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ERB-RD,RE,RG Series Datasheet

Panasonic Electronic Components

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Datasheet

Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Micro Chip Fuse
E
1
Product Code
Micro Chip Fuse
Structure
Rectangular type
Product shape
1206 inch size
(3.2 mm×1.6 mm)
Packaging Part No.
Code
Punched Carrier Taping
4 mm pitch, 5,000 pcs.
R
2
B
3
R
4
D
5
1
6 7
R
8
0
9
0
10
X
V
R
G
0603 inch size
(1.6 mm×0.8 mm)
E
0402 inch size
(1.0 mm×0.5 mm)
DPressed Carrier Taping
2 mm pitch, 10,000 pcs. ERBRD
ERBRE
ERBRG
X
0R25
0R31
0R37
0R50
0R63
0R75
1R00
1R25
0.25 A
0.315 A
0.375 A
0.50 A
0.63 A
0.75 A
1.0 A
1.25 A
1R40
1R50
2R00
2R50
3R00
3R15
4R00
5R00
1.4 A
1.5 A
2.0 A
2.5 A
3.0 A
3.15 A
4.0 A
5.0 A
Rated Current (A)
Almina Substrate
Fusing Element Electrode
(Outer)
Protective Coating Electrode (Base)
a
b
t
W
L
Micro Chip Fuse
Type: ERBRD
ERBRE
ERBRG
Explanation of Part Numbers
Features
Approved Safety Standards
Small size
Fast-acting and withstanding in-rush current characteristics
RoHS compliant
UL248-14 : File No.E194052
c-UL C22.2 No.248-14 : File No.E194052
Part No.
(inch size)
Dimensions (mm) Mass
(Weight)
(g/1000 pcs.)
LWa b t
ERBRD
(0402) 1.00±0.10 0.50+0.10 0.15±0.10 0.25±0.10 0.39
±0.10 0.7
ERBRE
(0603) 1.60±0.15 0.80+0.15 0.24±0.15 0.30±0.15 0.54
±0.10 2.2
ERBRG
(1206) 3.20±0.20 1.60±0.15 0.30±0.20 0.55±0.20 0.65±0.10 10
–0.05
–0.05
Construction Dimensions in mm (not to scale)
Jan. 201906
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Micro Chip Fuse
0603 inch / 1608 mm size : Type ERBRE
Part No. ERBRER□□V
0R50 0R75 1R00 1R25 1R40 1R50 2R00 2R50 3R00 3R15 4R00 5R00
Rated Current (A) 0.5 0.75 1.0 1.25 1.4 1.5 2.0 2.5 3.0 3.15 4.0 5.0
Marking Code F G H J 14 K N O P 31 S T
Internal R (mΩ) at 25 °C max.
330 190 125 94 85 72 51 40 33 32 22 19
Fusing Current/Fusing Time
(at 25 °C)
Rated Current ×100 % / 4 hours min.
Rated Current ×200 % / 5 seconds max.
Rated Current ×300 % / 0.2 seconds max.
Rated Voltage
(Open Circuit Voltage)
(V) DC
32
Interrupting Rating
at Rated Voltage (A) 50
Category Temp. Range
(°C) −40 to +125
0402 inch /1005 mm size : Type ERBRD
Part No. ERBRDR□□X
0R25 0R31 0R37 0R50 0R63 0R75 1R00 1R25 1R50 2R00 2R50 3R00 4R00 5R00
Rated Current (A) 0.25 0.315 0.375 0.5 0.63 0.75 1.0 1.25 1.5 2.0 2.5 3.0 4.0 5.0
Marking Code V X Y F 6 G H J K N O P S T
Internal R (mΩ) at 25 °C max.
700 520 440 310 220 190 125 82 70 53 42 37 24 19.5
Fusing Current/Fusing Time
(at 25 °C)
Rated Current ×100 % / 4 hours min.
Rated Current ×200 % / 5 seconds max.
Rated Current ×300 % / 0.2 seconds max.
Rated Voltage
(Open Circuit Voltage)
(V) DC
32
Interrupting Rating
at Rated Voltage (A) 35
Category Temp. Range
(°C) −40 to +125
Part No. ERBRGR□□V
0R50 0R75 1R00 1R25 1R50 2R00 2R50 3R00 4R00
Rated Current (A) 0.5 0.75 1.0 1.25 1.5 2.0 2.5 3.0 4.0
Marking Code F G H J K N O P S
Internal R (mΩ) at 25 °C max.
560 340 210 175 115 85 65 45 35
Fusing Current/Fusing Time
(at 25 °C)
Rated Current ×100 % / 4 hours min.
Rated Current ×200 % / 5 seconds max.
Rated Current ×300 % / 0.2 seconds max.
