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CX3225SB Series Datasheet

Kyocera International Inc. Electronic Components

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Datasheet

KYOCERA Crystal Device Corporation
KBS-5079G
Specifications
Drawing No.
UKY1C-H1-16357-00[43] 1/12
Issued Date.
Apr,13,2016
TO: KED USA
NoteIn case of specification change, KYOCERA Part Number also will be changed.
Product Name Quartz Crystal
Product Model CX3225SB
Frequency
Refer to UKY1C-H1-16357-00[43] 3/12 Nominal Frequency
Customer Part Number -
Customer Specification Number -
KYOCERA Part Number
Refer to UKY1C-H1-16357-00[43] 3/12 Nominal Frequency
Remarks Pb-FreeRoHS CompliantMSL 1
Customer Acceptance
Accept Signature Approved Date
Department
Person in charge
Seller
Manufacturer
KYOCERA Crystal Device Corporation
(Sales Division)
Crystal Units Division
6 Takeda Tobadono-cho, Fushimi-ku, Kyoto
5850, Higashine-Koh, Higashine-Shi, Yamagata
612-8501 Japan
999-3701 Japan
TEL. No. 075-604-3500
FAX. No. 075-604-3501
TEL. No. 0237-43-5611
FAX. No. 0237-43-5615
Design Department
Quality Assurance
Approved by Checked by Issued by
KYOCERA Crystal Device Corporation
Crystal Units Engineering Section
Crystal Units Division
T. Noritake
H. Shoji
T. Nitoube
Y. Kikuchi
Drawing No.
UKY1C-H1-16357-00[43]
2/12
KYOCERA Crystal Device Corporation
KBS-5079G
Revision History
Rev.No.
Description of revise
Date Approved by Checked by Issued by
1 First Edition Apr,13,2016 H. Shoji T. Nitoube Y. Kikuchi
Drawing No.
UKY1C-H1-16357-00[43]
3/12
KYOCERA Crystal Device Corporation
KBS-5079G
[
PART NUMBER LIST
]
Nominal Frequency
(MHz) KYOCERA Part Number ESR
()
Nominal
Frequency
Code
12.000 CX3225SB12000H0FLJCC 150 12000
12.288 CX3225SB12288H0FLJCC 150 12288
13.560 CX3225SB13560H0FLJCC 80 13560
16.000 CX3225SB16000H0FLJCC 80 16000
19.200 CX3225SB19200H0FLJCC 80 19200
20.000 CX3225SB20000H0FLJCC 50 20000
24.000 CX3225SB24000H0FLJCC 50 24000
24.576 CX3225SB24576H0FLJCC 50 24576
25.000 CX3225SB25000H0FLJCC 50 25000
26.000 CX3225SB26000H0FLJCC 50 26000
27.000 CX3225SB27000H0FLJCC 50 27000
30.000 CX3225SB30000H0FLJCC 50 30000
32.000 CX3225SB32000H0FLJCC 50 32000
38.400 CX3225SB38400H0FLJCC 50 38400
40.000 CX3225SB40000H0FLJCC 50 40000
48.000 CX3225SB48000H0FLJCC 50 48000
49.152 CX3225SB49152H0FLJCC 50 49152
54.000 CX3225SB54000H0FLJCC 50 54000
Drawing No.
UKY1C-H1-16357-00[43]
4/12
KYOCERA Crystal Device Corporation
KBS-5079G
1. APPLICATION
This specification sheet is applied to quartz crystal CX3225SB
2. KYOCERA PART NUMBER
Refer to UKY1C-H1-16357-00[43] 3/12 KYOCERA Part Number
3. RATINGS
Items SYMB. Rating Unit Remarks
Operating Temperature Topr -30 to +85
°C
Storage Temperature range Tstg -40 to +85
°C
4. CHARACTERISTICS
ELECTRICAL CHARACTERISTICS
Items Electrical Specification Test Condition Remarks
SYMB.
Min Typ. Max Unit
Mode of Vibration Fundamental
Nominal Frequency
F0 1 MHz
Nominal
Temperature TNOM +25 °C
Load Capacitance
CL 12.0 pF
Frequency
Tolerance
df/F -10.0 +10.0
PPM
+25±3°C
Frequency
Temperature
characteristics
df/F -15.0 +15.0 -30 to +85°C
Frequency Aging
Rate -1.0 +1.0 1
st
year +25±3°C
Equivalent Series
Resistance ESR 2
Drive Level Pd 0.01 100 µW
Insulation
Resistance IR 500 M 100V(DC)
1 Refer to UKY1C-H1-16356-00[43] 3/12 Nominal Frequency
2 Refer to UKY1C-H1-16356-00[43] 3/12 ESR
Drawing No.
