brief I-024 (5966-3087E).
3. Please contact your sales representative about operating currents below 10 mA.
Package Dimensions
AB
2.35 (0.093)
MAX.
5.80 ± 0.20
(0.228 ± 0.008)
5.00 ± 0.20
(0.197 ± 0.008)
31.60
(1.244) MIN. 0.70 (0.028)
MAX.
1.00
(0.039) MIN.
2.54 ± 0.38
(0.100 ± 0.015)
0.50 ± 0.10
(0.020 ± 0.004) SQ. TYP.
CATHODE
LEAD
CATHODE
FLAT
8.71 ± 0.20
(0.343 ± 0.008
1.14 ± 0.20
(0.045 ± 0.008)
1.14 ± 0.20
(0.045 ± 0.008)
5.00 ± 0.20
(0.197 ± 0.008)
31.60
(1.244) MIN.
0.70 (0.028)
MAX.
1.00
(0.039) MIN.
8.71 ± 0.20
(0.343 ± 0.008)
0.50 ± 0.10
(0.020 ± 0.004) SQ. TYP.
CATHODE
LEAD
d
1.50 ± 0.15
(0.059 ± 0.006)
5.80 ± 0.20
(0.228 ± 0.008)
2.54 ± 0.38
(0.100 ± 0.015)
CATHODE
FLAT
PART NO. d
HLMP-EX18-xxxxx 12.60 ± 0.18
(0.496 ± 0.007)
HLMP-EX27-xxxxx 11.33 ± 0.25
(0.446 ± 0.010)
HLMP-EX33-xxxxx 11.99 ± 0.25
(0.472 ± 0.010)
//
7
Electrical/Optical Characteristics at TA = 25°C
Parameter Symbol Min. Typ. Max. Units Test Conditions
Forward Voltage IF = 20 mA
Amber (λd = 592 nm) 2.3
Red-Orange (λd = 617 nm) VF 2.35 2.6[1] V
Red (λd = 630 nm) 2.4
Reverse Voltage VR 5 20 V IR = 100 µA
Peak Wavelength Peak of Wavelength of
Amber 594 Spectral Distribution
Red-Orange λPEAK 623 nm at IF = 20 mA
Red 639
Spectral Halfwidth λ1/2 17 nm Wavelength Width at Spectral Distrib-
ution 1/2 Power Point at IF = 20 mA
Speed of Response ts 20 ns Exponential Time
Constant, e-t/ts
Capacitance C 40 pF VF = 0, f = 1 MHz
Thermal Resistance RQJ-PIN 240 °C/W LED Junction-to-Cathode Lead
Luminous Efficacy[2] Emitted Luminous
Amber 500 Power/Emitted Radiant Power
Red-Orange hv 235 lm/W at If = 20 mA
Red 155
Luminous Flux jV 1000 mlm IF = 20 mA
Luminous Efficiency [3] he Emitted
Amber 22 Luminous Flux/
Red-Orange 22 lm/W Electrical Power
Red 21
Notes:
1. For options -xxRxx, -xxSxx, -xxTxx, -xxUxx, -xxWxx, -xxYxx, max forward voltage (Vf) is 2.6 V. Refer to Vf bin table.
2. The radiant intensity, Ie, in watts per steradian, may be found from the equation Ie = Iv/hv, where Iv is the luminous intensity in candelas and hv
is the luminous efficacy in lumens/watt.
3. he = jV / IF x VF, where jV is the emitted luminous flux, IF is electrical forward current and VF is the forward voltage.
Figure 1. Relative Intensity vs. Peak Wavelength. Figure 2a. Forward Current vs. Forward Voltage for
Option -xxRxx, -xxSxx, -xxTxx, -xxUxx, -xxWxx and
-xxYxx.
WAVELENGTH – nm
RELATIVE INTENSITY
550 600 650 700
1.0
0.5
0
AMBER RED-ORANGE
RED
k J \ /
8
Figure 6. Representative Spatial Radiation Pattern for 23° Viewing Angle Lamps.
Figure 3. Relative Luminous Intensity vs. Forward
Current.
Figure 4. Maximum Forward Current vs. Ambient Tem-
perature. Derating Based on TJMAX = 130°C.
Figure 5. Representative Spatial Radiation Pattern for 15° Viewing Angle Lamps.
Figure 2b. Forward Current vs. Forward Voltage.
CURRENT – mA
1.0
0
VF – FORWARD VOLTAGE – V
2.5
100
40
30
1.5 2.0
60
3.0
10
20
50
RED
70
80
90
AMBER
RELATIVE INTENSITY
(NORMALIZED AT 20 mA)
0
0
FORWARD CURRENT – mA
40
2.0
1.5
1.0
0.5
20 50
2.5
10 30
AMBER
RED & RED-ORANGE
IF MAX. – MAXIMUM FORWARD CURRENT – mA
0
0
TA – AMBIENT TEMPERATURE – C
40 80
50
45
35
25
15
5
55
40
30
20
10
20 60 100 120
1.0
0.8
0.6
0.4
0.2
-100 -50 0 50 100
0
ANGULAR DISPLACEMENT – DEGREES
NORMALIZED INTENSITY – %
1.0
0.8
0.6
0.4
0.2
-100 -50 0 50 100
0
ANGULAR DISPLACEMENT – DEGREES
NORMALIZED INTENSITY – %
9
Bin Name Min. Max.