Rated Voltage
(Open Circuit Voltage)
(V) DC
63 32
Interrupting Rating
at Rated Voltage (A) 50
Category Temp. Range
(°C) −40 to +125
1206 inch / 3216 mm size : Type ERBRG
The thin type is available about 1005 (0402 inch) size. Please contact us for details.
Please contact us when another rated current is needed.
Ratings
Jan. 201906
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Micro Chip Fuse
100
Fusing Time (s)
0.0001
0.001
0.01
0.1
1
10
0.1 1 10 100
Fusing Time (s)
0.0001
0.001
0.01
0.1
10
1
0.1 1 10
Fusing Current (A) Fusing Current (A)
0603 inch / 1608 mm size
(Type ERBRE)
0402 inch / 1005 mm size
(Type ERBRD)
0.5 A
0.25 A
0.315 A
0.375 A
0.75 A
0.63 A
1.0 A
1.25 A
1.5 A
2.0 A
2.5 A
3.0 A
4.0 A
5.0 A
100
Fusing Time (s)
0.0001
0.001
0.01
0.1
1
10
0.1 1 10
Fusing Current (A)
1206 inch /3216 mm size
(Type ERBRG)
0.5 A
0.75 A
1.0 A
1.25 A
1.5 A
2.0 A
2.5 A
3.0 A
4.0 A
0.5 A
0.75 A
1.0 A
1.25 A
1.4 A
1.5 A
2.0 A
2.5 A
3.0 A
3.15 A
4.0 A
5.0 A
Reference Only
Reference Only
Reference Only
C
A
B
Fusing Characteristics (25 °C typical)
Part No.
(inch size)
Dimensions (mm)
ABC
ERBRD(0402) 0.5 to 0.6 1.4 to 1.6 0.4 to 0.6
ERBRE(0603) 0.7 to 0.9 2.0 to 2.2 0.8 to 1.0
ERBRG(1206) 2.0 to 2.4 4.4 to 5.0 1.2 to 1.8
Recommended Soldering Conditions
Test Item Performance
Requirements Test Conditions
Resistance Within Specifi ed
Tolerance 25 °C
Resistance to Soldering Heat ±10 % 260 °C±5 °C, 10 s
Rapid Change of Temperature ±10 % –40 °C (30 min.) / +125 °C (30 min.), 5 cycles
Damp Heat, Steady State ±10 % 60 °C, 90 % to 95 %RH, 1000 h (no load)
Load Life in Humidity ±10 % 60 °C, 90 % to 95 %RH, Load: 70 % rated current, 1000 h
Endurance at 70 °C ±10 % 70 °C , Load: 70 % rated current, 1000 h
Perfomance
Jan. 201906
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Micro Chip Fuse
TT
A
P0
P2
P1
P1
fD0
B
F
W
E
(2 mm pitch)
Pressed
Carrier
Punched
Carrier
fN
W2
W1
fA
fC
Preheating
Peak
Heating
Temperature
Time
Carrier Taping Taping Reel
Part No. A B W F E
ERBRD 0.68±0.10 1.20±0.10
8.00±0.20 3.50±0.05 1.75±0.10
ERBRE 1.10±0.10 1.90±0.10
ERBRG 2.00±0.15 3.60±0.20
Part No. inch size Kind of Taping Pitch (P1) Quantity
ERBRD 0402 Pressed Carrier Taping 2 mm 10,000 pcs./ reel
ERBRE 0603 Punched Carrier Taping 4 mm 5,000 pcs./ reel
ERBRG 1206
(Unit : mm) (Unit : mm)
Part No. 0A0N0CW
1W2
ERBRD
ERBRE
ERBRG
180.0–1.5 60 0 13.0±0.2 9.0 0 11.4±1.0
0+1.0 +1.0
Part No. P1P2P00D0T
ERBRD 2.00±0.10
2.00±0.05 4.00±0.10 1.50+0.10
0.67±0.07
ERBRE 4.00±0.10 0.78±0.07
ERBRG 0.84±0.07
0
Standard Quantity
Packaging Methods
<Repair with hand soldering>
Preheat with a blast of hot air or similar method. Use a soldering iron with a tip temperature of 350 °C or less.
Solder each electrode for 3 seconds or less.
Never touch this product with the tip of a soldering iron.
Recommended soldering conditions for reflow
Recommended soldering conditions for fl ow
· Reflow soldering shall be performed a maximum of
two times.
· Please contact us for additional information when
used in conditions other than those specified.
· Please measure the temperature of the terminals
and study every kind of solder and printed circuit
board for solderability be fore ac tu al use.
Recommended Soldering Conditions
Recommendations and precautions are described below.