UKY1C-H1-16357-00[43]
5/12
KYOCERA Crystal Device Corporation
KBS-5079G
5. Measurement Condition
5.1 Frequency measurement
Measuring instrument : IEC PI-Network Test Fixture
Load Capacitance : 12.0pF
Drive Level : 10µW
5.2 Equivalent series resistance (ESR) measurement
Measuring instrument : IEC PI-Network Test Fixture
Load Capacitance : Series
Drive Level : 10µW
Drawing No.
UKY1C-H1-16357-00[43]
6/12
KYOCERA Crystal Device Corporation
KBS-5079G
6. APPEARANCES, PHYSICAL DIMENSION
OUTLINE DIMENSION (not to scale)
MARKING
1 Nominal Frequency Move the number of maximum indication beams of the
frequency to five digitsand omit less than kHz
2 Identification [K] mark is surely 1Pin direction.
3 Date Code YearLAST 1 DIGIT of YEAR AND WEEK
(Ex)Jan, 01, 2016 601
4 Manufacturing Location YJapan(Yamagata)
ZJapan(Shiga Yohkaichi)
TThailand
3 Refer to UKY1C-H1-16357-00[43] 3/12 Nominal Frequency Code
The font of marking is reference.
PIN
NO. PIN Layout
#1 HOT
#2 GND
#3 HOT
#4 GND
UNIT mm
0.55±0.05
3
2.50±0.10
3.20±0.10
1
4
R0.
20
41.0±0.1
80.10±0.1
4
0.
75
±0.1
C 0.30
0.
20
±0.0
4
2
3
K601Y
4
#1
#3
#4
#2
#3 HOT
#2 GND #1 HOT
#4 GND
TOP VIEW
(Connection)
#1
#4 #3
#2
(Top View)
(Side View)
(Bottom View)
Drawing No.
UKY1C-H1-16357-00[43]
7/12
KYOCERA Crystal Device Corporation
KBS-5079G
7. RECOMMENDED LAND PATTERN (not to scale)
UNIT mm
1.05
1.05
0.8
1.3
1.0
2.3
1.85
1.3
Drawing No.
UKY1C-H1-16357-00[43]
8/12
KYOCERA Crystal Device Corporation
KBS-5079G
8.TAPING & REEL
8-1.Dimensions
8-2.Leader and trailer tape
8-3.Direction
The direction shall be seen from the top cover tape side
8-4.Specification
1. Material of the carrier tape is either polystyrene or APET (ESD).
2. Material of the cover tape is polyester (ESD).
3. The seal tape shall not cover the sprocket holes and not protrude from the carrier tape.
4. Tensile strength of carrier tape: 10N or more.
5. The R of the corner of each cavity is 0.2RMAX.
6. The alignment between centers of the cavity and sprocket hole shall be 0.05mm or less.
7. The orientation shall be checked from the top cover tape side as shown in 8-3.
8.
Peeling force of cover tape: 0.1 to 1.0N.
9. The component will fall out naturally when cover tape is removed and set upside down.
.
3.5±0.05
4.0±0.1
2.0±0.05
4.0±0.05
φ1.05±0.1 φ1.55±0.05
(3.7)
3.5±0.1
1.75±0.1
8.0±0.2
(3.0)
2.8±0.1
1.0±0.1
0.25±0.05
Unreeling direction
400560mm
END START
Leader
Empty compartment
Components
Empty compartment
100200mm
160mm
or more
Career tape
Unreeling direction
12345
K123Y
12345
K123Y
12345
K123Y
12345
K123Y
165°180°
Cover tap
Drawing No.
UKY1C-H1-16357-00[43]
9/12
KYOCERA Crystal Device Corporation
KBS-5079G
8-5.Reel Specification
I
m)
n the case of Φ180 Reel (3,000 pcs max, every 1,000 pcs)
Symbol A B C D
Dimension φ180 +0/-3 φ60 +1/-0 φ13±0.2 φ21±0.8
Symbol E W t
Dimension 2.0±0.5 9±1 2.0±0.5
(Unit : mm)
In the case of Φ330 Reel (10,000 pcs max, every 1,000 pcs)
Symbol A B C D
Dimension φ330±2.0 φ100±1.0 φ13±0.2 φ21±0.8
Symbol E W t
Dimension 2.0±0.5 9.5±0.5 2.2±0.1
(Unit : m
A
C
D
E
B
W
t
Drawing No.
UKY1C-H1-16357-00[43]
10/12
KYOCERA Crystal Device Corporation
KBS-5079G
9. Environmental requirements
After following test, frequency shall not change more than ±10×10-6
And CI,±20% or 5 of large value.
9.1 Resistance to Shock Test condition
Natural dropped from height 100cm onto hard wood
board in 3 times
9.2 Resistance to Vibration Test condition
frequency 10 - 55 - 10 Hz
Amplitude 1.5mm
Cycle time 15 minutes
Direction X,Y,Z (3direction),2 h each.
9.3 Resistance to Heat Test condition
The quartz crystal unit shall be stored at a
temperature of +85±2°C for 500 h.
Then it shall be subjected to standard atmospheric
conditions for 1 h ,after whichi measurement shall
be made.