1 584.5 587.0
2 587.0 589.5
4 589.5 592.0
6 592.0 594.5
Bin Name Min. Max.
P 880 1150
Q 1150 1500
R 1500 1900
S 1900 2500
T 2500 3200
U 3200 4200
V 4200 5500
W 5500 7200
X 7200 9300
Y 9300 12000
Z 12000 16000
Intensity Bin Limits
(mcd at 20 mA)
Tolerance for each bin limit is ±15%.
Amber Color Bin Limits
(nm at 20 mA)
Tolerance for each bin limit is ±0.5 nm.
Notes:
1. Bin categories are established for classifi-
cation of products. Products may not be
available in all bin categories.
Figure 7. Representative Spatial Radiation Pattern for 30° Viewing Angle Lamps.
Bin Name Min. Max.
VA 2.0 2.2
VB 2.2 2.4
VC 2.4 2.6
Vf Bin Table[2]
Tolerance for each bin limit is ±0.05 V.
2. Vf Bin table only available for those part
number with options -xxRxx, -xxSxx, -xx-
Txx, -xxUxx, -xxWxx, -xxYxx.
Figure 8. Relative light output vs. junction temperature
0.1
RELATIVE LOP
(NORMALIZED AT 25 C)
JUNCTION TEMPERATURE – C
-50
10
1
-25 0 25 50 75 150100 125
RED
RED-ORANGE
AMBER
1.0
0.8
0.6
0.4
0.2
-100 -50 0 50 100
0
ANGULAR DISPLACEMENT – DEGREES
NORMALIZED INTENSITY – %
10
Precautions:
Lead Forming:
The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms
a mechanical ground which prevents mechanical
stress due to lead cutting from traveling into LED
package. This is highly recommended for hand solder
operation, as the excess lead length also acts as small
heat sink.
Soldering and Handling:
Care must be taken during PCB assembly and soldering
process to prevent damage to the LED component.
LED component may be effectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The
closest manual soldering distance of the soldering
heat source (soldering irons tip) to the body is
1.59mm. Soldering the LED using soldering iron tip
closer than 1.59mm might damage the LED.
Note:
1. PCB with different size and design (component density) will have
different heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to re-calibrate the soldering
profile again before loading a new type of PCB.
2. Avago Technologies’ high brightness LED are using high efficiency
LED die with single wire bond as shown below. Customer is advised
to take extra precaution during wave soldering to ensure that the
maximum wave temperature does not exceed 250°C and the solder
contact time does not exceeding 3sec. Over-stressing the LED
during soldering process might cause premature failure to the LED
due to delamination.
Avago Technologies LED configuration
1.59mm
ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
Recommended soldering condition:
Wave
Soldering [1, 2]
Manual Solder
Dipping
Pre-heat temperature 105 °C Max. -
Preheat time 60 sec Max -
Peak temperature 250 °C Max. 260 °C Max.
Dwell time 3 sec Max. 5 sec Max
Note:
1. Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2. It is recommended to use only bottom preheaters in order to reduce
thermal stress experienced by LED.
Wave soldering parameters must be set and
maintained according to the recommended
temperature and dwell time. Customer is advised
to perform daily check on the soldering profile to
ensure that it is always conforming to recommended
soldering conditions.
Note: Electrical connection between bottom surface of LED die and
the lead frame is achieved through conductive paste.
Any alignment fixture that is being applied during
wave soldering should be loosely fitted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during
wave soldering process.
At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to
cool down to room temperature prior to handling,
which includes removal of alignment fixture or pallet.
If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using reflow soldering prior to insertion the TH LED.
Recommended PC board plated through holes (PTH)
size for LED component leads.
LED component
lead size Diagonal
Plated through
hole diameter
0.45 x 0.45 mm
(0.018x 0.018 inch)
0.636 mm
(0.025 inch)
0.98 to 1.08 mm
(0.039 to 0.043 inch)
0.50 x 0.50 mm
(0.020x 0.020 inch)
0.707 mm
(0.028 inch)
1.05 to 1.15 mm
(0.041 to 0.045 inch)
Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause difficulty inserting the TH LED.
AllnGaP Device
CATHODE
11
Ammo Pack Drawing
Example of Wave Soldering Temperature Profile for TH LED
Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps.
030 100
250
200
150
100
50
TIME (MINUTES)
PREHEAT
TURBULENT WAVE LAMINAR WAVE
HOT AIR KNIFE
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak
temperature = 250°C)
Dwell time: 1.5 sec - 3.0 sec
(maximum = 3sec)
Note: Allow for board to be
sufficiently cooled to room
temperature before exerting
mechanical force.