Temperature Time
Preheating 140 °C to 160 °C 60 s to 120 s
Main heating Above 200 °C 30 s to 40 s
Peak 235 ± 5 °C max. 10 s
Temperature Time
Preheating 150 °C to 180 °C 60 s to 120 s
Main heating Above 230 °C 30 s to 40 s
Peak max. 260 °C max. 10 s
For soldering (Example : Sn/Pb)
For lead-free soldering (Example : Sn/Ag/Cu)
For soldering For lead-free soldering
Temperature Time Temperature Time
Preheating 140 °C to 180 °C 60 s to 120 s 150 °C to 180 °C 60 s to 120 s
Soldering 245 ± 5 °C 20 s to 30 s max. 260 °C max. 10 s
Jan. 201906
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Micro Chip Fuse
The following are precautions for individual products. Please also refer to the common precautions for fuses in this
catalog.
1. Set the rated current so that the current passing through the Micro Chip Fuses (hereafter called the fuses) under
normal conditions is within 70% of the rated current.
2. Do not continuously pass a current exceeding the rated current through the fuses.
3. If a pulse exceeding the rated current is applied, such as a rush current or surge current at power-on, take care
not to cause unwanted fusing. Calculate the I2t value of the pulse and check the tolerance to the number of
pulses according to the I2t-t characteristic curve before deciding to use the fuses. Before checking the tolerance,
consult our sales staff in advance.
4. The fuses are designed to be blown out by a current that is double or greater than the rated current. Ensure that
the abnormal current generated when a circuit abnormality occurs in your product is at least double or greater
than the rated current of the fuses. In addition, ensure that the abnormal cur rent of your product does not exceed
the maximum interrupting current of the fuses.
5. The fuses are designed to be used on the secondary side of a power supply. Do not use them on the primary
side.
6. Ensure that the voltage applied to the fuses are within their rated voltage.
7. The fusing characteristics of the fuses are affected by the ambient temperature. Before use, mount the fuses
on your products and carefully check and evaluate their category temperature range.
Safety Precautions
Jan. 201906
Safety Precautions (Common precautions for Fuses)
When using our products, no matter what sort of equipment they might be used for, be sure to make a written
agreement on the specifications with us in advance. The design and specifications in this catalog are subject
to change without prior notice.
Do not use the products beyond the specifications described in this catalog.
This catalog explains the quality and performance of the products as individual components. Before use, check
and evaluate its operations when installed in your products.
Install the following systems for a failsafe design to ensure safety if these products are to be used in equip ment
where a defect in these products may cause the loss of human life or other significant dam age, such as damage to
vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating
appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment.
Systems equipped with a protection circuit and a protection device
Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a sin gle fault
(1) Precautions for use
These products are designed and manufactured for general and standard use in general elec tron ic equipment
(e.g. AV equipment, home electric appliances, office equipment, information and communication equipment)
These products are not intended for use in the following special conditions. Before using the products,
carefully check the effects on their quality and performance, and determine whether or not they can be used.
1. In liquid, such as water, oil, chemicals, or organic solvent
2. In direct sunlight, outdoors, or in severe dust condition
3. In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
4. Electric Static Discharge (ESD) Environment
These components are sensitive to static electricity and can be damaged under static shock (ESD).
Please take measures to avoid any of these environments.
Smaller components are more sensitive to ESD environment.
5. Electromagnetic Environment
Avoid any environment where strong electromagnetic waves exist.
6. In an environment where these products cause dew condensation
7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with
resin or other materials
These products generate Joule heat when energized. Carefully position these products so that their heat will
not affect the other components (except Thermal Cutoffs).
• Carefully position these products so that their temperatures will not exceed the category temperature range due
to the effects of neighboring heat-generating components. Do not mount or place heat-generating components
or inflammables, such as vinyl-coated wires, near these products (except Thermal Cutoffs).
Note that non-cleaning solder, halogen-based highly active flux, or water-soluble flux may deteriorate the
performance or reliability of the products.
• Carefully select a flux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance
or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water
residues. Otherwise, the insulation performance may be deteriorated.
(2) Precautions for storage
The performance of these products, including the solderability, is guaranteed for a year from the date of ar riv al
at your company, provided that they remain packed as they were when delivered and stored at a tem per a ture
of 5 °C to 35 °C and a relative humidity of 45 % to 85 %.
The performance of Thermal Cutoffs is guaranteed for a year after our delivery, provided that they are stored at a
temperature of -10 °C to +40 °C and a relative humidity of 30 % to 75 %.
Even within the above guarantee periods, do not store these products in the following conditions. Otherwise,
their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping
materials) may be deformed or deteriorated, resulting in mounting failures.
1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
2. In direct sunlight
<Package markings>
Package markings include the product number, quantity, and country of origin.
In principle, the country of origin should be indicated in English.
May. 201500
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