9.4 Resistance to Cold Test condition
The quartz crystal unit shall be stored at a
temperature of -40±2°C for 500 h.
Then it shall be subjected to standard atmospheric
conditions for 1 h ,after whichi measurement shall
be made.
9.5 Thermal Shock Test condition
The quartz crystal unit shall be subjected to 500
succesive change of temperature cycles each as
shown in table belowThen it shall be subjected
to standard atmospheric conditions for 1hafter
which measurements shall be made.
Cycle -40±2°C30min.to +25±2°C5min.
to +85±2°C30min.to +25±2°C5min.
9
.6 Resistance to Moisture
9
.7 Soldering condition 1.
9.8
Intensity for bending in circuit board
.6 Resistance to Moisture
.7 Soldering condition 1.
Intensity for bending in circuit board
Solder this product in center of the circuit board of
and add the deflection of 3mm
.6 Resistance to Moisture
.7 Soldering condition 1.
2.
Intensity for bending in circuit board
Solder this product in center of the circuit board of
and add the deflection of 3mm
Test board : t
R5
45
KYOCERA Crystal Device Corporation
Test condition
The quartz crystal unit shall be stored at a
temperature of +60
90% to 95% for 240 h. Then it shall be subjected
to standard atmospheric conditions for 1h
which measurements shall b
Material of solder
Kind
Melting point
2.
Reflow temp.profile
Frequency shift :
3.
Hand Soldering
4.
Reflow Times
Reflow temp.profile
Intensity for bending in circuit board
Solder this product in center of the circuit board of
and add the deflection of 3mm
Test board : t
1.6
Preheating
PUSH
R5
Product
45
45
Drawing No.
KYOCERA Crystal Device Corporation
Test condition
The quartz crystal unit shall be stored at a
temperature of +60
±
90% to 95% for 240 h. Then it shall be subjected
to standard atmospheric conditions for 1h
which measurements shall b
Material of solder
Kind
lead free solder paste
Melting point
Reflow temp.profile
Frequency shift :
±
Hand Soldering
Reflow Times
Reflow temp.profile
Solder this product in center of the circuit board of
and add the deflection of 3mm
as the
bottom figure.
1.6
mm
Preheating
Peak
Total
board
1.6
Drawing No.
KYOCERA Crystal Device Corporation
The quartz crystal unit shall be stored at a
±
2°C
wich relative humidity of
90% to 95% for 240 h. Then it shall be subjected
to standard atmospheric conditions for 1h
which measurements shall b
e made
lead free solder paste
+220±5°C
±
2ppm
+350°C
3 sec MAX
2 times
Reflow temp.profile
Solder this product in center of the circuit board of
40
m
bottom figure.
Temp [
+150 to +180
+260
10
R230
press jig
UKY1C-
H1
KYOCERA Crystal Device Corporation
The quartz crystal unit shall be stored at a
wich relative humidity of
90% to 95% for 240 h. Then it shall be subjected
to standard atmospheric conditions for 1h
after
e made
lead free solder paste
3 sec MAX
m
m
×100
mm
Temp [
°C]
+150 to +180
+260
±5
20
R230
press jig
H1
-16357-
00[
wich relative humidity of
90% to 95% for 240 h. Then it shall be subjected
after
Time[sec]
150 (typ.)
1
0 (max.)
300 (max.)
UNIT : mm
00[
43]
11/12
KBS-
5079
Time[sec]
0 (max.)
300 (max.)
UNIT : mm
5079
G
Drawing No.
UKY1C-H1-16357-00[43]
12/12
KYOCERA Crystal Device Corporation
KBS-5079G
10. Cautions for use
1Soldering upon mounting
There is a possibility to influence product characteristics when Solder paste or conductive glue comes in
contact with product lid or surface.
2When using mounting machine
Please minimize the shock when using mounting machine to avoid any excess stress to the product.
3Conformity of a circuit
We strongly recommend to make sure that Negative resistance (Gain) of IC is designed to be 5 times the
ESR (Equivalent Series Resistance) of crystal unit.
11. Storage conditions
Please store product in below conditions, and use within 6 months.
Temperature +18 to +30°C, and Humidity of 20 to 70 % in the packaging condition.
12. Manufacturing location
Kyocera Crystal Device Corporation / Japan(Yamagata)
Kyocera Crystal Device Corporation Shiga Yohkaichi Plant / Japan(Shiga)
Kyocera Crystal Device (Thailand) Co., Ltd / Thailand(Lamphun)
13. Quality Assurance
To be guaranteed by Kyocera Crystal Device Quality Assurance Division
14. Quality guarantee
In case when Kyocera Crystal Device Corporation rooted failure occurred within 1year after its delivery,
substitute product will be arranged based on discussion. Quality guarantee of product after 1year of its delivery is
waivered.
15. Others
In case of any questions or opinions regarding the Specification, please have it in written manner
within 45 days after issued date.

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