TEMPERATURE (°C)
20
10 40 50 70 90
80
60
18.00 ± 0.50
(0.7087 ± 0.0197)
6.35 ± 1.30
(0.25 ± 0.0512)
12.70 ± 1.00
(0.50 ± 0.0394)
9.125 ± 0.625
(0.3593 ± 0.0246)
12.70 ± 0.30
(0.50 ± 0.0118)
CATHODE
0.70 ± 0.20
(0.0276 ± 0.0079)
20.50 ± 1.00
(0.807 ± 0.039)
A A
VIEW A–A
4.00 ± 0.20
(0.1575 ± 0.008) TYP.
ALL DIMENSIONS IN MILLIMETERS (INCHES).
NOTE: THE AMMO-PACKS DRAWING IS APPLICABLE FOR PACKAGING OPTION -DD & -ZZ AND REGARDLESS OF STANDOFF OR NON-STANDOFF.
Patks 514999 (1F)1lem PartNumber |)IH)||)|)|||||)||||)||||||||||||||||)||||| (1T) L01: L01 Number (0) QTY: Qu |||||)||)||||)|||||||||)IHI||)||||)|||||)|I|||||||| |)||||||||||)| LPN CATzlm |||||)||)||||)|||||)|||)IHIII) |)|)||||| ()9D MFG Dale: Manufacmring |||||)||)||||)|||||||||)|)||||)||||| (P Cus1 IIIHHI) ()V Ven (90) Date Code: Dale Cod |||||)||| |)|)|||||||||)|H||)|)|)IHIIIIIIIH Dep 11D: Made1n:Coun1ry n Orig in
12
Packaging Box for Ammo Packs
FROM LEFT SIDE OF BOX,
ADHESIVE TAPE MUST BE
FACING UPWARD.
AVAGO
TECHNOLOGIES
ANODE
MOTHERLABEL
CATHODE
C
A
+
ANODE LEAD LEAVES
THE BOX FIRST.
NOTE: THE DIMENSION FOR AMMO PACK IS APPLICABLE FOR THE DEVICE WITH STANDOFF AND WITHOUT STANDOFF.
LABEL ON
THIS SIDE
OF BOX.
Packaging Label:
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
(1P) Item: Part Number
(1T) Lot: Lot Number
LPN:
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID:
DeptID: Made In: Country of Origin
(Q) QTY: Quantity
CAT: Intensity Bin
BIN: Refer to below information
(9D) Date Code: Date Code
STANDARD LABEL LS0002
RoHS Compliant
e3 max temp 250C
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
C/O: Country of Origin
Customer P/N:
Supplier Code:
QUANTITY: Packing Quantity
CAT: Intensity Bin
BIN: Refer to below information
DATECODE: Date Code
RoHS Compliant
e3 max tem
p
250C
Lam
p
s Bab
y
Label
AVEIGO lltunoluaus P V D ()1P PART#: Part Number lumnmmmmmnmmmmmm (1T) )L:OT# Lot Number (QDWFG DATE: QUANTITY HHHHHHHHHI HHHHHHH Cust CAT III” III” Supp BIN: I II” I II“ DATECODE: Da HIHIIIIIIIIIHHI ZVB Ava G O YECHNDLDGIES
For product information and a complete list of distributors, please go to our website: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2009 Avago Technologies. All rights reserved. Obsoletes AVO1-0701EN
AV02-342EN - January 15, 2009
DISCLAIMER: AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE
AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLE-
AR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO
MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
(1P) Item: Part Number
(1T) Lot: Lot Number
LPN:
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
(V) Vendor ID:
DeptID: Made In: Country of Origin
(Q) QTY: Quantity
CAT: Intensity Bin
BIN: Refer to below information
(9D) Date Code: Date Code
STANDARD LABEL LS0002
RoHS Compliant
e3 max temp 250C
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
C/O: Country of Origin
Customer P/N:
Supplier Code:
QUANTITY: Packing Quantity
CAT: Intensity Bin
BIN: Refer to below information
DATECODE: Date Code
RoHS Compliant
e3 max tem
p
250C
Lam
p
s Bab
y
Label
(ii) Avago Baby Label (Only available on bulk packaging)
Acronyms and Definition:
BIN:
(i) Color bin only or VF bin only
(Applicable for part number with color bins but
without VF bin OR part number with VF bins and
no color bin)
OR
(ii) Color bin incorporated with VF Bin
(Applicable for part number that have both color
bin and VF bin)
Example:
(i) Color bin only or VF bin only
BIN: 2 (represent color bin 2 only)
BIN: VB (represent VF bin “VB only)
(ii) Color bin incorporate with VF Bin
BIN: 2VB
VB: VF bin “VB
2: Color bin 2 only

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